Patents by Inventor Hironori Kawamoto

Hironori Kawamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11820858
    Abstract: According to the present invention, there is provided a prepreg characterized by including a reinforcing fiber substrate composed of a reinforcing fiber, and an epoxy resin composition with which the reinforcing fiber substrate is partially or wholly impregnated, in which the epoxy resin composition includes, as an essential component, an epoxy resin, an amine-based curing agent, and a polyamide particle, the epoxy resin composition includes, as an optional component, an epoxy resin-soluble thermoplastic resin; and an epoxy group is introduced to the surface of the polyamide particle, and/or at least one of the epoxy resin, the amine-based curing agent, and the epoxy resin-soluble thermoplastic resin, included in the epoxy resin composition, partially permeates into the polyamide particle.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: November 21, 2023
    Assignee: TEIJIN LIMITED
    Inventors: Akimichi Oda, Hiroaki Kuwahara, Hironori Kawamoto
  • Publication number: 20230331906
    Abstract: According to the present invention, there is provided a prepreg characterized by including a reinforcing fiber substrate composed of a reinforcing fiber, and an epoxy resin composition with which the reinforcing fiber substrate is partially or wholly impregnated, in which the epoxy resin composition includes, as an essential component, an epoxy resin, an amine-based curing agent, and a polyamide particle, the epoxy resin composition includes, as an optional component, an epoxy resin-soluble thermoplastic resin; and an epoxy group is introduced to the surface of the polyamide particle, and/or at least one of the epoxy resin, the amine-based curing agent, and the epoxy resin-soluble thermoplastic resin, included in the epoxy resin composition, partially permeates into the polyamide particle.
    Type: Application
    Filed: June 16, 2023
    Publication date: October 19, 2023
    Applicant: TEIJIN LIMITED
    Inventors: Akimichi ODA, Hiroaki KUWAHARA, Hironori KAWAMOTO
  • Patent number: 11746445
    Abstract: An object of the present invention is to provide a carbon fiber which exhibits excellent strength development rate when used in a composite material. The present invention that solves the problems is a carbon fiber which simultaneously satisfies the following formulae (1) and (2): Lc/d?3??(1) TS×d×Lc>6.0×105??(2) wherein: Lc is an X-ray crystallite size (?), d is a filament diameter (?m), and TS is a strand tensile strength (MPa).
    Type: Grant
    Filed: September 13, 2022
    Date of Patent: September 5, 2023
    Assignees: TEIJIN LIMITED, Teijin Carbon Europe GmbH
    Inventors: Shuhei Yoshida, Hidekazu Yoshikawa, Yosuke Nakamura, Hironori Kawamoto, Takaya Suzuki, Toru Kaneko
  • Publication number: 20230087160
    Abstract: A manufacturing method and a manufacturing apparatus have high yields. The manufacturing method is a method for manufacturing a carbon fiber electrode substrate (3a) by feeding an oxidized fiber substrate (1a) through a carbonization furnace (102, 103) to carbonize the oxidized fiber substrate (1a). The method includes feeding, through the carbonization furnace (102, 103), a plurality of oxidized fiber substrates (1a) arranged in a thickness direction of the oxidized fiber substrates (1a).
    Type: Application
    Filed: March 2, 2021
    Publication date: March 23, 2023
    Applicant: TEIJIN LIMITED
    Inventor: Hironori KAWAMOTO
  • Patent number: 11560646
    Abstract: An object of the present invention is to provide a carbon fiber which exhibits excellent strength development rate when used in a composite material. The present invention that solves the problems is a carbon fiber which simultaneously satisfies the following formulae (1) and (2): Lc/d?3??(1) TS×d×Lc>6.0×105??(2) wherein: Lc is an X-ray crystallite size (?), d is a filament diameter (?m), and TS is a strand tensile strength (MPa).
    Type: Grant
    Filed: November 22, 2018
    Date of Patent: January 24, 2023
    Assignees: TEIJIN LIMITED, Teijin Carbon Europe GmbH
    Inventors: Shuhei Yoshida, Hidekazu Yoshikawa, Yosuke Nakamura, Hironori Kawamoto, Takaya Suzuki, Toru Kaneko
  • Publication number: 20230017814
    Abstract: An object of the present invention is to provide a carbon fiber which exhibits excellent strength development rate when used in a composite material. The present invention that solves the problems is a carbon fiber which simultaneously satisfies the following formulae (1) and (2): Lc/d?3??(1) TS×d×Lc>6.0×105??(2) wherein: Lc is an X-ray crystallite size (?), d is a filament diameter (?m), and TS is a strand tensile strength (MPa).
