Patents by Inventor Hironori Matsuoka
Hironori Matsuoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240051318Abstract: A medium-transport apparatus includes: an apparatus main body having the transport path for transporting the medium; and a cover CV provided on the side surface of the apparatus main body and configured to be switched between a first state of exposing the transport path and a second state of covering the transport path. The cover CV is divided into: a first cover that has the rotation shaft along a Z-axis and is rotatable with respect to the apparatus main body; and a second cover that is arranged on a ?Z side of the first cover, has the rotation shaft along a Y-axis on the Z-side, and is rotatable with respect to the apparatus main body.Type: ApplicationFiled: October 25, 2023Publication date: February 15, 2024Inventors: Akihisa WANIBE, Hironori MATSUOKA
-
Patent number: 11827040Abstract: A medium-transport apparatus includes: an apparatus main body having the transport path for transporting the medium; and a cover CV provided on the side surface of the apparatus main body and configured to be switched between a first state of exposing the transport path and a second state of covering the transport path. The cover CV is divided into: a first cover that has the rotation shaft along a Z-axis and is rotatable with respect to the apparatus main body; and a second cover that is arranged on a ?Z side of the first cover, has the rotation shaft along a Y-axis on the Z? side, and is rotatable with respect to the apparatus main body.Type: GrantFiled: March 3, 2022Date of Patent: November 28, 2023Assignee: Seiko Epson CorporationInventors: Akihisa Wanibe, Hironori Matsuoka
-
Publication number: 20230126048Abstract: A controller can acquire, as information of a recording device, first information that can determine that a recording type of the recording device is an ink-jet type, and second information that can determine the recording type of the recording device is a laser type. The controller acquires the information of the recording device, performs the post-processing based on a first setting when the information of the recording device includes the first information capable of determining that the recording type is the ink-jet type, and performs the control of the post-processing based on a second setting different from the first setting when the information of the recording device includes the second information capable of determining that the recording type is the laser type.Type: ApplicationFiled: October 24, 2022Publication date: April 27, 2023Inventors: Masayoshi MIYAKAWA, Hironori MATSUOKA
-
Patent number: 11515317Abstract: A three-dimensional memory device can include at least one alternating stack of insulating layers and electrically conductive layers located over a semiconductor material layer, memory stack structures vertically extending through the at least one alternating stack, and a vertical stack of dielectric plates interlaced with laterally extending portions of the insulating layers of the at least one alternating stack. A conductive via structure can vertically extend through each dielectric plate and the insulating layers, and can contact an underlying metal interconnect structure. Additionally or alternatively, support pillar structures can vertically extend through the vertical stack of dielectric plates and into an opening through the semiconductor material layer, and can contact lower-level dielectric material layers embedding the underlying metal interconnect structure to enhance structural support to the three-dimensional memory device during manufacture.Type: GrantFiled: June 5, 2020Date of Patent: November 29, 2022Assignee: SANDISK TECHNOLOGIES LLCInventors: Takaaki Iwai, Junpei Kanazawa, Hisakazu Otoi, Hironori Matsuoka, Raiden Matsuno
-
Publication number: 20220281249Abstract: A medium-transport apparatus includes: an apparatus main body having the transport path for transporting the medium; and a cover CV provided on the side surface of the apparatus main body and configured to be switched between a first state of exposing the transport path and a second state of covering the transport path. The cover CV is divided into: a first cover that has the rotation shaft along a Z-axis and is rotatable with respect to the apparatus main body; and a second cover that is arranged on a ?Z side of the first cover, has the rotation shaft along a Y-axis on the Z? side, and is rotatable with respect to the apparatus main body.Type: ApplicationFiled: March 3, 2022Publication date: September 8, 2022Inventors: Akihisa WANIBE, Hironori MATSUOKA
-
Publication number: 20220234368Abstract: A recording system includes a transportation unit that transports a paper sheet, an ejection unit that ejects an ink, a heating unit that heats the paper sheet, a discharge unit to which the paper sheet is discharged, and a control unit. The control unit specifies an amount of ejection of the ink from the ejection unit. The control unit also controls an operation of the heating unit such that an undried region where the ink on the paper sheet is not dried and a dried region where the ink on the paper sheet is dried are formed on the paper sheet. Then, the control unit controls a transporting operation by the transportation unit such that the paper sheet on which the dried region and the undried region are formed is discharged to the discharge unit.Type: ApplicationFiled: January 19, 2022Publication date: July 28, 2022Inventors: Naoki UEMURA, Masaki MIYAZAWA, Hirohisa ADACHI, Hiroyuki KOSUGE, Yuto SUZUKI, Shunpei YAMAGUCHI, Hironori MATSUOKA, Hiroshi SHIOBARA
-
Publication number: 20210384207Abstract: A three-dimensional memory device can include at least one alternating stack of insulating layers and electrically conductive layers located over a semiconductor material layer, memory stack structures vertically extending through the at least one alternating stack, and a vertical stack of dielectric plates interlaced with laterally extending portions of the insulating layers of the at least one alternating stack. A conductive via structure can vertically extend through each dielectric plate and the insulating layers, and can contact an underlying metal interconnect structure. Additionally or alternatively, support pillar structures can vertically extend through the vertical stack of dielectric plates and into an opening through the semiconductor material layer, and can contact lower-level dielectric material layers embedding the underlying metal interconnect structure to enhance structural support to the three-dimensional memory device during manufacture.Type: ApplicationFiled: June 5, 2020Publication date: December 9, 2021Inventors: Takaaki IWAI, Junpei KANAZAWA, Hisakazu OTOI, Hironori MATSUOKA, Raiden MATSUNO
-
Patent number: 11155096Abstract: A liquid ejecting unit includes: a first chamber; a second chamber; a third chamber; a fourth chamber; a first liquid passage for supplying a first type of liquid to the first chamber and the third chamber; a second liquid passage for supplying a second type of liquid to the second chamber and the fourth chamber, the second type of liquid differing from the first type of liquid; a first fluid passage for supplying fluid to the first chamber and the second chamber; and a second fluid passage for supplying the fluid to the third chamber and the fourth chamber.Type: GrantFiled: May 28, 2020Date of Patent: October 26, 2021Assignee: Seiko Epson CorporationInventors: Masahiko Sato, Hiroyuki Hagiwara, Hironori Matsuoka, Hiroyuki Kobayashi, Takahiro Kanegae
-
Patent number: 10957705Abstract: A first memory die including an array of first memory stack structures and a logic die including a complementary metal oxide semiconductor (CMOS) circuit are bonded. The CMOS circuit includes a first peripheral circuitry electrically coupled to nodes of the array of first memory stack structures through a first subset of first metal interconnect structures included within the first memory die. A second memory die is bonded to the first memory die. The second memory die includes an array of second memory stack structures. The CMOS circuit includes a second peripheral circuitry electrically coupled to nodes of the array of second memory stack structures through a second subset of first metal interconnect structures included within the first memory die and through second metal interconnect structures included within the second memory die. The logic die provides peripheral devices that support operation of memory stack structures in multiple memory dies.Type: GrantFiled: December 24, 2018Date of Patent: March 23, 2021Assignee: SANDISK TECHNOLOGIES LLCInventors: Yuji Totoki, Shigehisa Inoue, Yuki Kasai, Hironori Matsuoka
-
Publication number: 20200376847Abstract: A liquid ejecting unit includes: a first chamber; a second chamber; a third chamber; a fourth chamber; a first liquid passage for supplying a first type of liquid to the first chamber and the third chamber; a second liquid passage for supplying a second type of liquid to the second chamber and the fourth chamber, the second type of liquid differing from the first type of liquid; a first fluid passage for supplying fluid to the first chamber and the second chamber; and a second fluid passage for supplying the fluid to the third chamber and the fourth chamber.Type: ApplicationFiled: May 28, 2020Publication date: December 3, 2020Inventors: Masahiko SATO, Hiroyuki HAGIWARA, Hironori MATSUOKA, Hiroyuki KOBAYASHI, Takahiro KANEGAE
-
Publication number: 20200203364Abstract: A first memory die including an array of first memory stack structures and a logic die including a complementary metal oxide semiconductor (CMOS) circuit are bonded. The CMOS circuit includes a first peripheral circuitry electrically coupled to nodes of the array of first memory stack structures through a first subset of first metal interconnect structures included within the first memory die. A second memory die is bonded to the first memory die. The second memory die includes an array of second memory stack structures. The CMOS circuit includes a second peripheral circuitry electrically coupled to nodes of the array of second memory stack structures through a second subset of first metal interconnect structures included within the first memory die and through second metal interconnect structures included within the second memory die. The logic die provides peripheral devices that support operation of memory stack structures in multiple memory dies.Type: ApplicationFiled: December 24, 2018Publication date: June 25, 2020Inventors: Yuji TOTOKI, Shigehisa Inoue, Yuki Kasai, Hironori Matsuoka
-
Patent number: 10654266Abstract: A liquid ejecting head includes a plurality of driving elements that causes an ejection of a liquid from a nozzle by causing a fluctuation in a pressure, a sealing body that seals a first space for accommodating the plurality of driving elements, a case member that forms a second space for surrounding the sealing body, an atmosphere vent that is formed in the case member and through which the second space communicates with the air, a communication hole that is formed in the sealing body and through which the first space communicates with the second space, and a moisture absorbent disposed in the second space.Type: GrantFiled: December 27, 2018Date of Patent: May 19, 2020Assignee: Seiko Epson CorporationInventors: Yoshinori Nakajima, Takahiro Kanegae, Hiroshige Owaki, Makoto Otsuki, Hironori Matsuoka
-
Patent number: 10639895Abstract: A liquid ejecting head includes head units each of which includes a corresponding head substrate and ejects liquid, flexible cables each of which has one end connected to the corresponding head substrate, and a common member including the head units that are fixed thereto. In the liquid ejecting head, when a first direction, a second direction, and a third direction are directions that orthogonally intersect each other and the common member is placed on a virtual surface defined by the first direction and the second direction and has a thickness extending in the third direction, the common member extends more in the first direction than in the second direction. In addition, a fixation region in which each of the flexible cables and the corresponding head substrate are fixed to each other extends more in the second direction than in the first direction when viewed in the third direction.Type: GrantFiled: June 13, 2018Date of Patent: May 5, 2020Assignee: Seiko Epson CorporationInventors: Fumiya Takino, Hironori Matsuoka
-
Patent number: 10625512Abstract: A liquid discharge apparatus including a liquid discharge head that discharges a liquid by vibrating a vibration plate by a drive element and changing a pressure in an internal space filled with the liquid, a pressurization supply unit that forcibly feeds the liquid into the liquid discharge head, and a controller that restricts drive of the drive element in accordance with a pressure condition in the liquid discharge head.Type: GrantFiled: June 29, 2018Date of Patent: April 21, 2020Assignee: Seiko Epson CorporationInventors: Yukimasa Ishida, Hironori Matsuoka
-
Publication number: 20200101733Abstract: A head unit includes circulation heads disposed at different positions on an XY plane, supply pipes configured to supply liquid to the circulation heads, discharge pipes configured to discharge the liquid from the circulation heads to the outside, and flow path members connecting the circulation heads, the supply pipes, and the discharge pipes. Each circulation head includes a nozzle plate having nozzles. The nozzles include first nozzles on one end side in the X direction and second nozzles on the other end side in the X direction. During circulation, the liquid pressure in the first nozzles is higher than the liquid pressure in the second nozzles, and when the head unit is viewed from the Z direction in plan view, the first nozzles are disposed on both ends in the X direction or the second nozzles are disposed on both ends in the X direction.Type: ApplicationFiled: September 26, 2019Publication date: April 2, 2020Inventors: Hiroyuki HAGIWARA, Katsuhiro OKUBO, Takahiro KANEGAE, Hironori MATSUOKA
