Abstract: Provided are a bubble ejection method based on a novel principle, a power supply device used for performing the bubble ejection method, and a bubble ejecting apparatus. A bubble can be ejected by a bubble ejection method for bubble ejection into a conductor, the bubble ejection method includes steps of: contacting a bubble generating electrode to a conductor; contacting a counter electrode to the conductor or a processing target; and applying a negative voltage to the bubble generating electrode, and a conductive material is exposed on at least a tip part of the bubble generating electrode.

Abstract: A garment case a is capable of accommodating clothes, and is provided with a foldable main body. A roll bar is attached inside the main body, is disposed in a position in which the main body is folded, and extends in a direction in which a folded part extends when clothes have been accommodated in the garment case.

Abstract: An optical member related to the present application includes a metal substrate or inorganic carbon substrate having a rough surface on at least a part, and the metal substrate or inorganic carbon substrate does not melt at a growth temperature of a carbon nanostructure, an inorganic material layer containing inorganic fine particles comprised from a metal oxide and the inorganic material layer being formed on the rough surface of the metal substrate or the inorganic carbon substrate; a catalyst metal fine particle layer supported on the inorganic material layer; and a carbon nanostructure formed on the catalyst metal fine particle layer. The material of the metal substrate may be a metal selected from a group comprising of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Pd, Pt, Cu, Au and Ag or an alloy of these as a main component, an isotropic graphite or glassy carbon.

Abstract: A print production system includes an order-receiving server and a printing management server. The order-receiving server transmits an electronic operation manual including ordering information to the printing management server. The printing management server classifies a plurality of items for identifying content of a print job to be carried out into specifiable items that can be specified uniquely according to the electronic operation manual, and unspecifiable items that cannot be specified uniquely according to the electronic operation manual. The printing management server also generates job information by determining content of one or more unspecifiable items according to guidelines, and stores the job information in association with a management identifier of the print job.

Abstract: A semiconductor device includes a first bump that is located over a surface of a semiconductor element, and is formed on a first bump formation face distanced from a back surface of the semiconductor element at a first distance, and a second bump that is located over the surface of the semiconductor element, and is formed on a second bump formation face distanced from the back surface of the semiconductor element at a second distance being longer than the first distance, the second bump having a diameter larger than a diameter of the first bump.

Abstract: A print production system includes an order-receiving server and a printing management server. The order-receiving server transmits an electronic operation manual including ordering information to the printing management server. The printing management server classifies a plurality of items for identifying content of a print job to be carried out into specifiable items that can be specified uniquely according to the electronic operation manual, and unspecifiable items that cannot be specified uniquely according to the electronic operation manual. The printing management server also generates job information by determining content of one or more unspecifiable items according to guidelines, and stores the job information in association with a management identifier of the print job.

Abstract: At least two types of variable layers and at least one type of fixed layer are designated from among three or more types of layers. The same number of layer clusters, which are made up of a plurality of pages, as the number of types of variable layers are defined by adding the variable layers to the designated at least one type of fixed layer.

Abstract: A semiconductor device includes a first bump that is located over a surface of a semiconductor element, and is formed on a first bump formation face distanced from a back surface of the semiconductor element at a first distance, and a second bump that is located over the surface of the semiconductor element, and is formed on a second bump formation face distanced from the back surface of the semiconductor element at a second distance being longer than the first distance, the second bump having a diameter larger than a diameter of the first bump.

Abstract: This invention enables an intention of a photographer to be reflected with greater accuracy in image processing based on actions performed by the photographer when taking an image. Based on user information acquired by a user information acquisition section, supplementary information such as whether a composition flag is on or off and assignment of an image classification is recorded with an image. Based on the supplementary information, various types of image processing such as setting an image trimming range, imparting an effect, and arranging an image on a mount are performed.

Abstract: A semiconductor device includes a first bump that is located over a surface of a semiconductor element, and is formed on a first bump formation face distanced from a back surface of the semiconductor element at a first distance, and a second bump that is located over the surface of the semiconductor element, and is formed on a second bump formation face distanced from the back surface of the semiconductor element at a second distance being longer than the first distance, the second bump having a diameter larger than a diameter of the first bump.

Abstract: This invention enables an intention of a photographer to be reflected with greater accuracy in image processing based on actions performed by the photographer when taking an image. Based on user information acquired by a user information acquisition section, supplementary information such as whether a composition flag is on or off and assignment of an image classification is recorded with an image. Based on the supplementary information, various types of image processing such as setting an image trimming range, imparting an effect, and arranging an image on a mount are performed.

