Patents by Inventor Hirokazu Higashi

Hirokazu Higashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220195080
    Abstract: A method for producing a composition including a step A of performing ultrafiltration, microfiltration, dialysis membrane treatment, or a combination thereof on a composition containing water and a fluoropolymer. The fluoropolymer is a polymer having a structural unit M3 derived from a monomer represented by general formula (1): CX2?CY(—CZ2—O—Rf-A)??(1) where X is the same or different and is —H or —F; Y is —H, —F, an alkyl group, or a fluorine-containing alkyl group; Z is the same or different and is —H, —F, an alkyl group, or a fluoroalkyl group; Rf is a fluorine-containing alkylene group having 1 to 40 carbon atoms or a fluorine-containing alkylene group having 2 to 100 carbon atoms and having an ether bond; and A is —COOM, —SO3M, —OSO3M, or —C(CF3)2OM, wherein M is as defined herein; provided that at least one of X, Y, and Z includes a fluorine atom.
    Type: Application
    Filed: April 27, 2020
    Publication date: June 23, 2022
    Applicant: DAIKIN INDUSTRIES LTD
    Inventors: Masahiro HIGASHI, Sumi ISHIHARA, Satoru YONEDA, Yosuke KISHIKAWA, Hirokazu AOYAMA
  • Publication number: 20220169830
    Abstract: A surfactant for polymerization including at least one selected from a surfactant represented by R1a—CO—R2a—CO—R3a—OSO3Xa and a surfactant represented by R1b—CO—(CR2b2)n—(OR3b)p—(CR4b2)q-L-OSO3Xb, wherein R1a, R2a, R3a, Xa, R1b, R2b, R3b, R4b, L and Xb are as defined herein. Also disclosed is a composition containing a fluoropolymer and the at least one surfactant, a composition containing a fluoropolymer and a compound represented by (H—(CF2)8—SO3)qM2, where M2 is as defined herein, and a molded article made from the composition containing a fluoropolymer and the compound represented by (H—(CF2)8—SO3)qM2.
    Type: Application
    Filed: February 15, 2022
    Publication date: June 2, 2022
    Applicant: DAIKIN INDUSTRIES,LTD.
    Inventors: Taketo KATO, Satoru YONEDA, Manabu FUJISAWA, Kazuya ASANO, Takahiro KITAHARA, Masahiro HIGASHI, Akiyoshi YAMAUCHI, Sumi ISHIHARA, Yosuke KISHIKAWA, Shinnosuke NITTA, Marina NAKANO, Hirotoshi YOSHIDA, Yoshinori NANBA, Kengo ITO, Chiaki OKUI, Hirokazu AOYAMA, Masamichi SUKEGAWA, Taku YAMANAKA, Hiroyuki SATO, Yuuji TANAKA, Kenji ICHIKAWA, Yohei FUJIMOTO
  • Patent number: 11071945
    Abstract: A filter membrane includes a membrane having through holes that selectively separates specific material in processing medium, the membrane including first, second and third layers such that the first layer has first surface that is supplied with processing medium, the third layer has second surface on the opposite side of the first surface, and the second layer is formed between the first and third layers. The first layer includes first convex and concave portions, the third layer includes second convex and concave portions each having a larger area than each first concave portion, the second convex portions are formed to surround the second concave portions and connected to one another, the second layer has through holes connecting the second concave portions and first set of the first concave portions, and the first concave portions include second set in regions opposing the second convex portions that is connected to each other.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: July 27, 2021
    Assignee: IBIDEN CO., LTD.
    Inventors: Masatoshi Kunieda, Hirokazu Higashi, Tatsuhiro Kawai
  • Publication number: 20190232218
    Abstract: A filter membrane includes a membrane having through holes that selectively separates specific material in processing medium, the membrane including first, second and third layers such that the first layer has first surface that is supplied with processing medium, the third layer has second surface on the opposite side of the first surface, and the second layer is formed between the first and third layers. The first layer includes first convex and concave portions, the third layer includes second convex and concave portions each having a larger area than each first concave portion, the second convex portions are formed to surround the second concave portions and connected to one another, the second layer has through holes connecting the second concave portions and first set of the first concave portions, and the first concave portions include second set in regions opposing the second convex portions that is connected to each other.
    Type: Application
    Filed: January 29, 2019
    Publication date: August 1, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Masatoshi KUNIEDA, Hirokazu HIGASHI, Tatsuhiro KAWAI
  • Publication number: 20180154317
    Abstract: A filter membrane for selectively separating a specific material from other materials in a processing medium includes a membrane including resin material and having openings formed such that the openings selectively separate a specific material from other materials in a processing medium. The membrane has a first surface and a second surface on the opposite side with respect to the first surface such that the first surface receives the processing medium supplied to the membrane, the openings are formed through the membrane such that each of the openings has an opening part extending from the second surface toward the first surface and an expansion part expanding a size of the opening part and extending from the opening part to the first surface, and the first surface of the membrane is divided into multiple regions.
