Patents by Inventor Hiromoto Haruta

Hiromoto Haruta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11229116
    Abstract: A board assembly sheet includes a plurality of mounting boards each for mounting an electronic component. The mounting boards are defined in the board assembly sheet. The mounting board has a total thickness of 60 ?m or less. The board assembly sheet has a through hole passing through the board assembly sheet in a thickness direction. The through hole is formed to be along an end edge of the mounting board or along a phantom line extending along the end edge.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: January 18, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Hiromoto Haruta, Shuichi Wakaki
  • Patent number: 11072691
    Abstract: The present invention aims to provide a method for producing a porous gel-containing liquid that is inexpensive and excellent in homogeneity. The porous gel-containing liquid production method according to the present invention is a method including: a pulverization step of pulverizing a gel of a porous body, wherein the pulverization step is carried out as multi-stage pulverization including a plurality of pulverization stages.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: July 27, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Seong Jin Ryu, Hiromoto Haruta
  • Patent number: 11056921
    Abstract: A wireless power transmission system includes a power transmission device including a plurality of power transmission portions, and a power receiving object including a power receiving portion capable of receiving an electric power wirelessly transmitted from the power transmission portion. Of the plurality of power transmission portions, a specific power transmission portion transmits the electric power to the power receiving portion.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: July 6, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hisashi Tsuda, Masami Inoue, Taiki Sueyoshi, Hajime Nishio, Hiroshi Yamazaki, Hiromoto Haruta
  • Publication number: 20210204398
    Abstract: A wiring circuit board includes an insulating layer, a wire embedded in the insulating layer, and an alignment mark electrically independent from the wire and disposed in the insulating layer so as to allow a one-side surface in a thickness direction of the alignment mark to be exposed from the insulating layer. A peripheral portion of the alignment mark consists of only the insulating layer and has a thickness of 30 ?m or less.
    Type: Application
    Filed: October 12, 2018
    Publication date: July 1, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Takahiro TAKANO, Hiromoto HARUTA, Shuichi WAKAKI
  • Patent number: 10815355
    Abstract: The present invention provides, for example, a silicone porous body having a porous structure with less cracks and a high proportion of void space as well as having a strength. The silicone porous body of the present invention includes silicon compound microporous particles, wherein the silicon compound microporous particles are chemically bonded by catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The silicone porous body can be produced, for example, by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products, for example.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: October 27, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hiromoto Haruta, Kozo Nakamura, Kazuki Uwada, Hiroyuki Takemoto, Nao Murakami, Daisuke Hattori
  • Publication number: 20200329560
    Abstract: A board assembly sheet includes a plurality of mounting boards each for mounting an electronic component. The mounting boards are defined in the board assembly sheet. The mounting board has a total thickness of 60 ?m or less. The board assembly sheet has a through hole passing through the board assembly sheet in a thickness direction. The through hole is formed to be along an end edge of the mounting board or along a phantom line extending along the end edge.
    Type: Application
    Filed: October 2, 2018
    Publication date: October 15, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Hiromoto HARUTA, Shuichi WAKAKI
  • Publication number: 20200280218
    Abstract: A wireless power transmission system includes a power transmission device including a plurality of power transmission portions, and a power receiving object including a power receiving portion capable of receiving an electric power wirelessly transmitted from the power transmission portion. Of the plurality of power transmission portions, a specific power transmission portion transmits the electric power to the power receiving portion.
