Patents by Inventor Hiroki Kitayama

Hiroki Kitayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990417
    Abstract: A semiconductor memory device includes a first insulating layer, a first conductive layer, a first pillar, a second pillar, and a second insulating layer. The first conductive layer contains tungsten. The first conductive layer includes a first sub conductive layer and a second sub conductive layer. The first pillar and the second pillar pass through the first insulating layer and the first conductive layer. The second insulating layer divides the first insulating layer and the first conductive layer. The first sub conductive layer is in contact with the second sub conductive layer and is provided between the second sub conductive layer and the first insulating layer. A fluorine concentration in the first sub conductive layer is lower than that in the second sub conductive layer.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: May 21, 2024
    Assignee: Kioxia Corporation
    Inventors: Hiroki Kitayama, Mitsuo Ikeda, Daisuke Ikeno, Akihiro Kajita
  • Publication number: 20230413555
    Abstract: According to one embodiment, a semiconductor storage device includes a memory pillar extending in a first direction. The memory pillar includes a tunnel insulation film, a charge storage layer on the tunnel insulation film, and a first block insulation film on the charge storage layer. A conductor layer extends in a second direction intersecting the first direction to meet a portion of the memory pillar. The conductor layer includes a first layer comprising molybdenum and a second layer comprising tungsten. The first layer is between the memory pillar and the second layer in the second direction.
    Type: Application
    Filed: March 2, 2023
    Publication date: December 21, 2023
    Inventors: Hiroki KITAYAMA, Tomotaka ARIGA, Mitsuo IKEDA, Daisuke IKENO, Akihiro KAJITA
  • Publication number: 20230046783
    Abstract: A semiconductor memory device includes a first insulating layer, a first conductive layer, a first pillar, a second pillar, and a second insulating layer. The first conductive layer contains tungsten. The first conductive layer includes a first sub conductive layer and a second sub conductive layer. The first pillar and the second pillar pass through the first insulating layer and the first conductive layer. The second insulating layer divides the first insulating layer and the first conductive layer. The first sub conductive layer is in contact with the second sub conductive layer and is provided between the second sub conductive layer and the first insulating layer. A fluorine concentration in the first sub conductive layer is lower than that in the second sub conductive layer.
    Type: Application
    Filed: December 14, 2021
    Publication date: February 16, 2023
    Applicant: Kioxia Corporation
    Inventors: Hiroki KITAYAMA, Mitsuo IKEDA, Daisuke IKENO, Akihiro KAJITA
  • Patent number: 11067289
    Abstract: A water receiving member is reduced in size and is therefore made difficult to visually recognize. A cooking device (1) includes a main body (11), a front door (12), and a waste receiving member (41). The front door (12) has a water droplet restraining part (33) provided on a lower portion of an inner surface of the front door (12) which inner surface faces the heating room (13). While the front door (12) is closed, the water droplet restraining part (33) protrudes diagonally downwardly or horizontally from the inner surface of the front door (12) toward a rear side of the main body (11).
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: July 20, 2021
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Hiroki Kitayama, Kazuya Kitatani, Masayuki Uno, Shinya Ueda, Masayuki Iwamoto
  • Publication number: 20210088222
    Abstract: A water receiving member is reduced in size and is therefore made difficult to visually recognize. A cooking device (1) includes a main body (11), a front door (12), and a waste receiving member (41). The front door (12) has a water droplet restraining part (33) provided on a lower portion of an inner surface of the front door (12) which inner surface faces the heating room (13). While the front door (12) is closed, the water droplet restraining part (33) protrudes diagonally downwardly or horizontally from the inner surface of the front door (12) toward a rear side of the main body (11).
    Type: Application
    Filed: January 19, 2017
    Publication date: March 25, 2021
    Inventors: HIROKI KITAYAMA, KAZUYA KITATANI, MASAYUKI UNO, SHINYA UEDA, MASAYUKI IWAMOTO
  • Patent number: 10749102
    Abstract: A piezoelectric vibration component that includes a piezoelectric vibrator, a substrate, and a conductive adhesive that bonds the piezoelectric vibrator to the substrate. The conductive adhesive contains a silicone-based base resin, a cross-linker, a conductive filler, and an insulating filler. The silicone-based base resin has a weight-average molecular weight of 20,000 to 102,000. The cross-linker has a number-average molecular weight of 1,950 to 4,620. The conductive filler and the insulating filler have a particle size of 10 ?m or less.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: August 18, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Koji Nagahara, Muneyuki Daidai, Masahiro Saito, Atsushi Sugimasa, Hiroki Kitayama, Shigehisa Yago
  • Publication number: 20170345995
    Abstract: A piezoelectric vibration component that includes a piezoelectric vibrator, a substrate, and a conductive adhesive that bonds the piezoelectric vibrator to the substrate. The conductive adhesive contains a silicone-based base resin, a cross-linker, a conductive filler, and an insulating filler. The silicone-based base resin has a weight-average molecular weight of 20,000 to 102,000. The cross-linker has a number-average molecular weight of 1,950 to 4,620. The conductive filler and the insulating filler have a particle size of 10 ?m or less.