    Type: Application
    Filed: September 13, 2022
    Publication date: January 19, 2023
    Applicants: Teijin Limited, Teijin Carbon Europe GmbH
    Inventors: Shuhei YOSHIDA, Hidekazu Yoshikawa, Yosuke Nakamura, Hironori Kawamoto, Takaya Suzuki, Toru Kaneko
  • Publication number: 20200407548
    Abstract: The present invention provides an epoxy resin composition including tetraglycidyl-3,4?-diaminodiphenyl ether, and a curing agent composed of an aromatic polyamine having a predetermined substituent in at least one ortho position with respect to an amino group, a predetermined aromatic epoxy resin having a glycidyl ether group, or an epoxy resin having a predetermined epoxy equivalent weight.
    Type: Application
    Filed: March 14, 2019
    Publication date: December 31, 2020
    Applicant: TEIJIN LIMITED
    Inventors: Suguru OZAWA, Hironori KAWAMOTO, Takaya SUZUKI, Hiroaki KUWAHARA, Toru KANEKO
  • Publication number: 20200385891
    Abstract: An object of the present invention is to provide a carbon fiber which exhibits excellent strength development rate when used in a composite material. The present invention that solves the problems is a carbon fiber which simultaneously satisfies the following formulae (1) and (2): Lc/d?3??(1) TS×d×Lc>6.0×105??(2) wherein: Lc is an X-ray crystallite size (?), d is a filament diameter (?m), and TS is a strand tensile strength (MPa).
    Type: Application
    Filed: November 22, 2018
    Publication date: December 10, 2020
    Applicants: TEIJIN LIMITED, TEIJIN CARBON EUROPE GMBH
    Inventors: Shuhei YOSHIDA, Hidekazu YOSHIKAWA, Yosuke NAKAMURA, Hironori KAWAMOTO, Takaya SUZUKI, Toru KANEKO
  • Publication number: 20200291198
    Abstract: According to the present invention, there is provided a prepreg characterized by including a reinforcing fiber substrate composed of a reinforcing fiber, and an epoxy resin composition with which the reinforcing fiber substrate is partially or wholly impregnated, in which the epoxy resin composition includes, as an essential component, an epoxy resin, an amine-based curing agent, and a polyamide particle, the epoxy resin composition includes, as an optional component, an epoxy resin-soluble thermoplastic resin; and an epoxy group is introduced to the surface of the polyamide particle, and/or at least one of the epoxy resin, the amine-based curing agent, and the epoxy resin-soluble thermoplastic resin, included in the epoxy resin composition, partially permeates into the polyamide particle.
    Type: Application
    Filed: November 28, 2018
    Publication date: September 17, 2020
    Applicant: TEIJIN LIMITED
    Inventors: Akimichi ODA, Hiroaki KUWAHARA, Hironori KAWAMOTO
  • Patent number: 10544274
    Abstract: A prepreg includes conductive fibers impregnated with a matrix resin, the prepreg having a conductive region where a conductive material is dispersed in the resin. In the present invention, a resin layer composed of at least the matrix resin preferably is present on one or both surfaces of a conductive fiber layer composed of at least the conductive fibers, and the conductive region is present at least in the resin layer. In addition, the above-described conductive region preferably is present continuously in the thickness direction. The conductive region preferably is a conductive region where the conductive material is dispersed in the matrix resin, and the resin in the conductive region preferably forms a continuous phase with the matrix resin in other regions. A volume resistivity of the conductive region preferably is 1/1,000 or less of that of other regions of the matrix resin.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: January 28, 2020
    Assignee: Toho Tenax Co., Ltd.
