Patents by Inventor Hiroomi Hanai

Hiroomi Hanai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9755207
    Abstract: The present invention relates to a pressure-sensitive adhesive tape for battery containing: a substrate; and a pressure-sensitive adhesive layer provided on at least one side of the substrate, in which the pressure-sensitive adhesive tape has a thickness change ratio of 20% or less after immersion in a mixed solvent of ethylene carbonate/diethyl carbonate [former/latter (volume ratio)=1/1] at 60° C. for 8 hours; and a 180° peeling adhesive strength (against aluminum foil, peel temperature: 25° C., peel rate: 300 mm/minute) of 0.5 N/10 mm or more after the above immersion.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: September 5, 2017
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shigeki Kawabe, Yuichi Takamura, Jun Iwata, Hiroomi Hanai
  • Publication number: 20150291859
    Abstract: Provided is a pressure-sensitive adhesive tape for electrochemical devices according to the present invention. The adhesive tape is for use in electrochemical device production and includes a substrate and a pressure-sensitive adhesive layer. The adhesive layer is disposed on or over at least one side of the substrate and contains an acrylic polymer as a base polymer. The adhesive tape has a first and a second 180° peel adhesion strength. The first 180° peel adhesion strength is measured at 25° C. and a peeling speed of 300 mm/min after bonded to a SUS 304BA plate at a temperature of from 40° C. to below 150° C. The second 180° peel adhesion strength is measured at 25° C. and a peeling speed of 300 mm/min after bonded to a SUS 304BA plate at 25° C. The first 180° peel adhesion strength is twice or more as high as the second 180° peel adhesion strength.
    Type: Application
    Filed: October 25, 2013
    Publication date: October 15, 2015
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuichi Takamura, Shigeki Kawabe, Hiroomi Hanai
  • Publication number: 20130071740
    Abstract: The present invention relates to a pressure-sensitive adhesive tape for battery containing: a substrate and a pressure-sensitive adhesive layer laminated on at least one surface of a substrate, in which the pressure-sensitive adhesive layer is laminated on the substrate, 0.5 mm or more inside from both edges of the substrate, and in which the pressure-sensitive adhesive tape has a 180° peeling pressure-sensitive adhesive force at 23° C. being 0.1 N/10 mm or more, and has a slippage distance after a pressure-sensitive adhesive layer side of the pressure-sensitive adhesive tape is attached to a phenolic resin plate (attaching area: 10 mm×20 mm), followed by applying a load of 500 g thereto at 40° C. for 1 hour being 0.2 mm or less.
    Type: Application
    Filed: September 13, 2012
    Publication date: March 21, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuichi TAKAMURA, Hiroomi HANAI, Shigeki KAWABE, Jun IWATA
  • Publication number: 20130023419
    Abstract: Provided is a covering material, in which the covering material is a covering material for covering a superconducting wire, a tensile strength at break thereof at ?196° C. is 12.0 N/3 mm or more, and a tensile elongation at break thereof at ?196° C. is 12% or more. The covering material preferably includes a backing made of a polyimide resin. The covering material preferably includes a viscoelastic layer formed on one surface of the backing.
    Type: Application
    Filed: July 6, 2012
    Publication date: January 24, 2013
    Applicants: NITTO SHINKO CORPORATION, NITTO DENKO CORPORATION
    Inventors: Kiichiro MATSUSHITA, Hiroomi HANAI, Kazunori HAYASHI, Jun FUJIKI, Akihiro OOHASHI, Kayoko TAKAYANAGI, Kazumasa MUKOBATA, Yoshinori TANAKA
  • Publication number: 20130008685
    Abstract: Provided is a covering material, which includes a backing having an upper surface and a lower surface opposite to the upper surface, and a viscoelastic layer formed on the upper surface of the backing, in which the covering material is a covering material for covering a rectangular electric wire, and an adhesive force of the viscoelastic layer to the lower surface of the backing as measured by peeling at a peeling angle of 180° and a tensile rate of 300 mm/min is 0.05 N/20 mm or more and 10 N/20 mm or less. A covered rectangular electric wire includes the covering material and a rectangular electric wire covered with the covering material. An electrical device is produced by using the covered rectangular electric wire.
    Type: Application
    Filed: July 6, 2012
    Publication date: January 10, 2013
    Applicants: NITTO SHINKO CORPORATION, NITTO DENKO CORPORATION
    Inventors: Kiichiro MATSUSHITA, Hiroomi HANAI, Kazunori HAYASHI, Jun FUJIKI, Akihiro OOHASHI, Kayoko TAKAYANAGI, Kazumasa MUKOBATA
  • Publication number: 20120270036
    Abstract: To provide a pressure-sensitive adhesive tape for an electrochemical device that has an extremely low water content, that is unlikely to lead to “adhesive protrusion”, and that is not removed even when it is in contact with an electrolytic solution. The pressure-sensitive adhesive tape for an electrochemical device of the present invention includes a pressure-sensitive adhesive layer composed of an acrylic pressure-sensitive adhesive on at least one side of a plastic base, and is characterized by including the pressure-sensitive adhesive layer having a gel content of 60% or more and a thickness of 1 to 15 ?m, and by having a water absorption rate of 0.2% or less after immersion in water at 23° C. for 24 hours.
