Patents by Inventor Hiromoto Haruta
Hiromoto Haruta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11674004Abstract: The present invention is intended to provide a laminated film including a void-provided layer achieving both a high proportion of void space and a high film strength. The laminated film of the present invention includes a void-provided layer 21 and a resin film 10, the void-provided layer 21 being stacked on the resin film 10. The laminated film is produced by a production method, including steps of forming a void-provided structure 20?, which is a precursor of the void-provided layer 21 on the resin film; and causing a crosslinking reaction in the precursor 20? after the precursor forming step. The precursor 20? contains a substance that generates a basic substance by light irradiation or heating, the basic substance is not generated in the precursor forming step, the basic substance is generated by light irradiation or heating in the crosslinking reaction step, and the crosslinking reaction step has multiple stages.Type: GrantFiled: July 29, 2016Date of Patent: June 13, 2023Assignee: NITTO DENKO CORPORATIONInventors: Daisuke Hattori, Hiromoto Haruta, Kozo Nakamura, Hiroyuki Takemoto
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Patent number: 11618807Abstract: A film is provided with void spaces having a porous structure with less cracks and a high proportion of void space as well as having strength. The film with void spaces includes one kind or two or more kinds of structural units that form a structure with minute void spaces, wherein the structural units are chemically bonded through catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The film with void spaces can be produced by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products.Type: GrantFiled: December 25, 2015Date of Patent: April 4, 2023Assignee: NITTO DENKO CORPORATIONInventors: Daisuke Hattori, Hiromoto Haruta, Kozo Nakamura, Kazuki Uwada, Hiroyuki Takemoto, Nao Murakami
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Patent number: 11505667Abstract: The present invention provides a new member having a low refractive index as a substitute for an air layer, for example. The laminated film roll of the present invention includes a long laminated film roll including: an ultra-low refractive index layer having a refractive index of 1.20 or less; and a resin film, wherein the ultra-low refractive index layer is stacked on the resin film. The method of forming the long laminated film roll of the present invention includes steps of: preparing a liquid containing microporous particles; coating a resin film with the liquid; and drying the liquid applied on the resin film, for example.Type: GrantFiled: December 25, 2015Date of Patent: November 22, 2022Assignee: NITTO DENKO CORPORATIONInventors: Hiromoto Haruta, Hiroyuki Takemoto, Daisuke Hattori, Kozo Nakamura
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Patent number: 11460610Abstract: The present invention is intended to provide an optical laminate that achieves a superior film strength and a property that a void-provided layer and a pressure-sensitive adhesive/adhesive layer are not easily peeled from each other. The optical laminate of the present invention includes: a void-provided layer; an intermediate layer; and a pressure-sensitive adhesive/adhesive layer, wherein the void-provided layer, the intermediate layer, and the pressure-sensitive adhesive/adhesive layer are stacked in this order, and the intermediate layer is formed by forming the pressure-sensitive adhesive/adhesive layer on the void-provided layer.Type: GrantFiled: July 29, 2016Date of Patent: October 4, 2022Assignee: NITTO DENKO CORPORATIONInventors: Daisuke Hattori, Hiromoto Haruta, Kozo Nakamura, Hiroyuki Takemoto
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Patent number: 11337302Abstract: A wiring circuit board includes an insulating layer, a wire embedded in the insulating layer, and an alignment mark electrically independent from the wire and disposed in the insulating layer so as to allow a one-side surface in a thickness direction of the alignment mark to be exposed from the insulating layer. A peripheral portion of the alignment mark consists of only the insulating layer and has a thickness of 30 ?m or less.Type: GrantFiled: October 12, 2018Date of Patent: May 17, 2022Assignee: NITTO DENKO CORPORATIONInventors: Shusaku Shibata, Takahiro Takano, Hiromoto Haruta, Shuichi Wakaki
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Patent number: 11229116Abstract: A board assembly sheet includes a plurality of mounting boards each for mounting an electronic component. The mounting boards are defined in the board assembly sheet. The mounting board has a total thickness of 60 ?m or less. The board assembly sheet has a through hole passing through the board assembly sheet in a thickness direction. The through hole is formed to be along an end edge of the mounting board or along a phantom line extending along the end edge.Type: GrantFiled: October 2, 2018Date of Patent: January 18, 2022Assignee: NITTO DENKO CORPORATIONInventors: Shusaku Shibata, Hiromoto Haruta, Shuichi Wakaki
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Patent number: 11072691Abstract: The present invention aims to provide a method for producing a porous gel-containing liquid that is inexpensive and excellent in homogeneity. The porous gel-containing liquid production method according to the present invention is a method including: a pulverization step of pulverizing a gel of a porous body, wherein the pulverization step is carried out as multi-stage pulverization including a plurality of pulverization stages.Type: GrantFiled: September 27, 2016Date of Patent: July 27, 2021Assignee: NITTO DENKO CORPORATIONInventors: Seong Jin Ryu, Hiromoto Haruta
