Patents by Inventor Hironori Furuta

Hironori Furuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190115491
    Abstract: A semiconductor device includes a first three-terminal light emitting element, a second three-terminal light emitting element that is disposed at a prescribed distance away from the first three-terminal light emitting element in a first direction, a first current supply electrode that corresponds to the first three-terminal light emitting element, a second current supply electrode that corresponds to the second three-terminal light emitting element, a first control electrode that corresponds to the first three-terminal light emitting element, a second control electrode that corresponds to the second three-terminal light emitting element, and a current extraction electrode that corresponds to the first three-terminal light emitting element and the second three-terminal light emitting element, wherein the first control electrode and the second control electrode are disposed at an inter-region that is determined between the first three-terminal light emitting element and the second three-terminal light emitting
    Type: Application
    Filed: October 11, 2018
    Publication date: April 18, 2019
    Inventor: Hironori FURUTA
  • Publication number: 20180033908
    Abstract: A semiconductor device includes: a p type first semiconductor layer that contains acceptors as impurities; an n type second semiconductor layer that is provided on the first semiconductor layer and contains donors as impurities; and a p type first diffusion portion that includes a contact portion in contact with the first semiconductor layer, the contact portion containing acceptors whose concentration is higher than that in the first semiconductor layer.
    Type: Application
    Filed: July 20, 2017
    Publication date: February 1, 2018
    Applicant: Oki Data Corporation
    Inventor: Hironori FURUTA
  • Publication number: 20170219952
    Abstract: A light emitting element device includes: a light emitting thyristor having a layered structure including a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type different from the first conductivity type, a third semiconductor layer of the first conductivity type, and a fourth semiconductor layer of the second conductivity type that are layered in this order; and a gate electrode for supplying gate current to the light emitting thyristor. The light emitting thyristor includes an etching stop layer disposed on a surface of the third semiconductor layer or included in the third semiconductor layer, the etching stop layer being a semiconductor layer having an etching rate lower than an etching rate of a semiconductor layer adjacent to the etching stop layer.
    Type: Application
    Filed: January 27, 2017
    Publication date: August 3, 2017
    Applicant: Oki Data Corporation
    Inventors: Hironori FURUTA, Genichiro MATSUO, Shinya JUMONJI
  • Publication number: 20160254315
    Abstract: Provided is a semiconductor device that includes a substrate, a plurality of light-emitting elements, an insulating film, and a wiring line. The light-emitting elements are disposed linearly at a predetermined interval on the substrate. The insulating film is provided on the substrate and has openings that correspond to the respective light-emitting element. The wiring line is provided on the insulating film and coupled to each of the light-emitting elements. The insulating film has an end. The end is provided in an array direction of the light-emitting elements and has a first cliff. The first cliff has a face that makes one of a right angle and an acute angle to a surface of the substrate.
    Type: Application
    Filed: January 26, 2016
    Publication date: September 1, 2016
    Applicant: OKI DATA CORPORATION
    Inventors: HIRONORI FURUTA, GENICHIRO MATSUO
  • Patent number: 8816364
    Abstract: The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus being formed by bonding semiconductor thin film element on a plastic substrate, a thin film metal layer is formed on surface of the semiconductor thin film element for promoting heat release.
    Type: Grant
    Filed: July 23, 2012
    Date of Patent: August 26, 2014
    Assignee: Oki Data Corporation
    Inventors: Takahito Suzuki, Tomohiko Sagimori, Hiroyuki Fujiwara, Tomoki Igari, Yusuke Nakai, Hironori Furuta, Mitsuhiko Ogihara
  • Patent number: 8664672
    Abstract: A light emitting panel includes a plurality of light emitting element arrays each of which has a plurality of light emitting elements arranged in a plane. The light emitting element arrays are configured so that an arrangement plane of the light emitting elements of one light emitting element array is overlapped with another arrangement plane of the light emitting elements of another light emitting element array in substantially parallel to each other, and so that the light emitting elements of one light emitting element array and the light emitting elements of another light emitting element array emit lights to the same side.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: March 4, 2014
    Assignee: Oki Data Corporation
    Inventors: Mitsuhiko Ogihara, Takahito Suzuki, Tomoki Igari, Hiroyuki Fujiwara, Tomohiko Sagimori, Hironori Furuta, Yusuke Nakai
  • Patent number: 8497893
    Abstract: A semiconductor device includes three-terminal light emitting element array provided on a substrate, which includes a plurality of three-terminal light emitting elements which are substantially linearly arranged. Each three-terminal light emitting elements includes a first, second and third terminals. The third terminal is used to control a current between the first and second terminals. A Lead-out wiring portion is connected to the plurality of three-terminal light emitting elements. The three-terminal light emitting element array includes a common layer provided between two or more three-terminal light emitting elements adjacent to each other. The common layer mutually connects the second terminals (or the third terminals) of the two or three three-terminal light emitting elements.
