Abstract: A composition for forming an organic film contains a polymer having a partial structure shown by the following general formula (1A) or (1B), and an organic solvent, where Ar1 and Ar2 represent a benzene ring or naphthalene ring which optionally have a substituent; X represents a single bond or methylene group; a broken line represents a bonding arm; R represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; and W1 represents a hydroxyl group, an alkyloxy group having 1 to 10 carbon atoms, or an organic group having at least one aromatic ring optionally having a substituent. A composition for forming an organic film, the composition containing a polymer with high carbon content and thermosetting property as to enable high etching resistance and excellent twisting resistance; a patterning process using the composition; and a polymer suitable for the composition for forming an organic film.

Abstract: A resist underlayer film material contains (A) a resin having a compound shown in the following general formula (1A), and (B) an organic solvent. Mw/Mn of the compound shown in the general formula (1A) is 1.00?Mw/Mn?1.25. This provides: a resist underlayer film material having all of favorable dry etching resistance, heat resistance to 500° C. or higher, and high filling and planarizing properties; and methods for forming a resist underlayer film and patterning processes which use the material.

Abstract: The present invention provides a resist underlayer film material used in a multilayer resist method, the material containing: (A) a resin having a structural unit shown by the following general formula (1); and (B) an organic solvent. The resin content is 20 mass % or more. This provides: a resist underlayer film material having excellent filling property and adhesiveness, and favorable planarizing property; and a patterning process and a method for forming a resist underlayer film which use the material.

Abstract: A resist composition is provided comprising (A) a metal compound having formula (A-1), a hydrolysate or hydrolytic condensate thereof, or the reaction product of the metal compound, hydrolysate or hydrolytic condensate thereof with a di- or trihydric alcohol having formula (A-2), and (B) a sensitizer containing a compound having formula (B-1). The resist composition is adapted to change a solubility in developer upon exposure to high-energy radiation, has high resolution and sensitivity, and forms a pattern of good profile with minimal edge roughness after exposure.

Abstract: The present invention is a material for forming an organic film, containing: (A) a compound for forming an organic film shown by the following general formula (1A); and (B) an organic solvent, where W1 represents a tetravalent organic group, n1 represents an integer of 0 or 1, n2 represents an integer of 1 to 3, and R1 represents any one or more of the following general formulae (1B). This provides an imide compound, where the compound is cured not only under air, but also under film formation conditions of inert gas, and can form an organic underlayer film having not only excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but also favorable film formation and adhesion to a substrate, and a material for forming an organic film containing the compound.

Abstract: A composition for forming an organic film contains a polymer having a partial structure shown by the following general formula (1A) or (1B), and an organic solvent, where Ar1 and Ar2 represent a benzene ring or naphthalene ring which optionally have a substituent; X represents a single bond or methylene group; a broken line represents a bonding arm; R represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; and W1 represents a hydroxyl group, an alkyloxy group having 1 to 10 carbon atoms, or an organic group having at least one aromatic ring optionally having a substituent. A composition for forming an organic film, the composition containing a polymer with high carbon content and thermosetting property as to enable high etching resistance and excellent twisting resistance; a patterning process using the composition; and a polymer suitable for the composition for forming an organic film.

Abstract: A composition for forming an organic film contains a polymer having a partial structure shown by the following general formula (1A), and an organic solvent. The polymer is crosslinked by dehydrogenative coupling reaction involving hydrogen atoms located at the trityl position on the fluorene ring in each partial structure.

Abstract: A resist underlayer film composition is excellent in resistance to a basic hydrogen peroxide aqueous solution in gap-filling and planarization characteristics having a dry etching characteristic; a patterning process and method for forming a resist underlayer film, wherein the resist underlayer film composition is used for a multilayer resist method, the composition comprising: (a1) one, or two or more, of a compound represented by following general formula (x); and (b) an organic solvent, wherein n01 represents an integer of 1 to 10; when n01 is 2, w represents a sulfinyl group, a sulfonyl group, an ether group, or a divalent organic group having 2 to 50 carbon atoms; when n01 is an integer other than 2, w represents an n01-valent organic group having 2 to 50 carbon atoms; and y represents a single bond or divalent connecting group having 1 to 10 carbon atoms and optionally having an oxygen atom.