    Inventors: Kazuma Kurokawa, Hironori Kawamoto, Yoshitaka Umemoto, Akio Nakaishi
  • Publication number: 20180208729
    Abstract: A prepreg includes conductive fibers impregnated with a matrix resin, the prepreg having a conductive region where a conductive material is dispersed in the resin. In the present invention, a resin layer composed of at least the matrix resin preferably is present on one or both surfaces of a conductive fiber layer composed of at least the conductive fibers, and the conductive region is present at least in the resin layer. In addition, the above-described conductive region preferably is present continuously in the thickness direction. The conductive region preferably is a conductive region where the conductive material is dispersed in the matrix resin, and the resin in the conductive region preferably forms a continuous phase with the matrix resin in other regions. A volume resistivity of the conductive region preferably is 1/1,000 or less of that of other regions of the matrix resin.
    Type: Application
    Filed: July 24, 2015
    Publication date: July 26, 2018
    Applicant: Toho Tenax Co., Ltd.
    Inventors: Kazuma KUROKAWA, Hironori KAWAMOTO, Yoshitaka UMEMOTO, Akio NAKAISHI
  • Publication number: 20110218272
    Abstract: Provided are a thermosetting resin composition suitable for forming a composite material that has excellent mechanical characteristics, such as wet heat resistance and toughness, and also a prepreg using the same. The thermosetting resin composition includes at least a component [A] including thermoplastic resin particles and a thermosetting resin [B]. The component [A] includes a melt blend of at least the components [A-1] and [A-2] given below. In the particles, the component [A-1] and the component [A-2] may be in a non-compatibilized state or a compatibilized state.
    Type: Application
    Filed: November 7, 2009
    Publication date: September 8, 2011
    Applicant: TOHO TENAX CO., LTD.
    Inventors: Hiroshi Numata, Hironori Kawamoto
  • Publication number: 20110111663
    Abstract: Disclosed is an epoxy resin composition comprising at least component [A]: a glycidyl-amino-group-containing polyfunctional epoxy resin, component [B]: an epoxy resin other than the component [A], component [C]: a polyisocyanate compound, component [D]: an aromatic-amine-based curing agent, and component [E]: a thermoplastic resin, characterized in that the epoxy resin composition has an epoxy group concentration of 0.67 to 1.51 Eq/kg of the total amount of the components [A] to [D], and preferably that the component [E] is in a proportion of 10 to 50% by weight of the total epoxy resin composition. Use of a prepreg having the resin composition as a matrix resin makes it possible to obtain a composite material with excellent heat resistance and wet heat resistance together with high mechanical properties.
    Type: Application
    Filed: June 6, 2009
    Publication date: May 12, 2011
    Applicant: TOHO TENAX CO., LTD
    Inventors: Hironori Kawamoto, Toyoaki Ishiwata
  • Publication number: 20100133344
    Abstract: A bar code scanner module is disclosed that may include a chassis housing an optical transmission system therein, the optical transmission system including a laser diode and a motor; a first circuit board coupled to the motor; and a second circuit board disposed within the chassis and in communication with the first circuit board. The module may further include a third circuit board disposed in proximity to the chassis and in communication with at least one of the first circuit board and the second circuit board.
    Type: Application
    Filed: November 9, 2006
    Publication date: June 3, 2010
    Applicant: Optoelectronics Co., Ltd.
    Inventors: Masayoshi Yamanouchi, Hironori Kawamoto, Toshiyki Toyama
  • Patent number: 7549587
    Abstract: A method and system for scanning objects using a scan engine having two modes are described. Under a first mode, the scan engine generates modulated pulses for determining the existence of objects containing symbols such as barcode and a scanning mirror is kept stationary. When it is determined that a triggering event should occur or the symbols exit, the scan engine is switched to a second mode in which light is continuously generated by a light source and used with the scanning mirror oscillating for standard scanning.
    Type: Grant
    Filed: November 9, 2005
    Date of Patent: June 23, 2009
    Assignee: Optoelectronics Co., Ltd.
    Inventor: Hironori Kawamoto
  • Publication number: 20070102524
    Abstract: A method and system for scanning objects using a scan engine having two modes are described. Under a first mode, the scan engine generates modulated pulses for determining the existence of objects containing symbols such as barcode and a scanning mirror is kept stationary. When it is determined that a triggering event should occur or the symbols exit, the scan engine is switched to a second mode in which light is continuously generated by a light source and used with the scanning mirror oscillating for standard scanning.
    Type: Application
    Filed: November 9, 2005
    Publication date: May 10, 2007
    Inventor: Hironori Kawamoto