    Type: Grant
    Filed: July 8, 2010
    Date of Patent: July 30, 2013
    Assignee: Oki Data Corporation
    Inventors: Hironori Furuta, Yusuke Nakai, Hiroyuki Fujiwara
  • Publication number: 20120286303
    Abstract: The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus being formed by bonding semiconductor thin film element on a plastic substrate, a thin film metal layer is formed on surface of the semiconductor thin film element for promoting heat release.
    Type: Application
    Filed: July 23, 2012
    Publication date: November 15, 2012
    Applicant: Oki Data Corporation
    Inventors: Takahito SUZUKI, Tomohiko SAGIMORI, Hiroyuki FUJIWARA, Tomoki IGARI, Yusuke NAKAI, Hironori FURUTA, Mitsuhiko OGIHARA
  • Patent number: 8304792
    Abstract: A semiconductor light emitting apparatus is supplied capable of providing a high performance that can optimize simultaneously both an electrical characteristic and a light emitting characteristic.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: November 6, 2012
    Assignee: Oki Data Corporation
    Inventors: Yusuke Nakai, Hironori Furuta, Mitsuhiko Ogihara, Hiroyuki Fujiwara
  • Patent number: 8269314
    Abstract: The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus, inner surface electrode integrated with vertical wiring between plastic substrate and thin film LED 102 is accumulated, the inner surface electrode acts as a heat release layer for releasing heat produced inside the thin film LED 102.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: September 18, 2012
    Assignee: Oki Data Corporation
    Inventors: Takahito Suzuki, Tomohiko Sagimori, Hiroyuki Fujiwara, Tomoki Igari, Yusuke Nakai, Hironori Furuta, Mitsuhiko Ogihara
  • Patent number: 8258537
    Abstract: Provided is a technique of effectively extracting the beams of light excited in an LED light emitter other than the light beams emitted from a light-emitting region in the direction of a light-extraction surface. A pit with a tapered sidewall is formed in a substrate. A thin-film semiconductor element is attached to the pit. Light beams emitted from a side surface of the thin-film semiconductor element are reflected by the sidewall of the thin-film semiconductor element. Achieved thereby is effective extraction of light beams other than the light beams emitted from the light-emitting region in the direction of the light-extraction surface.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: September 4, 2012
    Assignee: Oki Data Corporation
    Inventors: Tomoki Igari, Tomohiko Sagimori, Mitsuhiko Ogihara, Takahito Suzuki, Hiroyuki Fujiwara, Hironori Furuta, Yusuke Nakai
  • Patent number: 7947576
    Abstract: An aspect of the invention provides a method of manufacturing a method of manufacturing a semiconductor element comprises the steps of: growing epitaxially a semiconductor layer on top of a semiconductor substrate; forming a patterned portion of the grown semiconductor layer by forming a pattern by a patterning process on top of the grown semiconductor layer; removing a portion of the semiconductor layer other than the patterned portion by a first etching method with a first etchant; and immersing a resultant from the first etching method in a second etchant that etches only the semiconductor substrate by a second etching method thereby removing the substrate from the semiconductor layer.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: May 24, 2011
    Assignee: Oki Data Corporation
    Inventors: Tomoki Igari, Mitsuhiko Ogihara, Hiroyuki Fujiwara, Hironori Furuta, Takahito Suzuki, Tomohiko Sagimori, Yusuke Nakai
  • Publication number: 20110007124
    Abstract: A semiconductor device includes three-terminal light emitting element array provided on a substrate, which includes a plurality of three-terminal light emitting elements which are substantially linearly arranged. Each three-terminal light emitting elements includes a first, second and third terminals. The third terminal is used to control a current between the first and second terminals. A Lead-out wiring portion is connected to the plurality of three-terminal light emitting elements. The three-terminal light emitting element array includes a common layer provided between two or more three-terminal light emitting elements adjacent to each other. The common layer mutually connects the second terminals (or the third terminals) of the two or three three-terminal light emitting elements.
    Type: Application
    Filed: July 8, 2010
    Publication date: January 13, 2011
    Applicant: OKI DATA CORPORATION
    Inventors: Hironori Furuta, Yusuke Nakai, Hiroyuki Fujiwara
  • Publication number: 20090242904
    Abstract: A semiconductor light emitting apparatus is supplied capable of providing a high performance that can optimize simultaneously both an electrical characteristic and a light emitting characteristic.