Abstract: A resist composition is provided comprising (A) a metal compound having formula (A-1), a hydrolysate or hydrolytic condensate thereof, or the reaction product of the metal compound, hydrolysate or hydrolytic condensate thereof with a di- or trihydric alcohol having formula (A-2), and (B) a sensitizer containing a compound having formula (B-1). The resist composition is adapted to change a solubility in developer upon exposure to high-energy radiation, has high resolution and sensitivity, and forms a pattern of good profile with minimal edge roughness after exposure.

Abstract: A resist underlayer film composition is excellent in resistance to a basic hydrogen peroxide aqueous solution in gap-filling and planarization characteristics having a dry etching characteristic; a patterning process and method for forming a resist underlayer film, wherein the resist underlayer film composition is used for a multilayer resist method, the composition comprising: (a1) one, or two or more, of a compound represented by following general formula (x); and (b) an organic solvent, wherein n01 represents an integer of 1 to 10; when n01 is 2, w represents a sulfinyl group, a sulfonyl group, an ether group, or a divalent organic group having 2 to 50 carbon atoms; when n01 is an integer other than 2, w represents an n01-valent organic group having 2 to 50 carbon atoms; and y represents a single bond or divalent connecting group having 1 to 10 carbon atoms and optionally having an oxygen atom.

Abstract: The present invention provides a hot dip plated high strength steel sheet comprising a cold rolled steel sheet and a hot dip plated layer formed on the surface thereof, characterized in that the cold rolled steel sheet contains, by mass %, C: 0.0005 to 0.0050%, Si: over 0.3 to 1.0%, Mn: 0.70 to 2.0%, P: 0.05% or less, Ti: 0.010 to 0.050%, Nb: 0.010 to 0.040%, B: 0.0005 to 0.0030%, S: 0.010% or less, Al: 0.01 to 0.30%, and N: 0.0010 to 0.01%, and a balance of Fe and unavoidable impurities, and the cold rolled steel sheet has a value of TB* defined by the equation TB*=(0.11?[Ti])/(ln ([B]×10000)) of 0.03 to 0.06, and P is present in an amount of [P]?10×[B]+0.03, where [Ti] is the Ti content in mass percent, [B] is the B content in mass percent, and [P] is the P content in mass percent.

Abstract: The present invention provides hot dip plated high strength steel sheet for press forming use having a tensile strength of 380 MPa to less than 540 MPa, having a press formability able to be used for the automobile field, in particular fuel tank applications, and having superior secondary work embrittlement resistance and superior seam weld zone low temperature toughness and further superior plateability and a method of production of the same and provides hot dip plated high strength steel sheet for press forming use of the present invention having cold rolled steel sheet and a hot dip plated layer formed on the surface of said cold rolled steel sheet, characterized in that said cold rolled steel sheet contains, by mass %, C: 0.0005 to 0.0050%, Si: over 0.3 to 1.0%, Mn: 0.70 to 2.0%, P: 0.05% or less, Ti: 0.010 to 0.050%, Nb: 0.010 to 0.040%, B: 0.0005 to 0.0030%, S: 0.010% or less, Al: 0.01 to 0.30%, and N: 0.0010 to 0.

Abstract: A pressing cuff presses a pressure sensor above an artery. The level of the pressure applied to the pressure sensor is changed while the pulse wave is measured based on information about the pressure from the pressure sensor. In order to adjust the level of the applied pressure using the pressure of gas in the pressing cuff, a three-port valve and a two-port valve are controlled so that the connection is changed to establish a state of holding the amount of the gas in the pressing cuff. Then, the state is changed to a state of isolating and discharging gas in which a part of the held gas is isolated from the remaining amount of the gas to be discharged. Then, the state is changed to the state of holding the remaining amount of gas in the pressing cuff.