Abstract: In order to suppress the occurrence of damage on a press-fit joining wiring board, a peak value of stress generated on the board in the case of a press-fitting a press-fit terminal into a through-hole is reduced so that it can not exceed the design standard value of the board. In the press-fit terminal in which a body part, retaining part, introducing part and forward end part are integrally formed, a cross-sectional area of the introducing part is reduced to be smaller than that of the retaining part, so that an intensity of the elastic force of the introducing part is decreased to be lower than that of the elastic force of the retaining part. Alternatively, on the wiring board, elastic material is filled into resin for combining sheet-like base material of the board so as to relieve an intensity of stress generated on the board itself.

Abstract: A semiconductor chip is provided with a high-frequency circuit. A multi-layer wiring section is comprised of organic material and formed on the semiconductor chip, an outermost layer of the multi-layer wiring section formed with a bump forming portion. A bump is formed on the bump forming portion. The multi-layer wiring section is provided with a reinforcing means for suppressing a deformation of a bonding portion between the bump and the bump forming portion when the high-frequency circuit device is bonded to a substrate with an ultrasonic vibration applied thereto.

Abstract: The present invention provides a method for measuring thermophysical properties that includes: rapid resistive self-heating of a specimen by using a heating current; emitting a light to the specimen heated by the rapid resistive self-heating of the specimen; measuring a temperature change of the specimen induced by emitting the light to the specimen; and deriving a thermal diffusivity of the specimen from the temperature change induced by emitting the light to the specimen.

Abstract: A connector fixing structure includes a substrate, a connector, and a housing. The substrate defines a first hole portion and a second hole portion. The connector includes a terminal of a pressfit shape that is inserted into the first holed portion to connect with the substrate electrically, and a housing having a leg portion of a press fit shape that is inserted into the second hole portion when the terminal is inserted into the first hole portion.

Abstract: Positive charges of a sensor element are stored in a capacitor for converting a voltage, are converted into a positive voltage by an amplifier, and then are outputted. When the polarity of the charges of the sensor element are inverted to be negative, the charges inversely flow from the capacitor for converting the voltage and feed back to an equivalent capacitor of the sensor element. The output of the amplifier reduces and returns to a zero-point. An automatic correcting circuit makes an FET conductive and the charges are discharged in order to prevent the fluctuation of the zero-point level due to the negative drift.

Abstract: An electronic control device enabling heat generated by a power module to be favorably radiated even in a high-temperature condition in an engine compartment. The unit includes a casing accommodating a control circuit substrate; a die-cast mounting plate forming a control circuit substrate support portion, a frame-like fitting member and an external mounting portion integrally together; and a metal substrate on which a power module is adhered. When the mounting plate is mounted on the wall of a transmission and the metal substrate is fitted in the opening in the bottom surface of the frame-like fitting member, a mounting surface in nearly the same plane is formed by the lower surface of the mounting plate and by the lower surface of the metal substrate permitting heat from the power module to be radiated to the wall.

Abstract: A pressfit terminal is to be inserted into a through hole defined in a substrate for electrically contacting with the through hole. The pressfit terminal includes a terminal main body and at least three protrusion portions. The at least three protrusion portions protrude outwardly from a surface of the terminal main body. At least part of the protrusion portions are arranged at intervals in a direction intersecting with an insertion direction of the terminal main body.

Abstract: The present invention concerns a substrate for circuit wiring in which an electronic component is mounted, by soldering, to a wiring pattern formed on an insulated layer deposited over a metallic substrate. A silica-based filler and a rubber-based filler are added in the insulated layer to reduce the linear thermal expansion of the layer and increase its elastic modulus. The mounting portion of an electronic component is molded with a resin material to which a silica-based filler has been added, and which thus has a coefficient of linear thermal expansion smaller than the coefficient of linear thermal expansion of the insulated layer. This serves to alleviate the stress caused by the linear thermal expansion of the metallic substrate, and thereby to prevent separation from occurring between the insulated layer and the metallic substrate, as well as between the insulated layer and the wiring pattern, when subjected to a high-temperature environment.

Abstract: A combustion-pressure-data acquisition system of a multi-cylinder engine according to the present invention includes an in-cylinder pressure sensor CPS#n for directly detecting combustion pressure in each cylinder; an amplifier unit AP#n to which the in-cylinder pressure sensor CPS#n for each cylinder is connected; and a channel switching unit MUX to which the amplifier unit AP#n for each cylinder is connected. It selects a system to be measured from among a plurality of systems of signals from the amplifier units AP#n with a channel selection signal outputted from an engine-controlling electronic control unit and outputs combustion pressure data to the ECU. Further, it outputs to an amplifier unit AP#n with which measurement ends a reset signal for discharging the electric charge between the in-cylinder pressure sensor CPS#n and the amplifier circuit to efficiently acquire combustion pressure data of each cylinder with a simple structure without complicated processing.