    Type: Application
    Filed: September 11, 2018
    Publication date: September 3, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hisashi TSUDA, Masami INOUE, Taiki SUEYOSHI, Hajime NISHIO, Hiroshi YAMAZAKI, Hiromoto HARUTA
  • Patent number: 10494546
    Abstract: The present invention provides a coating material that allows a structure with void spaces having a strength and flexibility to be formed. The coating material of the present invention includes: pulverized products of a gelled silicon compound obtained from a silicon compound containing at least three or less functional groups having saturated bonds; and a dispersion medium, wherein the pulverized product contains a residual silanol group. The method of producing a coating material according to the present invention includes steps of: causing gelation of a silicon compound containing at least three or less functional groups having saturated bonds and mixing the gelled silicon compound and a dispersion medium. According to the coating material of the present invention, for example, a coating film is formed by coating a base with the coating material and a porous structure is formed by chemically bonding the pulverized products contained in the coating film.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: December 3, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hiromoto Haruta, Hiroyuki Takemoto, Daisuke Hattori, Kozo Nakamura
  • Patent number: 10472483
    Abstract: The present invention provides, for example, a silicone porous body having a porous structure with less cracks and a high proportion of void space as well as having a strength. The silicone porous body of the present invention includes silicon compound microporous particles, wherein the silicon compound microporous particles are chemically bonded by catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The silicone porous body can be produced, for example, by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products, for example.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: November 12, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hiromoto Haruta, Kozo Nakamura, Kazuki Uwada, Hiroyuki Takemoto, Nao Murakami, Daisuke Hattori
  • Publication number: 20190330438
    Abstract: The present invention provides, for example, a silicone porous body having a porous structure with less cracks and a high proportion of void space as well as having a strength. The silicone porous body of the present invention includes silicon compound microporous particles, wherein the silicon compound microporous particles are chemically bonded by catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The silicone porous body can be produced, for example, by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products, for example.
    Type: Application
    Filed: July 3, 2019
    Publication date: October 31, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hiromoto Haruta, Kozo Nakamura, Kazuki Uwada, Hiroyuki Takemoto, Nao Murakami, Daisuke Hattori
  • Patent number: 10435531
    Abstract: The present invention provides, for example, a silicone porous body having a porous structure with less cracks and a high proportion of void space as well as having a strength. The silicone porous body of the present invention includes silicon compound microporous particles, wherein the silicon compound microporous particles are chemically bonded by catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The silicone porous body can be produced, for example, by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products, for example.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: October 8, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hiromoto Haruta, Kozo Nakamura, Kazuki Uwada, Hiroyuki Takemoto, Nao Murakami, Daisuke Hattori
  • Patent number: 10385179
    Abstract: The present invention provides, for example, a silicone porous body having a porous structure with less cracks and a high proportion of void space as well as having a strength. The silicone porous body of the present invention includes silicon compound microporous particles, wherein the silicon compound microporous particles are chemically bonded by catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The silicone porous body can be produced, for example, by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products, for example.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: August 20, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hiromoto Haruta, Kozo Nakamura, Kazuki Uwada, Hiroyuki Takemoto, Nao Murakami, Daisuke Hattori
  • Publication number: 20190040223
    Abstract: The present invention aims to provide a method for producing a porous gel-containing liquid that is inexpensive and excellent in homogeneity. The porous gel-containing liquid production method according to the present invention is a method including: a pulverization step of pulverizing a gel of a porous body, wherein the pulverization step is carried out as multi-stage pulverization including a plurality of pulverization stages.
    Type: Application
    Filed: September 27, 2016
    Publication date: February 7, 2019
    Applicant: Nitto Denko Corporation
    Inventors: Seong Jin Ryu, Hiromoto Haruta
  • Publication number: 20180223061
    Abstract: The present invention is intended to provide a laminated film including a void-provided layer achieving both a high proportion of void space and a high film strength. The laminated film of the present invention includes a void-provided layer 21 and a resin film 10, the void-provided layer 21 being stacked on the resin film 10. The laminated film is produced by a production method, including steps of forming a void-provided structure 20?, which is a precursor of the void-provided layer 21 on the resin film; and causing a crosslinking reaction in the precursor 20? after the precursor forming step. The precursor 20? contains a substance that generates a basic substance by light irradiation or heating, the basic substance is not generated in the precursor forming step, the basic substance is generated by light irradiation or heating in the crosslinking reaction step, and the crosslinking reaction step has multiple stages.
    Type: Application
    Filed: July 29, 2016
    Publication date: August 9, 2018
    Applicant: Nitto Denko Corporation
    Inventors: Daisuke Hattori, Hiromoto Haruta, Kozo Nakamura, Hiroyuki Takemoto
  • Publication number: 20180224580
    Abstract: The present invention is intended to provide an optical laminate that achieves a superior film strength and a property that a void-provided layer and a pressure-sensitive adhesive/adhesive layer are not easily peeled from each other. The optical laminate of the present invention includes: a void-provided layer; an intermediate layer; and a pressure-sensitive adhesive/adhesive layer, wherein the void-provided layer, the intermediate layer, and the pressure-sensitive adhesive/adhesive layer are stacked in this order, and the intermediate layer is formed by forming the pressure-sensitive adhesive/adhesive layer on the void-provided layer.