    Type: Application
    Filed: December 5, 2017
    Publication date: June 7, 2018
    Applicant: IBIDEN CO., LTD.
    Inventors: Masatoshi Kunieda, Hirokazu Higashi
  • Patent number: 9320153
    Abstract: A printed wiring board includes an interlayer resin insulation layer having a penetrating hole, a conductive circuit formed on a first surface of the interlayer resin insulation layer, a filled via conductor formed in the penetrating hole of the interlayer resin insulation layer and connected to the conductive circuit, a first surface-treatment coating structure formed on a first surface of the filled via conductor and having an electroless plating structure, and a second surface-treatment coating structure formed on a second surface of the filled via conductor on an opposite side with respect to the first surface-treatment coating structure and having an electroless plating structure. The filled via conductor includes a first conductive layer formed on side wall of the penetrating hole and a plated material filling the penetrating hole, and the first surface-treatment coating structure has a thickness which is different from a thickness of the second surface-treatment coating structure.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: April 19, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Masahiro Kaneko, Satoru Kose, Hirokazu Higashi
  • Publication number: 20150075851
    Abstract: A printed wiring board includes an interlayer resin insulation layer having a penetrating hole, a conductive circuit formed on a first surface of the interlayer resin insulation layer, a filled via conductor formed in the penetrating hole of the interlayer resin insulation layer and connected to the conductive circuit, a first surface-treatment coating structure formed on a first surface of the filled via conductor and having an electroless plating structure, and a second surface-treatment coating structure formed on a second surface of the filled via conductor on an opposite side with respect to the first surface-treatment coating structure and having an electroless plating structure. The filled via conductor includes a first conductive layer formed on side wall of the penetrating hole and a plated material filling the penetrating hole, and the first surface-treatment coating structure has a thickness which is different from a thickness of the second surface-treatment coating structure.
    Type: Application
    Filed: November 20, 2014
    Publication date: March 19, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Masahiro KANEKO, Satoru KOSE, Hirokazu HIGASHI
  • Patent number: 8935850
    Abstract: A method for manufacturing a printed wiring board includes forming a removable layer on a support substrate, forming an interlayer resin insulation layer on the removable layer, forming a penetrating hole in the interlayer resin insulation layer, forming a first conductive layer on the interlayer resin insulation layer and on a side wall of the penetrating hole, forming a conductive circuit on the interlayer resin insulation layer, forming a via conductor in the penetrating hole, removing the support substrate from the interlayer resin insulation layer by using the removable layer, forming a protruding portion of the via conductor protruding from a surface of the interlayer resin insulation layer, and forming a surface-treatment coating on a surface of the protruding portion of the via conductor.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: January 20, 2015
    Assignee: Ibiden Co., Ltd.
    Inventors: Masahiro Kaneko, Satoru Kose, Hirokazu Higashi
  • Publication number: 20130341077
    Abstract: A method for repairing a disconnection in a wiring board includes positioning a substrate including an insulation layer and a conductive layer formed on the insulation layer, the conductive layer having a wiring line disconnected such that the wiring line has a disconnected portion formed between conductive patterns forming the wiring line, applying in the disconnected portion between the conductive patterns a conductive paste including a non-conductive material and conductive particles such that the conductive paste fills the disconnected portion between the conductive patterns and joins the conductive patterns forming the wiring line in the conductive layer, and irradiating laser upon the conductive paste applied in the disconnected portion such that at least a portion of the conductive paste in the disconnected portion is sintered and forms a sintered portion connecting the conductive patterns of the wiring line in the conductive layer.
    Type: Application
    Filed: January 29, 2013
    Publication date: December 26, 2013
    Applicant: IBIDEN CO., LTD.
    Inventors: Shinji OUCHI, Hirokazu HIGASHI
  • Patent number: 8410376
    Abstract: A printed wiring board includes an interlayer resin insulation layer having a penetrating hole for a via conductor, a conductive circuit formed on one surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and having a protruding portion protruding from the other surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the protruding portion of the via conductor. The via conductor is connected to the conductive circuit and has a first conductive layer formed on the side wall of the penetrating hole and a plated layer filling the penetrating hole.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: April 2, 2013
    Assignee: Ibiden Co., Ltd.