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Patent number: 11056921Abstract: A wireless power transmission system includes a power transmission device including a plurality of power transmission portions, and a power receiving object including a power receiving portion capable of receiving an electric power wirelessly transmitted from the power transmission portion. Of the plurality of power transmission portions, a specific power transmission portion transmits the electric power to the power receiving portion.Type: GrantFiled: September 11, 2018Date of Patent: July 6, 2021Assignee: NITTO DENKO CORPORATIONInventors: Hisashi Tsuda, Masami Inoue, Taiki Sueyoshi, Hajime Nishio, Hiroshi Yamazaki, Hiromoto Haruta
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Publication number: 20210204398Abstract: A wiring circuit board includes an insulating layer, a wire embedded in the insulating layer, and an alignment mark electrically independent from the wire and disposed in the insulating layer so as to allow a one-side surface in a thickness direction of the alignment mark to be exposed from the insulating layer. A peripheral portion of the alignment mark consists of only the insulating layer and has a thickness of 30 ?m or less.Type: ApplicationFiled: October 12, 2018Publication date: July 1, 2021Applicant: NITTO DENKO CORPORATIONInventors: Shusaku SHIBATA, Takahiro TAKANO, Hiromoto HARUTA, Shuichi WAKAKI
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Patent number: 10815355Abstract: The present invention provides, for example, a silicone porous body having a porous structure with less cracks and a high proportion of void space as well as having a strength. The silicone porous body of the present invention includes silicon compound microporous particles, wherein the silicon compound microporous particles are chemically bonded by catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The silicone porous body can be produced, for example, by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products, for example.Type: GrantFiled: July 3, 2019Date of Patent: October 27, 2020Assignee: NITTO DENKO CORPORATIONInventors: Hiromoto Haruta, Kozo Nakamura, Kazuki Uwada, Hiroyuki Takemoto, Nao Murakami, Daisuke Hattori
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Publication number: 20200329560Abstract: A board assembly sheet includes a plurality of mounting boards each for mounting an electronic component. The mounting boards are defined in the board assembly sheet. The mounting board has a total thickness of 60 ?m or less. The board assembly sheet has a through hole passing through the board assembly sheet in a thickness direction. The through hole is formed to be along an end edge of the mounting board or along a phantom line extending along the end edge.Type: ApplicationFiled: October 2, 2018Publication date: October 15, 2020Applicant: NITTO DENKO CORPORATIONInventors: Shusaku SHIBATA, Hiromoto HARUTA, Shuichi WAKAKI
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Publication number: 20200280218Abstract: A wireless power transmission system includes a power transmission device including a plurality of power transmission portions, and a power receiving object including a power receiving portion capable of receiving an electric power wirelessly transmitted from the power transmission portion. Of the plurality of power transmission portions, a specific power transmission portion transmits the electric power to the power receiving portion.Type: ApplicationFiled: September 11, 2018Publication date: September 3, 2020Applicant: NITTO DENKO CORPORATIONInventors: Hisashi TSUDA, Masami INOUE, Taiki SUEYOSHI, Hajime NISHIO, Hiroshi YAMAZAKI, Hiromoto HARUTA
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Patent number: 10494546Abstract: The present invention provides a coating material that allows a structure with void spaces having a strength and flexibility to be formed. The coating material of the present invention includes: pulverized products of a gelled silicon compound obtained from a silicon compound containing at least three or less functional groups having saturated bonds; and a dispersion medium, wherein the pulverized product contains a residual silanol group. The method of producing a coating material according to the present invention includes steps of: causing gelation of a silicon compound containing at least three or less functional groups having saturated bonds and mixing the gelled silicon compound and a dispersion medium. According to the coating material of the present invention, for example, a coating film is formed by coating a base with the coating material and a porous structure is formed by chemically bonding the pulverized products contained in the coating film.Type: GrantFiled: December 25, 2015Date of Patent: December 3, 2019Assignee: NITTO DENKO CORPORATIONInventors: Hiromoto Haruta, Hiroyuki Takemoto, Daisuke Hattori, Kozo Nakamura
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Patent number: 10472483Abstract: The present invention provides, for example, a silicone porous body having a porous structure with less cracks and a high proportion of void space as well as having a strength. The silicone porous body of the present invention includes silicon compound microporous particles, wherein the silicon compound microporous particles are chemically bonded by catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The silicone porous body can be produced, for example, by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products, for example.Type: GrantFiled: December 25, 2015Date of Patent: November 12, 2019Assignee: NITTO DENKO CORPORATIONInventors: Hiromoto Haruta, Kozo Nakamura, Kazuki Uwada, Hiroyuki Takemoto, Nao Murakami, Daisuke Hattori