    Type: Application
    Filed: August 18, 2017
    Publication date: November 30, 2017
    Inventors: Koji Nagahara, Muneyuki Daidai, Masahiro Saito, Atsushi Sugimasa, Hiroki Kitayama, Shigehisa Yago
  • Publication number: 20170059171
    Abstract: A heating cooker includes a main casing, a heating chamber that is provided in the main casing and that is for heating an object to be heated, a door (3) that is provided on a front face side of the main casing and that opens and closes an opening of the heating chamber, and a dew receiving container (6) that is detachably attached onto an under front face side of the main casing.
    Type: Application
    Filed: July 14, 2015
    Publication date: March 2, 2017
    Inventors: Hiroki KITAYAMA, Junichi TAKEUCHI, Yasuhiko KAMII
  • Patent number: 9472351
    Abstract: A solid electrolytic capacitor that includes a capacitor element; an exterior resin; an anode lead terminal; and a cathode lead terminal. The anode lead terminal has a Cu base material, and an Au-plating layer formed thereon, and includes an Au region where the Au-plating layer as a surface layer is formed, and a Cu region where the Au-plating layer is not formed. The cathode lead terminal includes a base material, and an Au-plating layer as a surface layer of the cathode lead terminal, which is formed on the base material, and an anode section of the capacitor element is connected to the Cu region of the anode lead terminal.
    Type: Grant
    Filed: January 7, 2015
    Date of Patent: October 18, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Akio Katsube, Hiroki Kitayama, Shinji Otani, Koji Murata
  • Patent number: 9276194
    Abstract: A bonding method that provides excellent conductivity and bonding between a piezoelectric body and a metal plate includes a metal plate and an electrode of a piezoelectric body bonded to one another with an electrically conductive adhesive so as to provide electrical conductivity, the electrically conductive adhesive includes carbon black with a nano-level average particle size, and has a paste form included in a solventless or solvent-based resin so that the carbon black forms an aggregate with an average particle size of about 1 ?m to about 50 ?m. The electrically conductive adhesive is applied between the metal plate and the electrode of the piezoelectric body, and the metal plate and the piezoelectric body are subjected to heating and pressurization so that the carbon black aggregate is deformed, thereby hardening the electrically conductive adhesive.
    Type: Grant
    Filed: June 19, 2013
    Date of Patent: March 1, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroki Kitayama, Hideo Nakagoshi, Kiyoshi Kurihara
  • Publication number: 20150194270
    Abstract: A solid electrolytic capacitor that includes a capacitor element; an exterior resin; an anode lead terminal; and a cathode lead terminal. The anode lead terminal has a Cu base material, and an Au-plating layer formed thereon, and includes an Au region where the Au-plating layer as a surface layer is formed, and a Cu region where the Au-plating layer is not formed. The cathode lead terminal includes a base material, and an Au-plating layer as a surface layer of the cathode lead terminal, which is formed on the base material, and an anode section of the capacitor element is connected to the Cu region of the anode lead terminal.
    Type: Application
    Filed: January 7, 2015
    Publication date: July 9, 2015
    Inventors: Akio Katsube, Hiroki Kitayama, Shinji Otani, Koji Murata
  • Patent number: 8982537
    Abstract: In a solid electrolytic capacitor, resistance welding is carried out to bond a valve metal substrate and a spacer together while controlling a welding current so that only a bonding material provided in spacers and having a relatively low melting point is melted. At least a portion of the bonding material provided in the spacer penetrates an etching part of the valve metal substrate, and thickness Ta of a core part located at a positive electrode part in the valve metal substrate and thickness Tc of the core part located at a negative electrode part satisfy the requirement of |Tc?Ta|/Tc×100?10[%].
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: March 17, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroki Kitayama, Akio Katsube
  • Publication number: 20130276977
    Abstract: A bonding structure that provides excellent conductivity and bonding between a piezoelectric body and a metal plate includes a metal plate and an electrode of a piezoelectric body bonded to one another with an electrically conductive adhesive so as to provide electrical conductivity, the electrically conductive adhesive includes carbon black with a nano-level average particle size, and has a paste form included in a solventless or solvent-based resin so that the carbon black forms an aggregate with an average particle size of about 1 ?m to about 50 ?m. The electrically conductive adhesive is applied between the metal plate and the electrode of the piezoelectric body, and the metal plate and the piezoelectric body are subjected to heating and pressurization so that the carbon black aggregate is deformed, thereby hardening the electrically conductive adhesive.
    Type: Application
    Filed: June 19, 2013
    Publication date: October 24, 2013
    Inventors: Hiroki KITAYAMA, Hideo NAKAGOSHI, Kiyoshi KURIHARA
  • Patent number: 8492959
    Abstract: A bonding structure that provides excellent conductivity and bonding between a piezoelectric body and a metal plate includes a metal plate and an electrode of a piezoelectric body bonded to one another with an electrically conductive adhesive so as to provide electrical conductivity, the electrically conductive adhesive includes carbon black with a nano-level average particle size, and has a paste form included in a solventless or solvent-based resin so that the carbon black forms an aggregate with an average particle size of about 1 ?m to about 50 ?m. The electrically conductive adhesive is applied between the metal plate and the electrode of the piezoelectric body, and the metal plate and the piezoelectric body are subjected to heating and pressurization so that the carbon black aggregate is deformed, thereby hardening the electrically conductive adhesive.
