Patents by Inventor Hironori Furuta
Hironori Furuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190115491Abstract: A semiconductor device includes a first three-terminal light emitting element, a second three-terminal light emitting element that is disposed at a prescribed distance away from the first three-terminal light emitting element in a first direction, a first current supply electrode that corresponds to the first three-terminal light emitting element, a second current supply electrode that corresponds to the second three-terminal light emitting element, a first control electrode that corresponds to the first three-terminal light emitting element, a second control electrode that corresponds to the second three-terminal light emitting element, and a current extraction electrode that corresponds to the first three-terminal light emitting element and the second three-terminal light emitting element, wherein the first control electrode and the second control electrode are disposed at an inter-region that is determined between the first three-terminal light emitting element and the second three-terminal light emittingType: ApplicationFiled: October 11, 2018Publication date: April 18, 2019Inventor: Hironori FURUTA
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Publication number: 20180033908Abstract: A semiconductor device includes: a p type first semiconductor layer that contains acceptors as impurities; an n type second semiconductor layer that is provided on the first semiconductor layer and contains donors as impurities; and a p type first diffusion portion that includes a contact portion in contact with the first semiconductor layer, the contact portion containing acceptors whose concentration is higher than that in the first semiconductor layer.Type: ApplicationFiled: July 20, 2017Publication date: February 1, 2018Applicant: Oki Data CorporationInventor: Hironori FURUTA
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Publication number: 20170219952Abstract: A light emitting element device includes: a light emitting thyristor having a layered structure including a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type different from the first conductivity type, a third semiconductor layer of the first conductivity type, and a fourth semiconductor layer of the second conductivity type that are layered in this order; and a gate electrode for supplying gate current to the light emitting thyristor. The light emitting thyristor includes an etching stop layer disposed on a surface of the third semiconductor layer or included in the third semiconductor layer, the etching stop layer being a semiconductor layer having an etching rate lower than an etching rate of a semiconductor layer adjacent to the etching stop layer.Type: ApplicationFiled: January 27, 2017Publication date: August 3, 2017Applicant: Oki Data CorporationInventors: Hironori FURUTA, Genichiro MATSUO, Shinya JUMONJI
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Publication number: 20160254315Abstract: Provided is a semiconductor device that includes a substrate, a plurality of light-emitting elements, an insulating film, and a wiring line. The light-emitting elements are disposed linearly at a predetermined interval on the substrate. The insulating film is provided on the substrate and has openings that correspond to the respective light-emitting element. The wiring line is provided on the insulating film and coupled to each of the light-emitting elements. The insulating film has an end. The end is provided in an array direction of the light-emitting elements and has a first cliff. The first cliff has a face that makes one of a right angle and an acute angle to a surface of the substrate.Type: ApplicationFiled: January 26, 2016Publication date: September 1, 2016Applicant: OKI DATA CORPORATIONInventors: HIRONORI FURUTA, GENICHIRO MATSUO
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Patent number: 8816364Abstract: The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus being formed by bonding semiconductor thin film element on a plastic substrate, a thin film metal layer is formed on surface of the semiconductor thin film element for promoting heat release.Type: GrantFiled: July 23, 2012Date of Patent: August 26, 2014Assignee: Oki Data CorporationInventors: Takahito Suzuki, Tomohiko Sagimori, Hiroyuki Fujiwara, Tomoki Igari, Yusuke Nakai, Hironori Furuta, Mitsuhiko Ogihara
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Patent number: 8664672Abstract: A light emitting panel includes a plurality of light emitting element arrays each of which has a plurality of light emitting elements arranged in a plane. The light emitting element arrays are configured so that an arrangement plane of the light emitting elements of one light emitting element array is overlapped with another arrangement plane of the light emitting elements of another light emitting element array in substantially parallel to each other, and so that the light emitting elements of one light emitting element array and the light emitting elements of another light emitting element array emit lights to the same side.Type: GrantFiled: June 24, 2008Date of Patent: March 4, 2014Assignee: Oki Data CorporationInventors: Mitsuhiko Ogihara, Takahito Suzuki, Tomoki Igari, Hiroyuki Fujiwara, Tomohiko Sagimori, Hironori Furuta, Yusuke Nakai