-
Patent number: 10556437Abstract: A liquid ejecting apparatus includes a liquid path comprising a filter and a liquid storing chamber for supplying liquid to a liquid ejecting head. The liquid storing chamber has an inlet, a bubble retention space disposed above the inlet, a bottom disposed below the bubble retention space, and a first outlet and a second outlet. (i) The first outlet is located on one side of an imaginary center line passing through the center of a projected area, and the second outlet is located on the other side of the imaginary center line. Alternatively, (ii) the first outlet and the second outlet are located outside a projected area defined by projecting the bubble retention space onto the bottom.Type: GrantFiled: August 29, 2018Date of Patent: February 11, 2020Assignee: Seiko Epson CorporationInventors: Yoshinori Nakajima, Takahiro Kanegae, Hiroshige Owaki, Shigeki Suzuki, Hironori Matsuoka
-
Patent number: 10464338Abstract: A liquid discharge apparatus includes a casing, a liquid discharge head that includes a nozzle for discharging a liquid supplied from a liquid supply source provided in the casing, a waste liquid tank that accommodates in the casing a fluid emitted from the nozzle, and an outlet opening for emitting the fluid emitted from the nozzle to an outside of the casing without emitting the fluid into the waste liquid tank provided in the casing.Type: GrantFiled: October 11, 2017Date of Patent: November 5, 2019Assignee: Seiko Epson CorporationInventors: Manabu Hanakawa, Yukimasa Ishida, Hironori Matsuoka, Toshio Sukigara, Kazuhiro Yamato, Yasunori Kuramoto
-
Patent number: 10458552Abstract: A valve includes a valve seat having a hole configured as a flow path, a valve body configured to open/close the flow path due to relative movement with respect to the valve seat, an opening member having a first surface fixed to one of the valve seat and the valve body, a second surface configured to separate away and abut the other one of the valve seat and the valve body, a third surface which intersects the first and second surfaces, and an opening penetrating the first and second surfaces, a fixing member that fixes the first surface to the one of the valve seat and the valve body, and an inclined portion, which makes an interval between the one of the valve seat and the valve body and the first surface long in a direction from the opening to the third surface.Type: GrantFiled: July 28, 2017Date of Patent: October 29, 2019Assignee: Seiko Epson CorporationInventors: Yukimasa Ishida, Kenji Ochiai, Taiki Hanagami, Daisuke Noguchi, Hironori Matsuoka
-
Publication number: 20190193397Abstract: A liquid ejecting head includes a plurality of driving elements that causes an ejection of a liquid from a nozzle by causing a fluctuation in a pressure, a sealing body that seals a first space for accommodating the plurality of driving elements, a case member that forms a second space for surrounding the sealing body, an atmosphere vent that is formed in the case member and through which the second space communicates with the air, a communication hole that is formed in the sealing body and through which the first space communicates with the second space, and a moisture absorbent disposed in the second space.Type: ApplicationFiled: December 27, 2018Publication date: June 27, 2019Inventors: Yoshinori NAKAJIMA, Takahiro KANEGAE, Hiroshige OWAKI, Makoto OTSUKI, Hironori MATSUOKA
-
Publication number: 20190061364Abstract: A liquid ejecting apparatus includes a liquid path comprising a filter and a liquid storing chamber for supplying liquid to a liquid ejecting head. The liquid storing chamber has an inlet, a bubble retention space disposed above the inlet, a bottom disposed below the bubble retention space, and a first outlet and a second outlet. (i) The first outlet is located on one side of an imaginary center line passing through the center of a projected area, and the second outlet is located on the other side of the imaginary center line. Alternatively, (ii) the first outlet and the second outlet are located outside a projected area defined by projecting the bubble retention space onto the bottom.Type: ApplicationFiled: August 29, 2018Publication date: February 28, 2019Inventors: Yoshinori NAKAJIMA, Takahiro KANEGAE, Hiroshige OWAKI, Shigeki SUZUKI, Hironori MATSUOKA