Abstract: A heating device includes a substrate in a form of a face plate that is positioned above a base plate, on which a wafer is placed, and to which a film heater for heating wafer is provided, columns that are vertically provided between the base plate and the face plate and support the face plate, and tension members that pull the face plate toward the base plate. The columns and the tension members are positioned to support or pull at least a part of the face plate corresponding to a placement region of the wafer. Each of the tension members includes a shaft having an upper end locked by the face plate and a lower end penetrating the base plate and a coil spring that is positioned on the base plate and biases the lower end of the shaft downward.

Abstract: A heating device includes a base plate and a face plate that is provided above the base plate and on which a wafer is placed. The face plate includes an aluminum substrate, a film heater that is provided to the aluminum substrate and heats the wafer, and a gap ball that is disposed on the aluminum substrate and interposed between the aluminum substrate and the wafer. The aluminum substrate is provided with a second attachment hole into which the gap ball is press-fitted. The gap ball is held only by an inner wall of the second attachment hole by being press-fitted.

Abstract: A non-contact wafer temperature measuring apparatus by which a wafer temperature can be measured with accuracy in situ even in a low temperature process. The wafer temperature measuring apparatus for measuring a wafer temperature based on reflected light of light applied to a wafer as a target of temperature measurement includes: a light source unit for generating light containing a P-polarized component having a wavelength not larger than 400 nm and applying the light to the wafer; a light receiving unit for receiving the light reflected by the wafer and detecting at least intensity of the P-polarized component having the wavelength not larger than 400 nm; and a signal processing unit for calculating a temperature of the target of temperature measurement at least based on the intensity of the P-polarized component having the wavelength not larger than 400 nm detected by the light receiving unit.

Abstract: A thermoelectric module with a simple structure with less breakage by thermal stress is provided. For this purpose, the thermoelectric module includes p-type and n-type thermoelectric elements (13, 14) which are alternately placed, and outer electrodes (15) and inner electrodes (16), which are alternately placed between the thermoelectric elements (13, 14), and at least part of at least either one of the outer electrode (15) or the inner electrode (16) has a shape approximately along an object which exchanges heat with the electrodes (15, 16). The inner electrodes (16) surround an object which exchanges heat with the electrodes (15, 16).

Abstract: A thermoelectric module with a simple structure with less breakage by thermal stress is provided. For this purpose, the thermoelectric module includes p-type and n-type thermoelectric elements (13, 14) which are alternately placed, and outer electrodes (15) and inner electrodes (16), which are alternately placed between the thermoelectric elements (13, 14), and at least part of at least either one of the outer electrode (15) or the inner electrode (16) has a shape approximately along an object which exchanges heat with the electrodes (15, 16). The inner electrodes (16) surround an object which exchanges heat with the electrodes (15, 16).

Abstract: The invention provides a temperature control device with excellent temperature uniformity and thermal response, which can be manufactured easily, and a manufacturing method for the same. A thermoelectric device 21 is arranged between a substrate mounting plate 1 and a cooling plate 3. Copper foil electrodes 5, 5, . . . on the upper side of the thermoelectric device 21 are adhered to a lower surface of the substrate mounting plate 1 with an adhesive sheet 17 covering substantially the entire lower surface of the substrate mounting plate 1, and copper foil electrodes 7, 7, . . . on the lower side of the thermoelectric device 21 are adhered to an upper surface of the cooling plate 3 with an adhesive sheet 19 covering substantially the entire upper surface of the substrate mounting plate 1.

Abstract: A temperature control system which performs control of an object whose temperature is to be controlled as accurately as possible. The system comprises: a chiller located in a fluid circulating and supplying system, for cooling a thermal fluid returning from a vacuum chamber, a first flow control valve located in the fluid circulating and supplying system in a position between the chiller and the vacuum chamber, a bypass passage for splitting and supplying thermal fluid returning from the vacuum chamber to a position between the first flow control valve and the vacuum chamber, before it reaches the chiller, a second flow control valve located in the bypass passage, and a halogen lamp heater located in the fluid circulating and supplying system in a position between a confluence point of the bypass passage and the vacuum chamber, for adjusting the temperature of the thermal fluid passing therethrough to a set temperature.