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Patent number: 8497893Abstract: A semiconductor device includes three-terminal light emitting element array provided on a substrate, which includes a plurality of three-terminal light emitting elements which are substantially linearly arranged. Each three-terminal light emitting elements includes a first, second and third terminals. The third terminal is used to control a current between the first and second terminals. A Lead-out wiring portion is connected to the plurality of three-terminal light emitting elements. The three-terminal light emitting element array includes a common layer provided between two or more three-terminal light emitting elements adjacent to each other. The common layer mutually connects the second terminals (or the third terminals) of the two or three three-terminal light emitting elements.Type: GrantFiled: July 8, 2010Date of Patent: July 30, 2013Assignee: Oki Data CorporationInventors: Hironori Furuta, Yusuke Nakai, Hiroyuki Fujiwara
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Publication number: 20120286303Abstract: The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus being formed by bonding semiconductor thin film element on a plastic substrate, a thin film metal layer is formed on surface of the semiconductor thin film element for promoting heat release.Type: ApplicationFiled: July 23, 2012Publication date: November 15, 2012Applicant: Oki Data CorporationInventors: Takahito SUZUKI, Tomohiko SAGIMORI, Hiroyuki FUJIWARA, Tomoki IGARI, Yusuke NAKAI, Hironori FURUTA, Mitsuhiko OGIHARA
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Patent number: 8304792Abstract: A semiconductor light emitting apparatus is supplied capable of providing a high performance that can optimize simultaneously both an electrical characteristic and a light emitting characteristic.Type: GrantFiled: December 31, 2008Date of Patent: November 6, 2012Assignee: Oki Data CorporationInventors: Yusuke Nakai, Hironori Furuta, Mitsuhiko Ogihara, Hiroyuki Fujiwara
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Patent number: 8269314Abstract: The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus, inner surface electrode integrated with vertical wiring between plastic substrate and thin film LED 102 is accumulated, the inner surface electrode acts as a heat release layer for releasing heat produced inside the thin film LED 102.Type: GrantFiled: February 28, 2008Date of Patent: September 18, 2012Assignee: Oki Data CorporationInventors: Takahito Suzuki, Tomohiko Sagimori, Hiroyuki Fujiwara, Tomoki Igari, Yusuke Nakai, Hironori Furuta, Mitsuhiko Ogihara
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Patent number: 8258537Abstract: Provided is a technique of effectively extracting the beams of light excited in an LED light emitter other than the light beams emitted from a light-emitting region in the direction of a light-extraction surface. A pit with a tapered sidewall is formed in a substrate. A thin-film semiconductor element is attached to the pit. Light beams emitted from a side surface of the thin-film semiconductor element are reflected by the sidewall of the thin-film semiconductor element. Achieved thereby is effective extraction of light beams other than the light beams emitted from the light-emitting region in the direction of the light-extraction surface.Type: GrantFiled: March 4, 2009Date of Patent: September 4, 2012Assignee: Oki Data CorporationInventors: Tomoki Igari, Tomohiko Sagimori, Mitsuhiko Ogihara, Takahito Suzuki, Hiroyuki Fujiwara, Hironori Furuta, Yusuke Nakai
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Patent number: 7947576Abstract: An aspect of the invention provides a method of manufacturing a method of manufacturing a semiconductor element comprises the steps of: growing epitaxially a semiconductor layer on top of a semiconductor substrate; forming a patterned portion of the grown semiconductor layer by forming a pattern by a patterning process on top of the grown semiconductor layer; removing a portion of the semiconductor layer other than the patterned portion by a first etching method with a first etchant; and immersing a resultant from the first etching method in a second etchant that etches only the semiconductor substrate by a second etching method thereby removing the substrate from the semiconductor layer.Type: GrantFiled: March 11, 2009Date of Patent: May 24, 2011Assignee: Oki Data CorporationInventors: Tomoki Igari, Mitsuhiko Ogihara, Hiroyuki Fujiwara, Hironori Furuta, Takahito Suzuki, Tomohiko Sagimori, Yusuke Nakai
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Publication number: 20110007124Abstract: A semiconductor device includes three-terminal light emitting element array provided on a substrate, which includes a plurality of three-terminal light emitting elements which are substantially linearly arranged. Each three-terminal light emitting elements includes a first, second and third terminals. The third terminal is used to control a current between the first and second terminals. A Lead-out wiring portion is connected to the plurality of three-terminal light emitting elements. The three-terminal light emitting element array includes a common layer provided between two or more three-terminal light emitting elements adjacent to each other. The common layer mutually connects the second terminals (or the third terminals) of the two or three three-terminal light emitting elements.Type: ApplicationFiled: July 8, 2010Publication date: January 13, 2011Applicant: OKI DATA CORPORATIONInventors: Hironori Furuta, Yusuke Nakai, Hiroyuki Fujiwara