    Type: Grant
    Filed: December 27, 2011
    Date of Patent: July 23, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroki Kitayama, Hideo Nakagoshi, Kiyoshi Kurihara
  • Patent number: 8464705
    Abstract: An open/close adjustment device is connected to the door of a heating chamber of a cooking device, and the open/close adjustment device pulls the door back to its totally closed position. The open/close adjustment device adjusts an operation force when the door is passing a predetermined open angle. The operation force indicates a maximum value when the door is passing the predetermined open angle, and the maximum value is given by two protrusions disposed at front-side and rear-side with distance between them. Each of the protrusions each produces a load when they go over a support member, and a following one of the two protrusions produces a load larger than a load firstly produced by a preceding one of the two protrusions when the door is opened.
    Type: Grant
    Filed: July 9, 2007
    Date of Patent: June 18, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hiroki Kitayama, Masahiro Nishijima, Takeyuki Ozaki
  • Publication number: 20130100586
    Abstract: In a solid electrolytic capacitor, resistance welding is carried out to bond a valve metal substrate and a spacer together while controlling a welding current so that only a bonding material provided in spacers and having a relatively low melting point is melted. At least a portion of the bonding material provided in the spacer penetrates an etching part of the valve metal substrate, and thickness Ta of a core part located at a positive electrode part in the valve metal substrate and thickness Tc of the core part located at a negative electrode part satisfy the requirement of |Tc?Ta|/Tc×100?10 [%].
    Type: Application
    Filed: August 29, 2012
    Publication date: April 25, 2013
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Hiroki Kitayama, Akio Katsube
  • Patent number: 8288695
    Abstract: A cooking device for performing cooking using a microwave and steam, in which a door of a heating chamber includes, as constituting components, an inner frame, a choke cover, and a gasket. The inner frame is made of metal and has at its periphery a choke structure constructed from a large number of comb teeth. The gasket is installed in the door with a base section of the gasket held between the inner frame and the choke cover. A lip section of the gasket has a bag-like cross-section whose side that faces the inside of the heating chamber is an entrance. The forward end of the lip section is bent to the door side. The comb teeth, except those positioned at the corners of the door, are bent at a larger angle than in a case in which the gasket is not installed.
    Type: Grant
    Filed: August 25, 2006
    Date of Patent: October 16, 2012
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Masahiro Nishijima, Hiroki Kitayama
  • Publication number: 20120091863
    Abstract: A bonding structure that provides excellent conductivity and bonding between a piezoelectric body and a metal plate includes a metal plate and an electrode of a piezoelectric body bonded to one another with an electrically conductive adhesive so as to provide electrical conductivity, the electrically conductive adhesive includes carbon black with a nano-level average particle size, and has a paste form included in a solventless or solvent-based resin so that the carbon black forms an aggregate with an average particle size of about 1 ?m to about 50 ?m. The electrically conductive adhesive is applied between the metal plate and the electrode of the piezoelectric body, and the metal plate and the piezoelectric body are subjected to heating and pressurization so that the carbon black aggregate is deformed, thereby hardening the electrically conductive adhesive.
    Type: Application
    Filed: December 27, 2011
    Publication date: April 19, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroki Kitayama, Hideo Nakagoshi, Kiyoshi Kurihara
  • Publication number: 20120031282
    Abstract: A cooking device has a cam mechanism (104) which moves in association with the pivoting of a door (103). The cam mechanism (104) includes a cam roller (131) rotatably mounted to a support base (130), an arm (132) having a front end pivotable connected to the door (103), having a cam surface (134) in sliding contact with the cam roller (131), and capable of moving in to-and-fro direction relative to a casing, and a coiled spring (133) stretched between the support base (130) and a rear end of the arm (132). The arm (132) has a recess (135) on a surface facing the door (103). When the door (103) is fully open, the recess (135) forms between the door (103) and the arm (132) a space (S) having sufficient size allowing a user's finger to be inserted in and removed from the space.
    Type: Application
    Filed: April 16, 2010
    Publication date: February 9, 2012
    Inventors: Hiroki Kitayama, Masahiro Nishijima
  • Publication number: 20120017768
    Abstract: A water tank 104 includes a tank main body 130 for storing water therein, and a decorative plate 131 attached to the tank main body 130 and having a height H1 higher than a height H2 of the tank main body. A handle portion is provided in a decorative plate 131 side bottom face of the tank main body 130. At an upper end of the decorative plate 131, a holding recess portion 139 is formed so as to allow a user to hold a top face of the tank main body 130 while gripping the handle portion.
    Type: Application
    Filed: April 9, 2010
    Publication date: January 26, 2012
    Inventors: Hiroki Kitayama, Takao Murai, Noriko Ina