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Publication number: 20190330438Abstract: The present invention provides, for example, a silicone porous body having a porous structure with less cracks and a high proportion of void space as well as having a strength. The silicone porous body of the present invention includes silicon compound microporous particles, wherein the silicon compound microporous particles are chemically bonded by catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The silicone porous body can be produced, for example, by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products, for example.Type: ApplicationFiled: July 3, 2019Publication date: October 31, 2019Applicant: NITTO DENKO CORPORATIONInventors: Hiromoto Haruta, Kozo Nakamura, Kazuki Uwada, Hiroyuki Takemoto, Nao Murakami, Daisuke Hattori
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Patent number: 10435531Abstract: The present invention provides, for example, a silicone porous body having a porous structure with less cracks and a high proportion of void space as well as having a strength. The silicone porous body of the present invention includes silicon compound microporous particles, wherein the silicon compound microporous particles are chemically bonded by catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The silicone porous body can be produced, for example, by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products, for example.Type: GrantFiled: December 25, 2015Date of Patent: October 8, 2019Assignee: NITTO DENKO CORPORATIONInventors: Hiromoto Haruta, Kozo Nakamura, Kazuki Uwada, Hiroyuki Takemoto, Nao Murakami, Daisuke Hattori
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Patent number: 10385179Abstract: The present invention provides, for example, a silicone porous body having a porous structure with less cracks and a high proportion of void space as well as having a strength. The silicone porous body of the present invention includes silicon compound microporous particles, wherein the silicon compound microporous particles are chemically bonded by catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The silicone porous body can be produced, for example, by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products, for example.Type: GrantFiled: December 25, 2015Date of Patent: August 20, 2019Assignee: NITTO DENKO CORPORATIONInventors: Hiromoto Haruta, Kozo Nakamura, Kazuki Uwada, Hiroyuki Takemoto, Nao Murakami, Daisuke Hattori
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Publication number: 20190040223Abstract: The present invention aims to provide a method for producing a porous gel-containing liquid that is inexpensive and excellent in homogeneity. The porous gel-containing liquid production method according to the present invention is a method including: a pulverization step of pulverizing a gel of a porous body, wherein the pulverization step is carried out as multi-stage pulverization including a plurality of pulverization stages.Type: ApplicationFiled: September 27, 2016Publication date: February 7, 2019Applicant: Nitto Denko CorporationInventors: Seong Jin Ryu, Hiromoto Haruta
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Publication number: 20180224580Abstract: The present invention is intended to provide an optical laminate that achieves a superior film strength and a property that a void-provided layer and a pressure-sensitive adhesive/adhesive layer are not easily peeled from each other. The optical laminate of the present invention includes: a void-provided layer; an intermediate layer; and a pressure-sensitive adhesive/adhesive layer, wherein the void-provided layer, the intermediate layer, and the pressure-sensitive adhesive/adhesive layer are stacked in this order, and the intermediate layer is formed by forming the pressure-sensitive adhesive/adhesive layer on the void-provided layer.Type: ApplicationFiled: July 29, 2016Publication date: August 9, 2018Applicant: NITTO DENKO CORPORATIONInventors: Daisuke Hattori, Hiromoto Haruta, Kozo Nakamura, Hiroyuki Takemoto
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Publication number: 20180223061Abstract: The present invention is intended to provide a laminated film including a void-provided layer achieving both a high proportion of void space and a high film strength. The laminated film of the present invention includes a void-provided layer 21 and a resin film 10, the void-provided layer 21 being stacked on the resin film 10. The laminated film is produced by a production method, including steps of forming a void-provided structure 20?, which is a precursor of the void-provided layer 21 on the resin film; and causing a crosslinking reaction in the precursor 20? after the precursor forming step. The precursor 20? contains a substance that generates a basic substance by light irradiation or heating, the basic substance is not generated in the precursor forming step, the basic substance is generated by light irradiation or heating in the crosslinking reaction step, and the crosslinking reaction step has multiple stages.Type: ApplicationFiled: July 29, 2016Publication date: August 9, 2018Applicant: Nitto Denko CorporationInventors: Daisuke Hattori, Hiromoto Haruta, Kozo Nakamura, Hiroyuki Takemoto