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Publication number: 20090242904Abstract: A semiconductor light emitting apparatus is supplied capable of providing a high performance that can optimize simultaneously both an electrical characteristic and a light emitting characteristic.Type: ApplicationFiled: December 31, 2008Publication date: October 1, 2009Applicant: Oki Data CorporationInventors: Yusuke NAKAI, Hironori FURUTA, Hiroyuki FUJIWARA, Mitsuhiko OGIHARA
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Publication number: 20090239361Abstract: An aspect of the invention provides a method of manufacturing a method of manufacturing a semiconductor element comprises the steps of: growing epitaxially a semiconductor layer on top of a semiconductor substrate; forming a patterned portion of the grown semiconductor layer by forming a pattern by a patterning process on top of the grown semiconductor layer; removing a portion of the semiconductor layer other than the patterned portion by a first etching method with a first etchant; and immersing a resultant from the first etching method in a second etchant that etches only the semiconductor substrate by a second etching method thereby removing the substrate from the semiconductor layer.Type: ApplicationFiled: March 11, 2009Publication date: September 24, 2009Applicant: Oki Data CorporationInventors: Tomoki IGARI, Mitsuhiko OGIHARA, Hiroyuki FUJIWARA, Hironori FURUTA, Takahito SUZUKI, Tomohiko SAGIMORI, Yusuke NAKAI
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Publication number: 20090224276Abstract: Provided is a technique of effectively extracting the beams of light excited in an LED light emitter other than the light beams emitted from a light-emitting region in the direction of a light-extraction surface. A pit with a tapered sidewall is formed in a substrate. A thin-film semiconductor element is attached to the pit. Light beams emitted from a side surface of the thin-film semiconductor element are reflected by the sidewall of the thin-film semiconductor element. Achieved thereby is effective extraction of light beams other than the light beams emitted from the light-emitting region in the direction of the light-extraction surface.Type: ApplicationFiled: March 4, 2009Publication date: September 10, 2009Applicant: Oki Data CorporationInventors: Tomoki IGARI, Tomohiko SAGIMORI, Mitsuhiko OGIHARA, Takahito SUZUKI, Hiroyuki FUJIWARA, Hironori FURUTA, Yusuke NAKAI
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Publication number: 20090212398Abstract: A thin-film semiconductor element is formed on a plastic substrate in a semiconductor device. A thermal expansion buffer layer is interposed between the thin-film semiconductor element and the plastic substrate. Although the thin-film semiconductor element is made from a material with a thermal expansion coefficient differing from the thermal expansion coefficient of the plastic substrate, the thermal expansion buffer layer interposed between the thin-film semiconductor element and the plastic substrate protects the thin-film semiconductor element from damage caused by mechanical stress in the device fabrication process due to the different thermal expansion coefficients, enabling the semiconductor device to function reliably.Type: ApplicationFiled: February 25, 2009Publication date: August 27, 2009Applicant: OKI DATA CORPORATIONInventors: Takahito Suzuki, Hiroyuki Fujiwara, Tomohiko Sagimori, Tomoki Igari, Hironori Furuta, Yusuke Nakai, Mitutsuhiko Ogihara
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Publication number: 20090001391Abstract: A light emitting panel includes a plurality of light emitting element arrays each of which has a plurality of light emitting elements arranged in a plane. The light emitting element arrays are configured so that an arrangement plane of the light emitting elements of one light emitting element array is overlapped with another arrangement plane of the light emitting elements of another light emitting element array in substantially parallel to each other, and so that the light emitting elements of one light emitting element array and the light emitting elements of another light emitting element array emit lights to the same side.Type: ApplicationFiled: June 24, 2008Publication date: January 1, 2009Applicant: OKI DATA CORPORATIONInventors: Mitsuhiko OGIHARA, Takahito SUZUKI, Tomoki IGARI, Hiroyuki FUJIWARA, Tomohiko SAGIMORI, Hironori FURUTA, Yusuke NAKAI
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Publication number: 20080224170Abstract: A nitride semiconductor wafer includes a substrate; a nitride compound semiconductor layer formed on the substrate; and an AlxGa1-xAs layer (x?0.6) formed between the substrate and the nitride semiconductor layer. The nitride compound semiconductor layer is formed of a nitride compound in a group III to a group V.Type: ApplicationFiled: March 13, 2008Publication date: September 18, 2008Inventors: Mitsuhiko Ogihara, Tomoki Igari, Hiroyuki Fujiwara, Tomohiko Sagimori, Takahito Suzuki, Hironori Furuta, Yusuke Nakai
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Publication number: 20080219006Abstract: The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus, inner surface electrode integrated with vertical wiring between plastic substrate and thin film LED 102 is accumulated, the inner surface electrode acts as a heat release layer for releasing heat produced inside the thin film LED 102.Type: ApplicationFiled: February 28, 2008Publication date: September 11, 2008Applicant: OKI DATA CORPORATIONInventors: Takahito Suzuki, Tomohiko Sagimori, Hiroyuki Fujiwara, Tomoki Igari, Yusuke Nakai, Hironori Furuta, Mitsuhiko Ogihara