Abstract: A pulse wave measuring apparatus obtains the N-th derivative of a measured pulse waveform. The pulse waveform is classified into waveforms ?-? in accordance with the presence/absence of a shoulder (inflection point) at a rising phase of a pulse waveform of one beat, and also in accordance with the presence/absence of a shoulder in a falling phase. In each classified waveform, each calculated characteristic point of the N-th derivative corresponds to a traveling wave or reflected wave. The pulse wave measuring apparatus can calculate an AI value or the like that is the characteristic value of a pulse wave using such characteristic points and calculation equation of each waveform.

Abstract: A pulse wave measuring apparatus extracts a direct current component from a pressure value obtained from a sensor pressure, and defines the pressurization force of the cuff as the optimum pressurization force when that direct current component is stable. Following determination of the optimum pressurization force, the pulse wave measuring apparatus monitors whether the direct current component obtained from the pressure sensor is optimum or not, and adjusts the pressure, when not. By determining the rising sharpness of the peak and waveform distortion in the sphygmographic waveform, determination is made whether the pressurization force of the cuff is appropriate or not to carry out further adjustment of pressure, as necessary.

Abstract: A sensor array having a plurality of pressure sensors arranged on a measurement surface, a pressurization portion for pressing the sensor array laid across an artery of a living body, a sensor signal selection portion for selecting a pressure signal among pressure signals from the plurality of pressure sensors, a filter portion having a cutoff frequency variable corresponding to an instruction, and a filter control portion for providing an instruction to vary a value of the cutoff frequency are included. The filter control portion switches the cutoff frequency in a situation wherein a plurality of pressure signals respectively obtained from the plurality of pressure sensors are successively switched and output by the sensor signal selection portion to specify the pressure sensor for pulse wave detection, and in a situation wherein the pulse wave is detected from the specified pressure sensor.

Abstract: A pressure sensor for detecting a pulse wave, a digital conversion unit for converting a pressure signal from the pressure sensor into a digital signal, and a fourth derivative filter having an adjustable frequency characteristic for obtaining a fourth derivative wave of an original waveform based on the digital signal generated by the conversion by the digital conversion unit are provided. Local extrema of the fourth derivative wave in a section of the pulse wave corresponding to one beat are calculated. Based on the calculated local extrema, an early systolic component and a late systolic component are calculated.

Abstract: A sensor unit is brought into contact with a surface of a living body to detect a pulse wave of an artery directly below. A CPU extracts a characteristic point of the pulse wave detected and obtains a second systolic component in the pulse wave using the characteristic point extracted. Then, a variation with time in a systolic blood pressure of a central artery of the living body is estimated using the second systolic component obtained, and an estimated variation with time in the systolic blood pressure is displayed on a display portion. For estimation of the systolic blood pressure, arithmetic with a linear transformation is applied using the second systolic component obtained and a blood pressure of a peripheral artery which is measured beforehand with an electronic sphygmomanometer.

Abstract: A pressure sensor for detecting a pulse wave, a digital conversion unit for converting a pressure signal from the pressure sensor into a digital signal, and a fourth derivative filter having an adjustable frequency characteristic for obtaining a fourth derivative wave of an original waveform based on the digital signal generated by the conversion by the digital conversion unit are provided. Local extrema of the fourth derivative wave in a section of the pulse wave corresponding to one beat are calculated. Based on the calculated local extrema, an early systolic component and a late systolic component are calculated.

Abstract: A sensor array having a plurality of pressure sensors arranged on a measurement surface, a pressurization portion for pressing the sensor array laid across an artery of a living body, a sensor signal selection portion for selecting a pressure signal among pressure signals from the plurality of pressure sensors, a filter portion having a cutoff frequency variable corresponding to an instruction, and a filter control portion for providing an instruction to vary a value of the cutoff frequency are included. The filter control portion switches the cutoff frequency in a situation wherein a plurality of pressure signals respectively obtained from the plurality of pressure sensors are successively switched and output by the sensor signal selection portion to specify the pressure sensor for pulse wave detection, and in a situation wherein the pulse wave is detected from the specified pressure sensor.