    Type: Application
    Filed: December 31, 2008
    Publication date: October 1, 2009
    Applicant: Oki Data Corporation
    Inventors: Yusuke NAKAI, Hironori FURUTA, Hiroyuki FUJIWARA, Mitsuhiko OGIHARA
  • Publication number: 20090239361
    Abstract: An aspect of the invention provides a method of manufacturing a method of manufacturing a semiconductor element comprises the steps of: growing epitaxially a semiconductor layer on top of a semiconductor substrate; forming a patterned portion of the grown semiconductor layer by forming a pattern by a patterning process on top of the grown semiconductor layer; removing a portion of the semiconductor layer other than the patterned portion by a first etching method with a first etchant; and immersing a resultant from the first etching method in a second etchant that etches only the semiconductor substrate by a second etching method thereby removing the substrate from the semiconductor layer.
    Type: Application
    Filed: March 11, 2009
    Publication date: September 24, 2009
    Applicant: Oki Data Corporation
    Inventors: Tomoki IGARI, Mitsuhiko OGIHARA, Hiroyuki FUJIWARA, Hironori FURUTA, Takahito SUZUKI, Tomohiko SAGIMORI, Yusuke NAKAI
  • Publication number: 20090224276
    Abstract: Provided is a technique of effectively extracting the beams of light excited in an LED light emitter other than the light beams emitted from a light-emitting region in the direction of a light-extraction surface. A pit with a tapered sidewall is formed in a substrate. A thin-film semiconductor element is attached to the pit. Light beams emitted from a side surface of the thin-film semiconductor element are reflected by the sidewall of the thin-film semiconductor element. Achieved thereby is effective extraction of light beams other than the light beams emitted from the light-emitting region in the direction of the light-extraction surface.
    Type: Application
    Filed: March 4, 2009
    Publication date: September 10, 2009
    Applicant: Oki Data Corporation
    Inventors: Tomoki IGARI, Tomohiko SAGIMORI, Mitsuhiko OGIHARA, Takahito SUZUKI, Hiroyuki FUJIWARA, Hironori FURUTA, Yusuke NAKAI
  • Publication number: 20090212398
    Abstract: A thin-film semiconductor element is formed on a plastic substrate in a semiconductor device. A thermal expansion buffer layer is interposed between the thin-film semiconductor element and the plastic substrate. Although the thin-film semiconductor element is made from a material with a thermal expansion coefficient differing from the thermal expansion coefficient of the plastic substrate, the thermal expansion buffer layer interposed between the thin-film semiconductor element and the plastic substrate protects the thin-film semiconductor element from damage caused by mechanical stress in the device fabrication process due to the different thermal expansion coefficients, enabling the semiconductor device to function reliably.
    Type: Application
    Filed: February 25, 2009
    Publication date: August 27, 2009
    Applicant: OKI DATA CORPORATION
    Inventors: Takahito Suzuki, Hiroyuki Fujiwara, Tomohiko Sagimori, Tomoki Igari, Hironori Furuta, Yusuke Nakai, Mitutsuhiko Ogihara
  • Publication number: 20090001391
    Abstract: A light emitting panel includes a plurality of light emitting element arrays each of which has a plurality of light emitting elements arranged in a plane. The light emitting element arrays are configured so that an arrangement plane of the light emitting elements of one light emitting element array is overlapped with another arrangement plane of the light emitting elements of another light emitting element array in substantially parallel to each other, and so that the light emitting elements of one light emitting element array and the light emitting elements of another light emitting element array emit lights to the same side.
    Type: Application
    Filed: June 24, 2008
    Publication date: January 1, 2009
    Applicant: OKI DATA CORPORATION
    Inventors: Mitsuhiko OGIHARA, Takahito SUZUKI, Tomoki IGARI, Hiroyuki FUJIWARA, Tomohiko SAGIMORI, Hironori FURUTA, Yusuke NAKAI
  • Publication number: 20080224170
    Abstract: A nitride semiconductor wafer includes a substrate; a nitride compound semiconductor layer formed on the substrate; and an AlxGa1-xAs layer (x?0.6) formed between the substrate and the nitride semiconductor layer. The nitride compound semiconductor layer is formed of a nitride compound in a group III to a group V.
    Type: Application
    Filed: March 13, 2008
    Publication date: September 18, 2008
    Inventors: Mitsuhiko Ogihara, Tomoki Igari, Hiroyuki Fujiwara, Tomohiko Sagimori, Takahito Suzuki, Hironori Furuta, Yusuke Nakai
  • Publication number: 20080219006
    Abstract: The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus, inner surface electrode integrated with vertical wiring between plastic substrate and thin film LED 102 is accumulated, the inner surface electrode acts as a heat release layer for releasing heat produced inside the thin film LED 102.
    Type: Application
    Filed: February 28, 2008
    Publication date: September 11, 2008
    Applicant: OKI DATA CORPORATION
    Inventors: Takahito Suzuki, Tomohiko Sagimori, Hiroyuki Fujiwara, Tomoki Igari, Yusuke Nakai, Hironori Furuta, Mitsuhiko Ogihara