Patents by Inventor Hiroki Ozeki

Hiroki Ozeki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190002741
    Abstract: A method for manufacturing a connection structure capable of increasing the allowable range of a spacing between terminals of a component and mounting at a low temperature. The method for manufacturing a connection structure includes a disposition step of disposing, through an anisotropic conductive adhesive of a thermosetting type including conductive particles, a first electronic component including a first terminal row and a second electronic component including a second terminal row facing the first terminal row, a thermal pressurization step of thermally pressurizing the first electronic component and the second electronic component to sandwich the conductive particles between the first terminal row and the second terminal row, and a full curing step of irradiating with infrared laser light to fully cure the anisotropic conductive adhesive in a state where the conductive particles are sandwiched between the first terminal row and the second terminal row.
    Type: Application
    Filed: February 21, 2017
    Publication date: January 3, 2019
    Applicant: DEXERIALS CORPORATION
    Inventor: Hiroki OZEKI
  • Patent number: 9253911
    Abstract: The present invention provides an anisotropic conductive material in which lower continuity resistance and higher adhesive strength are obtained, and a method for manufacturing the same. When a glass substrate and a metal wiring material are thermally compressed and bonded, in an interface between the glass substrate and an anisotropic conductive material, Si on a surface of the glass substrate reacts on an alkoxyl group (OR) at an end of disulfide silane modified by hydrophobic silica, and chemically binds thereto. Furthermore, at an interface between the metal wiring material and the anisotropic conductive material, a part of S—S bonds (disulfide bonds) in disulfide silane dissociates due to the heat at the time of thermocompression bonding, and the dissociated sulfide silane chemically binds to metal Me.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: February 2, 2016
    Assignee: DEXERIALS CORPORATION
    Inventors: Reiji Tsukao, Tomoyuki Ishimatsu, Hiroki Ozeki
  • Patent number: 8987607
    Abstract: To provide a conductive particle, which contains a core particle, and a conductive layer formed on a surface of the core particle, where the core particle is formed of a resin, or a metal, or both thereof, and the conductive layer contains a phosphorus-containing hydrophobic group at a surface thereof.
    Type: Grant
    Filed: July 19, 2012
    Date of Patent: March 24, 2015
    Assignee: Dexerials Corporation
    Inventors: Hiroki Ozeki, Tomoyuki Ishimatsu, Reiji Tsukao
  • Patent number: 8796557
    Abstract: An adhesive film, containing a first adhesive layer in which conductive particles are dispersed, and a second adhesive layer adhered to the first adhesive layer, wherein the lowest viscosity of the first adhesive layer attained at or below the curing temperature is higher than that of the second adhesive layer attained at or below the curing temperature, where the curing temperature is a temperature at which the adhesive layer starts to cure, wherein the first and second adhesive layers are respectively disposed to a substrate side and an electronic part side, and the adhesive film is configured to join the electronic part and the substrate by heating and pressurizing the substrate and the electronic part with the adhesive layer being therebetween, and wherein the first adhesive layer has a thickness which is less than two times of an average particle diameter of the conductive particles.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: August 5, 2014
    Assignee: Dexerials Corporation
    Inventors: Tomoyuki Ishimatsu, Hiroki Ozeki
  • Publication number: 20130135838
    Abstract: The present invention provides an anisotropic conductive material in which lower continuity resistance and higher adhesive strength are obtained, and a method for manufacturing the same. When a glass substrate and a metal wiring material are thermally compressed and bonded, in an interface between the glass substrate and an anisotropic conductive material, Si on a surface of the glass substrate reacts on an alkoxyl group (OR) at an end of disulfide silane modified by hydrophobic silica, and chemically binds thereto. Furthermore, at an interface between the metal wiring material and the anisotropic conductive material, a part of S—S bonds (disulfide bonds) in disulfide silane dissociates due to the heat at the time of thermocompression bonding, and the dissociated sulfide silane chemically binds to metal Me.
    Type: Application
    Filed: November 30, 2011
    Publication date: May 30, 2013
    Applicant: DEXERIALS CORPORATION
    Inventors: Reiji Tsukao, Tomoyuki Ishimatsu, Hiroki Ozeki
  • Publication number: 20130077266
    Abstract: A connection method and a connection structure of electronic components by which high connection reliability can be obtained. An anisotropic conductive film is temporarily disposed, and thermally compressed and bonded, in such manner that a boundary of a circuit protection area and a terminal area of a second electronic component is positioned on a single layer area of the anisotropic conductive film; and the terminal area of the second electronic component is positioned on a double-layer area of the anisotropic conductive film.
    Type: Application
    Filed: October 26, 2011
    Publication date: March 28, 2013
    Applicant: DEXERIALS CORPORATION
    Inventors: Reiji Tsukao, Tomoyuki Ishimatsu, Hiroki Ozeki
  • Patent number: 8395052
    Abstract: The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: March 12, 2013
    Assignee: Dexerials Corporation
    Inventors: Tomoyuki Ishimatsu, Hiroki Ozeki, Hiroshi Hamachi
  • Publication number: 20120279781
    Abstract: To provide a conductive particle, which contains a core particle, and a conductive layer formed on a surface of the core particle, where the core particle is formed of a resin, or a metal, or both thereof, and the conductive layer contains a phosphorus-containing hydrophobic group at a surface thereof.
