Abstract: The present invention relates to a resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 ?m/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.

Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

Abstract: A resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 ?m/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.

Abstract: The present disclosure relates to a prepreg formed by drying a fabric substrate impregnated with a resin composition by means of heating until the resin composition is in a semi-cured state. The resin composition contains (A) at least one of an epoxy resin having naphthalene skeleton and a phenolic curing agent; and (B) a polymer having structures represented by the following formulae (I) and (II), no unsaturated bond between carbon atoms, an epoxy value ranging from 0.2 to 0.8 ep/kg, and an weight-average molecular weight ranging from 200,000 to 850,000: wherein X:Y=0:1 to 0.35:0.65, R1 represents H or CH3, and R2 represents H or an alkyl group.

Abstract: A prepreg includes a resin composition including: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic hardener having a naphthalene skeleton; (B) a polymer having at least the structures of formulae (2) and (3) among formulae (1), (2) and (3) and having a weight-average molecular weight of from 200,000 to 850,000 inclusive; and (C) an inorganic filler: wherein x:y:z (molar fraction)=0:0.95:0.05 to 0.2:0.6:0.2 (where x+y+z?1, 0?x?0.2, 0.6?y?0.95, 0.05?z?0.2); R1 represents a hydrogen atom or a methyl group and R2 includes at least one of a glycidyl group and an epoxidized alkyl group among a hydrogen atom, an alkyl group, a glycidyl group and an epoxidized alkyl group in formula (2); and R3 represents a hydrogen atom or a methyl group and R4 represents Ph (phenyl group), —COOCH2Ph or —COO(CH2)2Ph in formula (3).

Abstract: A metal-clad laminate of the present invention includes an insulating layer and a metal layer disposed on at least one surface of the insulating layer. The insulating layer is formed by laminating at least a center layer and surface resin layers disposed on both surfaces of the center layer. The center layer contains a heat-curable resin and includes a core layer containing at least one fibrous base material and a heat-curable resin layer that does not contain a fibrous base material. The ratio of the thickness of the surface resin layer to the thickness of the heat-curable resin layer is between 0.5 and 10.

Abstract: A metal-clad laminate of the present invention comprises an insulating layer, and a metal layer that is present at least on one surface side of the insulating layer. The insulating layer is a laminate of at least three layers: a center layer, a first resin layer that is present on one surface side of the center layer, and a second resin layer that is present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a respective resin composition. The elastic modulus of the cured product of the resin composition contained in the center layer is lower than the elastic moduli of both the cured product of the resin composition contained in the first resin layer and the cured product of the resin composition contained in the second resin layer.

Abstract: A poly(phenylene ether) resin composition includes a modified poly(phenylene ether) copolymer, a polymer substance having a weight-average molecular weight larger than that of the modified poly(phenylene ether) copolymer, and a compound compatible with the modified poly(phenylene ether) copolymer. The modified poly(phenylene ether) copolymer is produced by modifying the phenolic hydroxyl group in a molecular terminal of a poly(phenylene ether) copolymer with a compound having a carbon-carbon unsaturated double bond. The polymer substance has a structure of at least one selected from a polystyrene framework, a polybutadiene framework, and a methacrylate framework. The polymer substance has a softening temperature not higher than 110° C. The compound compatible with the modified poly(phenylene ether) copolymer includes two or more carbon-carbon unsaturated double-bonds per molecule, and has a melting point not higher than 30° C.

Abstract: A resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 ?m/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.

Abstract: A prepreg satisfies the following properties (A) and (B). (A) The resin flow of the prepreg measured under conditions of 170° C. and 30 kgf/cm2 according to IEC 60249-3-1, 1981, is 0% or more and 5% or less. (B) In a dynamic viscoelasticity test under conditions of a temperature of 30° C. or higher and 200° C. or lower, a temperature rising rate of 3° C./min, and a frequency of 0.5 Hz, a relation of 1?Vb/Va?15 is established, where Va is a minimum melt viscosity of the resin composition collected from the prepreg, and Vb is a melt viscosity of the collected resin composition at a temperature Tb, Tb=Ta+20° C., and Ta is a temperature when the melt viscosity is the minimum melt viscosity Va.

