Patents by Inventor Hiromi Yajima

Hiromi Yajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7708618
    Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: May 4, 2010
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Hiromi Yajima, Yukio Imoto, Shoichi Kodama, Riichiro Aoki, Takashi Omichi, Toyomi Nishi, Tetsuji Togawa
  • Patent number: 7478347
    Abstract: A semiconductor manufacturing apparatus having a plurality of portions according to this invention includes a storage device which stores, for each portion, information representing the lapsed time of use or the product processing count till occurrence of a failure after installation of the portion, and a calculation device which receives the information stored in the storage device and outputs function information representing a failure probability and/or failure rate as a function of the lapsed time of use or the product processing count for each portion.
    Type: Grant
    Filed: April 17, 2006
    Date of Patent: January 13, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiromi Yajima, Tatsumi Suganuma, Noriaki Yoshikawa, Tadashi Yotsumoto, Kenji Nakata
  • Publication number: 20080166949
    Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
    Type: Application
    Filed: October 31, 2007
    Publication date: July 10, 2008
    Inventors: Hiromi Yajima, Yukio Imoto, Shoichi Kodama, Riichiro Aoki, Takashi Omichi, Toyomi Nishi, Tetsuji Togawa
  • Publication number: 20080090501
    Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
    Type: Application
    Filed: October 31, 2007
    Publication date: April 17, 2008
    Inventors: Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura
  • Patent number: 7198552
    Abstract: A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
    Type: Grant
    Filed: December 6, 2005
    Date of Patent: April 3, 2007
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Toyomi Nishi, Tetsuji Togawa, Harumitsu Saito, Manabu Tsujimura, Hiromi Yajima, Kazuaki Himukai, Shoichi Kodama, Yukio Imoto, Riichiro Aoki, Masako Watase, Atsushi Shigeta, Shiro Mishima, Gisuke Kouno
  • Publication number: 20060190120
    Abstract: A semiconductor manufacturing apparatus having a plurality of portions according to this invention includes a storage device which stores, for each portion, information representing the lapsed time of use or the product processing count till occurrence of a failure after installation of the portion, and a calculation device which receives the information stored in the storage device and outputs function information representing a failure probability and/or failure rate as a function of the lapsed time of use or the product processing count for each portion.
    Type: Application
    Filed: April 17, 2006
    Publication date: August 24, 2006
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Hiromi Yajima, Tatsumi Suganuma, Noriaki Yoshikawa, Tadashi Yotsumoto, Kenji Nakata
  • Patent number: 7065725
    Abstract: A semiconductor manufacturing apparatus having a plurality of portions according to this invention includes a storage device which stores, for each portion, information representing the lapsed time of use or the product processing count till occurrence of a failure after installation of the portion, and a calculation device which receives the information stored in the storage device and outputs function information representing a failure probability and/or failure rate as a function of the lapsed time of use or the product processing count for each portion.
    Type: Grant
    Filed: March 4, 2003
    Date of Patent: June 20, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiromi Yajima, Tatsumi Suganuma, Noriaki Yoshikawa, Tadashi Yotsumoto, Kenji Nakata
  • Publication number: 20060084369
    Abstract: A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
    Type: Application
    Filed: December 6, 2005
    Publication date: April 20, 2006
    Inventors: Toyomi Nishi, Tetsuji Togawa, Harumitsu Saito, Manabu Tsujimura, Hiromi Yajima, Kazuaki Himukai, Shoichi Kodama, Yukio Imoto, Riichiro Aoki, Masako Watase, Atsushi Shigeta, Shiro Mishima, Gisuke Kouno
  • Patent number: 6997782
    Abstract: A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: February 14, 2006
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Toyomi Nishi, Tetsuji Togawa, Harumitsu Saito, Manabu Tsujimura, Hiromi Yajima, Kazuaki Himukai, Shoichi Kodama, Yukio Imoto, Riichiro Aoki, Masako Watase, Atsushi Shigeta, Shiro Mishima, Gisuke Kouno
  • Publication number: 20060009130
    Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
    Type: Application
    Filed: September 9, 2005
    Publication date: January 12, 2006
    Inventors: Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura
  • Patent number: 6966821
    Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
    Type: Grant
    Filed: February 25, 2003
    Date of Patent: November 22, 2005
    Assignees: Kabushiki Kaisha Toshiba, Ebara Corporation
    Inventors: Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura
  • Publication number: 20030171836
    Abstract: A semiconductor manufacturing apparatus having a plurality of portions according to this invention includes a storage device which stores, for each portion, information representing the lapsed time of use or the product processing count till occurrence of a failure after installation of the portion, and a calculation device which receives the information stored in the storage device and outputs function information representing a failure probability and/or failure rate as a function of the lapsed time of use or the product processing count for each portion.
    Type: Application
    Filed: March 4, 2003
    Publication date: September 11, 2003
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Hiromi Yajima, Tatsumi Suganuma, Noriaki Yoshikawa, Tadashi Yotsumoto, Kenji Nakata
  • Publication number: 20030148714
    Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
    Type: Application
    Filed: February 25, 2003
    Publication date: August 7, 2003
    Inventors: Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura
  • Patent number: 6595220
    Abstract: An apparatus for conveying a workpiece as used to convey the workpiece such as a semiconductor wafer, a glass substrate or liquid crystal panel, between processing apparatuses when the workpiece is processed in the plurality of processing apparatuses. The amount of liquid on a surface of a workpiece is adjusted to a predetermined amount, and the workpiece, which retains the predetermined amount of liquid, is conveyed between processes. The adjusting includes both supplying a sufficient amount of liquid onto the surface of the workpiece, which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.
    Type: Grant
    Filed: March 5, 2001
    Date of Patent: July 22, 2003
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Toshiro Maekawa, Satomi Hamada, Riichiro Aoki, Shoichi Kodama, Hiromi Yajima
  • Patent number: 6547638
    Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: April 15, 2003
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura
  • Publication number: 20030040261
    Abstract: A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
    Type: Application
    Filed: September 27, 2002
    Publication date: February 27, 2003
    Inventors: Toyomi Nishi, Tetsuji Togawa, Harumitsu Saito, Manabu Tsujimura, Hiromi Yajima, Kazuaki Himukai, Shoichi Kodama, Yukio Imoto, Riichiro Aoki, Masako Watase, Atsushi Shigeta, Shiro Mishima, Gisuke Kouno
  • Patent number: 6500051
    Abstract: A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
    Type: Grant
    Filed: June 27, 1997
    Date of Patent: December 31, 2002
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Toyomi Nishi, Tetsuji Togawa, Harumitsu Saito, Manabu Tsujimura, Hiromi Yajima, Kazuaki Himukai, Shoichi Kodama, Yukio Imoto, Riichiro Aoki, Masako Watase, Atsushi Shigeta, Shiro Mishima, Gisuke Kouno
  • Patent number: 6443808
    Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: September 3, 2002
    Assignees: Kabushiki Kaisha Toshiba, Ebara Corporation
    Inventors: Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura
  • Patent number: 6439971
    Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: August 27, 2002
    Assignees: Kabushiki Kaisha Toshiba, Ebara Corporation
    Inventors: Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura
  • Patent number: 6425806
    Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: July 30, 2002
    Assignees: Kabushiki Kaisha Toshiba, Ebara Corporation
    Inventors: Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura