Patents by Inventor Hiroki Matsuzawa

Hiroki Matsuzawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11232995
    Abstract: To provide a semiconductor device capable of effectively releasing heat from a semiconductor element, the semiconductor device includes a semiconductor element, a heat sink connected thermally to the semiconductor element and a coolant flow channel formed facing the heat sink. The heat sink is integrally composed of multiple cooling fins projecting toward the coolant flow channel. A linear base of each of the multiple cooling fins inclines relative to a direction in which a coolant is supplied through the coolant flow channel. An inclination of a linear base of each of the cooling fins arranged adjacent to each other in the direction relative to the coolant flow direction is substantially opposite from each other.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: January 25, 2022
    Assignee: DENSO CORPORATION
    Inventors: Hiroki Matsuzawa, Bahman Hossini Soltani, Kazuya Takeuchi
  • Patent number: 11189544
    Abstract: A power conversion apparatus includes a semiconductor element, a plurality of lead frames, a flow-passage formation body, an insulating portion, a metal joining material, and a resin sealing portion. The plurality of lead frames are electrically connected to the semiconductor element. The flow-passage formation body forms a coolant flow passage in which a coolant flows. The insulating portion is arranged between the lead frame and the flow-passage formation body to provide insulation between the lead frame and the flow-passage formation body. The metal joining material joins the insulating portion and the flow-passage formation body. The resin sealing portion seals the semiconductor element and the lead frames. The semiconductor element and the lead frames are integrated with the flow-passage formation body to form a semiconductor cooling assembly by the resin sealing portion.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: November 30, 2021
    Assignee: DENSO CORPORATION
    Inventors: Hiroki Matsuzawa, Bahman Hossini Soltani
  • Publication number: 20200176354
    Abstract: A power conversion apparatus includes a semiconductor element, a plurality of lead frames, a flow-passage formation body, an insulating portion, a metal joining material, and a resin sealing portion. The plurality of lead frames are electrically connected to the semiconductor element. The flow-passage formation body forms a coolant flow passage in which a coolant flows. The insulating portion is arranged between the lead frame and the flow-passage formation body to provide insulation between the lead frame and the flow-passage formation body. The metal joining material joins the insulating portion and the flow-passage formation body. The resin sealing portion seals the semiconductor element and the lead frames. The semiconductor element and the lead frames are integrated with the flow-passage formation body to form a semiconductor cooling assembly by the resin sealing portion.
    Type: Application
    Filed: February 5, 2020
    Publication date: June 4, 2020
    Applicant: DENSO CORPORATION
    Inventors: Hiroki MATSUZAWA, Bahman Hossini SOLTANI
  • Publication number: 20200075452
    Abstract: To provide a semiconductor device capable of effectively releasing heat from a semiconductor element, the semiconductor device includes a semiconductor element, a heat sink connected thermally to the semiconductor element and a coolant flow channel formed facing the heat sink. The heat sink is integrally composed of multiple cooling fins projecting toward the coolant flow channel. A linear base of each of the multiple cooling fins inclines relative to a direction in which a coolant is supplied through the coolant flow channel. An inclination of a linear base of each of the cooling fins arranged adjacent to each other in the direction relative to the coolant flow direction is substantially opposite from each other.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Inventors: Hiroki MATSUZAWA, Bahman Hossini SOLTANI, Kazuya TAKEUCHI
  • Patent number: 7658637
    Abstract: A connector installed in a casing containing an electronic device such as a car navigation device is coupled to another connector installed in a memory device such as a hard disc. The connector includes a support member composed of a back plate and side plates connected to the back plate. The connector is disposed on the back plate, and coupling guides to be coupled to guiding grooves formed on the memory device are formed integrally with the side plates. The coupling guides are slid into the guiding grooves to correctly position the connector relative to the memory-side connector when the memory device is coupled to the casing containing the connector. Thus, the connector is surely coupled to the memory-side connector at a right position to establish electrical connection between two connectors.
    Type: Grant
    Filed: September 25, 2008
    Date of Patent: February 9, 2010
    Assignee: DENSO CORPORATION
    Inventor: Hiroki Matsuzawa
  • Publication number: 20090104810
    Abstract: A connector installed in a casing containing an electronic device such as a car navigation device is coupled to another connector installed in a memory device such as a hard disc. The connector includes a support member composed of a back plate and side plates connected to the back plate. The connector is disposed on the back plate, and coupling guides to be coupled to guiding grooves formed on the memory device are formed integrally with the side plates. The coupling guides are slid into the guiding grooves to correctly position the connector relative to the memory-side connector when the memory device is coupled to the casing containing the connector. Thus, the connector is surely coupled to the memory-side connector at a right position to establish electrical connection between two connectors.
    Type: Application
    Filed: September 25, 2008
    Publication date: April 23, 2009
    Applicant: DENSO CORPORATION
    Inventor: Hiroki Matsuzawa
  • Publication number: 20080006473
    Abstract: A device for a vehicle has a casing, which is provided with a noise isolation member for obstructing gaps between openings and connectors, gaps at engagement positions and gaps at screw holes, for example. Thus, noise transmitted to passengers in the vehicle from the device can be reduced. The noise isolation member is resilient at the part obstructing the gaps, without hindrance to connection of the connector.
    Type: Application
    Filed: November 18, 2005
    Publication date: January 10, 2008
    Applicant: DENSO CORPORATION
    Inventors: Hiroki Matsuzawa, Yasushi Ohasi, Masaaki Imai, Izuho Murakami