Abstract: A prepreg containing: a resin composition; and a woven fabric base material. The resin composition contains: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic curing agent having a naphthalene skeleton; (B) a high molecular weight compound having at least structures represented by formulae (1) and (2 ) or at least a structure represented by the formula (2), no unsaturated bond between carbon atoms, and a weight-average molecular weight of 250,000 to 850,000; and (C) an inorganic filler. (C) The inorganic filler is subjected to surface treatment with a silane coupling agent represented by a formula (3).

Abstract: Provided is a prepreg that is formed by impregnating a fabric base material with a resin composition, then heating and drying. The resin composition includes (A) a polymer which has a specific structure, has no unsaturated bond between carbon atoms, has an epoxy number of from 0.2 to 0.8 eq/kg, and has a weight-average molecular weight of from 200,000 to 1,000,000; (B) a polyarylene-ether copolymer (PAE); and (C) an epoxy resin having two or more epoxy groups on a molecule. The component (B) is compatible with the component (A), and the component (C) is an epoxy resin that is incompatible with the component (A).

Abstract: The prepreg in accordance with the present invention is formed from a resin composition and a fabric substrate impregnated with the resin composition. The resin composition contains: (A) a thermosetting resin composition; (B) a resin having a Tg not more than 100° C.; and (C) an inorganic filler. The resin (B) having the Tg not more than 100° C. has: a carbonyl group or a siloxane group; and an epoxy group or a phenolic hydroxyl group. The inorganic filler (C) is subjected to surface-treatment with a silane coupling agent represented by a general formula: YSiX3, wherein X represents a methoxy group or an ethoxy group, and Y represents an aliphatic alkyl group having 6 to 18 carbon atoms.

Abstract: The prepreg in accordance with the present invention is formed from a resin composition and a fabric substrate impregnated with the resin composition. The resin composition contains: (A) a thermosetting resin composition; (B) a resin having a Tg not more than 100° C.; and (C) an inorganic filler. The resin (B) having the Tg not more than 100° C. has: a carbonyl group or a siloxane group; and an epoxy group or a phenolic hydroxyl group. The inorganic filler (C) is subjected to surface-treatment with a silane coupling agent represented by a general formula: YSiX3, wherein X represents a methoxy group or an ethoxy group, and Y represents an aliphatic alkyl group having 6 to 18 carbon atoms.

Abstract: The present invention relates to a resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 ?m/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.

Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

Abstract: The present disclosure relates to a prepreg formed by drying a fabric substrate impregnated with a resin composition by means of heating until the resin composition is in a semi-cured state. The resin composition contains (A) at least one of an epoxy resin having naphthalene skeleton and a phenolic curing agent; and (B) a polymer having structures represented by the following formulae (I) and (II), no unsaturated bond between carbon atoms, an epoxy value ranging from 0.2 to 0.8 ep/kg, and an weight-average molecular weight ranging from 200,000 to 850,000: wherein X:Y=0:1 to 0.35:0.65, R1 represents H or CH3, and R2 represents H or an alkyl group.

Abstract: A metal-clad laminate of the present invention includes an insulating layer and a metal layer disposed on at least one surface of the insulating layer. The insulating layer is formed by laminating at least a center layer and surface resin layers disposed on both surfaces of the center layer. The center layer contains a heat-curable resin and includes a core layer containing at least one fibrous base material and a heat-curable resin layer that does not contain a fibrous base material. The ratio of the thickness of the surface resin layer to the thickness of the heat-curable resin layer is between 0.5 and 10.

Abstract: A metal-clad laminate according to the invention is provided with an insulating layer and a metal layer present on at least one surface side of the insulating layer. The insulating layer is formed by laminating at least two layers, which are a first resin layer and a second resin layer disposed between the first resin layer and the metal layer. The first resin layer and the second resin layer each include a cured product of a resin composition. The resin composition in the first resin layer is different from the resin composition in the second resin layer. A relative permittivity of the cured product of the resin composition included in the second resin layer is lower than a relative permittivity of the cured product of the resin composition included in the first resin layer.