    Type: Application
    Filed: July 19, 2012
    Publication date: November 8, 2012
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Hiroki Ozeki, Tomoyuki Ishimatsu, Reiji Tsukao
  • Patent number: 8273207
    Abstract: A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: September 25, 2012
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Tomoyuki Ishimatsu, Daisuke Sato, Hiroki Ozeki
  • Patent number: 8158887
    Abstract: An adhesive film including a first adhesive layer containing a first main resin component and dispersed conductive particles, and a second adhesive layer containing a second main resin component and adhering to the first adhesive layer, each of the adhesive layers containing a secondary resin component, wherein the first main resin component has a glass transition temperature higher than that of the secondary resin component, and the second main resin component has a glass transition temperature higher than that of the secondary resin component and lower than that of the first main resin component, and a reaction peak temperature of each of the adhesive layers is lower than the glass transition temperature of the first main resin component and higher than the glass transition temperature of the second main resin component, and is a temperature at which a calorific value of the adhesive layer is maximum during temperature rise.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: April 17, 2012
    Assignees: Sony Corporation, Sony Chemical & Information Device Corporation
    Inventors: Tomoyuki Ishimatsu, Hiroki Ozeki
  • Publication number: 20110120767
    Abstract: An anisotropic conductive film that may give rise to high connection reliability, and a method for manufacturing a connection assembly with the use of the anisotropic conductive film, are disclosed. An anisotropic conductive film (2) is composes of an insulating adhesive resin containing polybutadiene particles, a cationic polymerizable resin and a cationic curing agent, and conductive particles dispersed in the insulating adhesive resin, with the lowest melt viscosity of the anisotropic conductive film being 300 to 1000 Pa·s. This anisotropic conductive film is placed in contact with terminal electrodes of a glass substrate (1). A flexible printed circuit board (3) is placed on top of the anisotropic conductive film so that terminal electrodes of the flexible printed circuit board (3) are in contact with the anisotropic conductive film (2). A heating tool is thrust onto the flexible printed circuit board side for electrically interconnecting the terminal electrodes.
    Type: Application
    Filed: May 20, 2008
    Publication date: May 26, 2011
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Daisuke Sato, Hiroki Ozeki, Tomoyuki Ishimatsu
  • Publication number: 20110088935
    Abstract: The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer.
    Type: Application
    Filed: December 22, 2010
    Publication date: April 21, 2011
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Tomoyuki ISHIMATSU, Hiroki Ozeki, Hiroshi Hamachi
  • Publication number: 20100116533
    Abstract: An adhesive film including a first adhesive layer containing a first main resin component and dispersed conductive particles, and a second adhesive layer containing a second main resin component and adhering to the first adhesive layer, each of the adhesive layers containing a secondary resin component, wherein the first main resin component has a glass transition temperature higher than that of the secondary resin component, and the second main resin component has a glass transition temperature higher than that of the secondary resin component and lower than that of the first main resin component, and a reaction peak temperature of each of the adhesive layers is lower than the glass transition temperature of the first main resin component and higher than the glass transition temperature of the second main resin component, and is a temperature at which a calorific value of the adhesive layer is maximum during temperature rise.
    Type: Application
    Filed: January 19, 2010
    Publication date: May 13, 2010
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Tomoyuki Ishimatsu, Hiroki Ozeki
  • Publication number: 20100096175
    Abstract: An adhesive film, containing a first adhesive layer in which conductive particles are dispersed, and a second adhesive layer adhered to the first adhesive layer, wherein the lowest viscosity of the first adhesive layer attained at or below the curing temperature is higher than that of the second adhesive layer attained at or below the curing temperature, where the curing temperature is a temperature at which the adhesive layer starts to cure, wherein the first and second adhesive layers are respectively disposed to a substrate side and an electronic part side, and the adhesive film is configured to join the electronic part and the substrate by heating and pressurizing the substrate and the electronic part with the adhesive layer being therebetween, and wherein the first adhesive layer has a thickness which is less than two times of an average particle diameter of the conductive particles.
    Type: Application
    Filed: December 23, 2009
    Publication date: April 22, 2010
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Tomoyuki ISHIMATSU, Hiroki Ozeki
  • Publication number: 20100080995
    Abstract: A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.
    Type: Application
    Filed: December 4, 2009
    Publication date: April 1, 2010
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Tomoyuki Ishimatsu, Daisuke Sato, Hiroki Ozeki
  • Publication number: 20090325519
    Abstract: A receiver according to the present invention includes a first receiving (RCV) quality detector and a second RCV quality detector connected before a combining unit. The second RCV quality detector determines a quality of a signal output from at least one of a first receiving unit and a second receiving unit by a method different from that of the first RCV quality detector. A controller allows the receiver to operate in a single receiving mode when a determination result of the second RCV quality detector is not better than a predetermined level regardless of a determination result of a determination result of the first RCV quality detector not being a predetermined level. When the receiver passes in an area where the receiver cannot receive a broadcast signal, the determination result of the second RCV quality detector is not better than the predetermined level. In response, the controller allows the receiver to operate in the single receiving mode, thereby reducing power consumption of the receiver.
    Type: Application
    Filed: December 4, 2007
    Publication date: December 31, 2009
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yasunobu Tsukio, Hiroki Ozeki, Yosuke Wada