    Type: Application
    Filed: July 29, 2016
    Publication date: August 9, 2018
    Applicant: NITTO DENKO CORPORATION
    Inventors: Daisuke Hattori, Hiromoto Haruta, Kozo Nakamura, Hiroyuki Takemoto
  • Publication number: 20180002508
    Abstract: A film is provided with void spaces having a porous structure with less cracks and a high proportion of void space as well as having strength. The film with void spaces includes one kind or two or more kinds of structural units that form a structure with minute void spaces, wherein the structural units are chemically bonded through catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The film with void spaces can be produced by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products.
    Type: Application
    Filed: December 25, 2015
    Publication date: January 4, 2018
    Applicant: NITTO DENKO CORPORATION
    Inventors: Daisuke Hattori, Hiromoto Haruta, Kozo Nakamura, Kazuki Uwada, Hiroyuki Takemoto, Nao Murakami
  • Publication number: 20170349784
    Abstract: The present invention provides a coating material that allows a structure with void spaces having a strength and flexibility to be formed. The coating material of the present invention includes: pulverized products of a gelled silicon compound obtained from a silicon compound containing at least three or less functional groups having saturated bonds; and a dispersion medium, wherein the pulverized product contains a residual silanol group. The method of producing a coating material according to the present invention includes steps of: causing gelation of a silicon compound containing at least three or less functional groups having saturated bonds and mixing the gelled silicon compound and a dispersion medium. According to the coating material of the present invention, for example, a coating film is formed by coating a base with the coating material and a porous structure is formed by chemically bonding the pulverized products contained in the coating film.
    Type: Application
    Filed: December 25, 2015
    Publication date: December 7, 2017
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hiromoto Haruta, Hiroyuki Takemoto, Daisuke Hattori, Kozo Nakamura
  • Publication number: 20170342232
    Abstract: The present invention provides, for example, a silicone porous body having a porous structure with less cracks and a high proportion of void space as well as having a strength. The silicone porous body of the present invention includes silicon compound microporous particles, wherein the silicon compound microporous particles are chemically bonded by catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The silicone porous body can be produced, for example, by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products, for example.
    Type: Application
    Filed: December 25, 2015
    Publication date: November 30, 2017
    Applicant: Nitto Denko Corporation
    Inventors: Hiromoto Haruta, Kozo Nakamura, Kazuki Uwada, Hiroyuki Takemoto, Nao Murakami, Daisuke Hattori
  • Publication number: 20170341336
    Abstract: The present invention provides a new member having a low refractive index as a substitute for an air layer, for example. The laminated film roll of the present invention includes a long laminated film roll including: an ultra-low refractive index layer having a refractive index of 1.20 or less; and a resin film, wherein the ultra-low refractive index layer is stacked on the resin film. The method of forming the long laminated film roll of the present invention includes steps of: preparing a liquid containing microporous particles; coating a resin film with the liquid; and drying the liquid applied on the resin film, for example.
    Type: Application
    Filed: December 25, 2015
    Publication date: November 30, 2017
    Applicant: Nitto Denko Corporation
    Inventors: Hiromoto HARUTA, Hiroyuki TAKEMOTO, Daisuke HATTORI, Kozo NAKAMURA
  • Patent number: 9321247
    Abstract: A transparent film, the back-face of which has excellent resistance to scratch and printability, and a surface protection film which has such a transparent film are provided. A transparent film 10 has a substrate layer 12 formed of a transparent resin material, and a back-face layer 14 with a thickness of 1 ?m or less provided on a first face 12A thereof. A percent change in coefficient of friction ?? is less than 10% for the transparent film 10 when the percent change is determined from a coefficient of friction ?50 of the back-face layer after being conserved at 50° C. and 15% RH for three days and a coefficient of friction ?80 of the back-face layer after being conserved at 80° C. and 80% RH for three days, with an absolute value of difference between the two coefficients of friction |?80??50| being divided by the smaller value of the two coefficients of friction.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: April 26, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hiromoto Haruta, Hirokazu Matsuda, Tsuyoshi Inoue, Kazuhito Okumura, Osamu Kondo, Yoko Muraoka