Patents by Inventor Hiromitsu Maruyama

Hiromitsu Maruyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220367234
    Abstract: A dicing die attach film including a dicing film and a die attach film laminated on the dicing film, in which the die attach film has an arithmetic average roughness Ra1 of from 0.05 to 2.50 ?m at a surface in contact with the dicing film, and a value of ratio of Ra1 to an arithmetic average roughness Ra2 at a surface that is of the die attach film and is opposite to the surface in contact with the dicing film is from 1.05 to 28.00.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 17, 2022
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yota OTANI, Hiromitsu MARUYAMA, Minoru MORITA
  • Publication number: 20220310547
    Abstract: A dicing die attach film containing a dicing film and a die attach film stacked on the dicing film, wherein the die attach film contains an organic solvent having a boiling point of 100° C. or more and less than 150° C. and a vapor pressure of 50 mmHg or less, and wherein an amount of the organic solvent in the die attach film satisfies the following (a): (a) when 1.0 g of the die attach film is immersed in 10.0 mL of acetone at 4° C. for 24 hours, an amount of the organic solvent extracted into the acetone is 800 ?g or less.
    Type: Application
    Filed: May 27, 2022
    Publication date: September 29, 2022
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Minoru MORITA, Yota OTANI, Hiromitsu MARUYAMA
  • Patent number: 9631123
    Abstract: The adhesive sheet wound into a roll includes: a long release film; an adhesive layer provided in a label form on the release film; and a pressure-sensitive adhesive film having a label part covering the adhesive layer and provided so as to be in contact with the release film around the adhesive layer and a peripheral part surrounding an outside of the label part, wherein a through hole penetrating the pressure-sensitive adhesive film is provided outside a portion corresponding to a part of the adhesive layer intended to be attached to an adherend and inside the label part, and wherein outer circumference of the adhesive layer× 1/43?maximum width of the through hole×number of the through holes per label part of the pressure-sensitive adhesive film?outer circumference of the adhesive layer is satisfied.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: April 25, 2017
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masami Aoyama, Hiromitsu Maruyama
  • Patent number: 9523023
    Abstract: An adhesive sheet 10 wound into a roll includes: a long release film 11; an adhesive layer 12 provided in a label form on the release film 11; and a pressure-sensitive adhesive film 13 having a label part 13a covering the adhesive layer 12 and provided so as to be in contact with the release film 11 around the adhesive layer 12 and a peripheral part 13b surrounding an outside of the label part 13a, wherein a through hole 14 penetrating the release film 11 is provided in a place including a portion corresponding to an outside of a part 15 of the adhesive layer 12 intended to be attached to an adherend and an inside of the label part 13a.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: December 20, 2016
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masami Aoyama, Hiromitsu Maruyama
  • Patent number: 9324592
    Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.
    Type: Grant
    Filed: July 16, 2008
    Date of Patent: April 26, 2016
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hiromitsu Maruyama, Shuzo Taguchi, Noboru Sakuma, Yasumasa Morishima, Shinichi Ishiwata
  • Patent number: 9324593
    Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.
    Type: Grant
    Filed: January 3, 2012
    Date of Patent: April 26, 2016
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hiromitsu Maruyama, Noboru Sakuma, Yasumasa Morishima, Shinichi Ishiwata
  • Publication number: 20150017374
    Abstract: An adhesive sheet 10 wound into a roll includes: a long release film 11; an adhesive layer 12 provided in a label form on the release film 11; and a pressure-sensitive adhesive film 13 having a label part 13a covering the adhesive layer 12 and provided so as to be in contact with the release film 11 around the adhesive layer 12 and a peripheral part 13b surrounding an outside of the label part 13a, wherein a through hole 14 penetrating the release film 11 is provided in a place including a portion corresponding to an outside of a part 15 of the adhesive layer 12 intended to be attached to an adherend and an inside of the label part 13a.
    Type: Application
    Filed: October 2, 2014
    Publication date: January 15, 2015
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masami AOYAMA, Hiromitsu MARUYAMA
  • Publication number: 20150017373
    Abstract: The adhesive sheet 10 wound into a roll includes: a long release film 11; an adhesive layer 12 provided in a label form on the release film 11; and a pressure-sensitive adhesive film 13 having a label part 13a covering the adhesive layer 12 and provided so as to be in contact with the release film 11 around the adhesive layer 12 and a peripheral part 13b surrounding an outside of the label part 13a, wherein a through hole 14 penetrating the pressure-sensitive adhesive film 12 is provided in a place that is outside a portion corresponding to a part c of the adhesive layer 12 intended to be attached to an adherend and inside the label part 13a and that includes a part R of the pressure-sensitive adhesive film 13 intended to be attached to an adherend.
    Type: Application
    Filed: October 2, 2014
    Publication date: January 15, 2015
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masami AOYAMA, Hiromitsu Maruyama
  • Publication number: 20150017375
    Abstract: The adhesive sheet wound into a roll includes: a long release film; an adhesive layer provided in a label form on the release film; and a pressure-sensitive adhesive film having a label part covering the adhesive layer and provided so as to be in contact with the release film around the adhesive layer and a peripheral part surrounding an outside of the label part, wherein a through hole penetrating the pressure-sensitive adhesive film is provided outside a portion corresponding to a part of the adhesive layer intended to be attached to an adherend and inside the label part, and wherein outer circumference of the adhesive layer×1/43?maximum width of the through hole×number of the through holes per label part of the pressure-sensitive adhesive film?outer circumference of the adhesive layer is satisfied.
    Type: Application
    Filed: October 2, 2014
    Publication date: January 15, 2015
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masami AOYAMA, Hiromitsu Maruyama
  • Publication number: 20120100325
    Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.
    Type: Application
    Filed: January 3, 2012
    Publication date: April 26, 2012
    Inventors: Hiromitsu MARUYAMA, Noboru Sakuma, Yasumasa Morishima, Shinichi Ishiwata
  • Publication number: 20100227165
    Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.
    Type: Application
    Filed: July 16, 2008
    Publication date: September 9, 2010
    Inventors: Hiromitsu Maruyama, Shuzo Taguchi, Noboru Sakuma, Yasumasa Morishima, Shinichi Ishiwata
  • Patent number: D621803
    Type: Grant
    Filed: July 16, 2008
    Date of Patent: August 17, 2010
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Hiromitsu Maruyama, Shuzo Taguchi, Yasumasa Morishima, Shinichi Ishiwata
  • Patent number: D628170
    Type: Grant
    Filed: July 16, 2008
    Date of Patent: November 30, 2010
    Assignee: The Furukawa Electric Company
    Inventors: Hiromitsu Maruyama, Shuzo Taguchi, Yasumasa Morishima, Shinichi Ishiwata