    Inventors: Masahiro Kaneko, Satoru Kose, Hirokazu Higashi
  • Patent number: 8378230
    Abstract: A printed wiring board includes an interlayer resin insulation layer having the first surface, the second surface on the opposite side of the first surface, and a penetrating hole for a via conductor, a conductive circuit formed on the first surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and connected to the conductive circuit on the first surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the via conductor exposed from the second surface of the interlayer resin insulation layer through the penetrating hole. The via conductor is made of a first conductive layer formed on the side wall of the penetrating hole and a plated-metal filling the penetrating hole. The surface of the via conductor is recessed from the second surface of the interlayer resin insulation layer.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: February 19, 2013
    Assignee: Ibiden Co., Ltd.
    Inventors: Masahiro Kaneko, Daiki Komatsu, Satoru Kose, Hirokazu Higashi
  • Publication number: 20110067913
    Abstract: A printed wiring board includes an interlayer resin insulation layer having the first surface, the second surface on the opposite side of the first surface, and a penetrating hole for a via conductor, a conductive circuit formed on the first surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and connected to the conductive circuit on the first surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the via conductor exposed from the second surface of the interlayer resin insulation layer through the penetrating hole. The via conductor is made of a first conductive layer formed on the side wall of the penetrating hole and a plated-metal filling the penetrating hole. The surface of the via conductor is recessed from the second surface of the interlayer resin insulation layer.
    Type: Application
    Filed: April 30, 2010
    Publication date: March 24, 2011
    Applicant: IBIDEN CO., LTD.
    Inventors: Masahiro KANEKO, Daiki Komatsu, Satoru Kose, Hirokazu Higashi
  • Publication number: 20110048773
    Abstract: A printed wiring board includes an interlayer resin insulation layer having a penetrating hole for a via conductor, a conductive circuit formed on one surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and having a protruding portion protruding from the other surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the protruding portion of the via conductor. The via conductor is connected to the conductive circuit and has a first conductive layer formed on the side wall of the penetrating hole and a plated layer filling the penetrating hole.
    Type: Application
    Filed: July 21, 2010
    Publication date: March 3, 2011
    Applicant: IBIDEN CO., LTD.
    Inventors: Masahiro Kaneko, Satoru Kose, Hirokazu Higashi
  • Publication number: 20050031920
    Abstract: There is provided a catalyst for a water gas shift reaction in a hydrogen gas which is able to effectively remove CO in the hydrogen gas within a broader temperature range. Such a catalyst for the water gas shift reaction is characterized in that a metal oxide carrier supports at least platinum. The catalyst can be used for removing carbon monoxide in the hydrogen gas. Particularly, such a catalyst can be used in the water gas shift reaction for removing carbon monoxide in a reformed gas in a fuel cell generation system.
    Type: Application
    Filed: April 14, 2004
    Publication date: February 10, 2005
    Applicant: MATSUSHITA ELECTRIC WORKS, LTD.
    Inventors: Akira Igarashi, Hirokazu Higashi, Manabu Mizobuchi, Noboru Hashimoto, Kensaku Kinugawa
  • Patent number: 6777117
    Abstract: There is provided a catalyst for a water gas shift reaction in a hydrogen gas which is able to effectively remove CO in the hydrogen gas within a broader temperature range. Such a catalyst for the water gas shift reaction is characterized in that a metal oxide carrier supports at least platinum. The catalyst can be used for removing carbon monoxide in the hydrogen gas. Particularly, such a catalyst can be used in the water gas shift reaction for removing carbon monoxide in a reformed gas in a fuel cell generation system.
    Type: Grant
    Filed: February 6, 2001
    Date of Patent: August 17, 2004
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Akira Igarashi, Hirokazu Higashi, Manabu Mizobuchi, Noboru Hashimoto, Kensaku Kinugawa
  • Patent number: 6013407
    Abstract: A positive resist composition is excellent in sensitivity, film loss after development, resolution, thermal-flow resistance, storage stability, exposure margin and focus margin and comprises in combination (A) an alkali-soluble phenol resin, (B) a quinonediazide sulfonate type photosensitive agent and (C) a phenolic compound, wherein the phenolic compound (C) is at least one phenolic compound selected from the group consisting of phenolic compounds (CX) having a structural unit represented by the following formula (I) and phenolic compounds (CD) having a structural unit represented by the following formula (II): ##STR1## wherein R.sup.1 to R.sup.3 are, independently of one another, a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group which may be substituted, a cycloalkyl group which may be substituted, an alkenyl group which may be substituted, an alkoxy group which may be substituted, or an aryl group which may be substituted, R.sup.4 to R.sup.
    Type: Grant
    Filed: July 8, 1997
    Date of Patent: January 11, 2000
    Assignee: Nippon Zeon Co., Ltd.
    Inventors: Shoji Kawata, Hiroshi Hayashi, Hirokazu Higashi, Takeyoshi Kato, Masahiro Nakamura