Patents by Inventor Hironori Furuta

Hironori Furuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080042155
    Abstract: A semiconductor device is manufactured using dicing of a semiconductor wafer. The semiconductor device includes a substrate, a base insulating layer formed on the substrate, a semiconductor element formed on the base insulating layer, and a separate pattern portion formed on an end portion of the substrate separately from the base insulating layer. The separate pattern portion prevents the base insulating layer from being peeled off from the substrate when the dicing is performed.
    Type: Application
    Filed: June 27, 2007
    Publication date: February 21, 2008
    Applicant: OKI DATA CORPORATION
    Inventors: Hironori Furuta, Mitsuhiko Ogihara, Hiroyuki Fujiwara, Tomoki Igari, Masataka Muto