    Type: Application
    Filed: October 6, 2011
    Publication date: October 25, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuyuki KIUCHI, Hiroomi HANAI, Shigeki KAWABE, Michirou KAWANISHI
  • Publication number: 20120270042
    Abstract: To provide a pressure-sensitive adhesive tape for an electrochemical device that has an excellent adhesive strength and that achieves, for example, the protection of an electrode, the suppression of active material separation, and the fixing of a wound end of a laminate composed of electrode plates, a separator, and the like when the laminate is wound and packed into a battery case, without adversely affecting the electrochemical device. The pressure-sensitive adhesive tape for an electrochemical device of the present invention includes a pressure-sensitive adhesive layer composed of an acrylic pressure-sensitive adhesive on at least one side of a plastic base. The acrylic pressure-sensitive adhesive includes an acrylic polymer that is obtained by polymerization of a monomer component containing at least an alkyl(meth)acrylate and a hydroxyl group-containing monomer. The acrylic polymer has an acid value of 1.0 or less and a glass transition temperature (TO of ?40° C. or more.
    Type: Application
    Filed: October 6, 2011
    Publication date: October 25, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hiroomi HANAI, Michirou KAWANISHI
  • Publication number: 20120219835
    Abstract: The present invention relates to a pressure-sensitive adhesive tape for battery containing: a substrate; and a pressure-sensitive adhesive layer provided on at least one side of the substrate, in which the pressure-sensitive adhesive tape has a thickness change ratio of 20% or less after immersion in a mixed solvent of ethylene carbonate/diethyl carbonate [former/latter (volume ratio)=1/1] at 60° C. for 8 hours; and a 180° peeling adhesive strength (against aluminum foil, peel temperature: 25° C., peel rate: 300 mm/minute) of 0.5 N/10 mm or more after the above immersion.
    Type: Application
    Filed: February 27, 2012
    Publication date: August 30, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shigeki KAWABE, Yuichi TAKAMURA, Jun IWATA, Hiroomi HANAI
  • Publication number: 20120107573
    Abstract: The present invention relates to a pressure-sensitive adhesive tape for a battery, containing: a substrate; and a pressure-sensitive adhesive layer laminated on at least one surface of the substrate, in which the pressure-sensitive adhesive layer contains a rubber component in the content of 70 wt % or more, and the rubber component has a weight average molecular weight of 300,000 to 5,000,000, and in which the pressure-sensitive adhesive layer is laminated at an inner portion of 0.5 mm or more from both edges of the substrate, with a thickness of 1 to 25 ?m.
    Type: Application
    Filed: October 28, 2011
    Publication date: May 3, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Jun Iwata, Hiroomi Hanai, Toshio Shintani
  • Publication number: 20120058335
    Abstract: The present invention relates to a pressure-sensitive adhesive tape for a non-aqueous battery, containing: a substrate and a pressure-sensitive adhesive layer on at least one side of the substrate, in which the pressure-sensitive adhesive layer contains 90 wt % or more of a polyisobutylene rubber, and in which a content of a polyisobutylene rubber having a molecular weight of 800,000 to 2,200,000 is in the range of 15 to 50 wt % based on the entire pressure-sensitive adhesive layer, a content of a polyisobutylene rubber having a molecular weight of 10,000 to 700,000 is in the range of 35 to 70 wt % based on the entire pressure-sensitive adhesive layer, and a content of a component having a molecular weight of 10,000 or less is 5 wt % or less based on the entire pressure-sensitive adhesive layer.
    Type: Application
    Filed: August 26, 2011
    Publication date: March 8, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mitsuru KAMITANI, Jun IWATA, Hiroomi HANAI, Tadashi TERASHIMA
  • Publication number: 20120052295
    Abstract: The present invention relates to a pressure-sensitive adhesive tape for protecting an electrode plate, containing: a substrate, and a pressure-sensitive adhesive layer provided on at least one side of a the substrate, in which the pressure-sensitive adhesive tape has a piercing resistance, obtained by the following calculation method, of 300 gf·mm or more; and has a heat shrinkage ratio, when heating is performed at 260° C. for 1 hour, of 1.0% or less in both of TD (width) direction and MD (length) direction, and in which the calculation method contains fixing the pressure-sensitive adhesive tape to a fixing plate in which a circular hole having a diameter of 11.28 mm is formed, piercing a needle of which the end of has a curvature radius of 0.5 mm to the pressure-sensitive adhesive tape at a speed of 2 mm/s under condition of 23±2° C.
    Type: Application
    Filed: August 29, 2011
    Publication date: March 1, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Jun IWATA, Mitsuru KAMITANI, Hiroomi HANAI
  • Patent number: 6773533
    Abstract: A manufacturing method of a ceramic green sheet comprising steps of; forming a predetermined electrode pattern on an adhesive layer separable by being heated or an adhesive layer separable by being cured with UV of a carrier sheet, wherein the carrier sheet comprising the separable adhesive layer on one side of a base film, and forming a ceramic green sheet with a ceramic slurry on the separable adhesive layer with the electrode pattern formed thereon. The electrodes in the ceramic green sheet obtained may be formed with good patterning accuracy and the carrier sheet may easily separated after formation of the ceramic green sheet.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: August 10, 2004
    Assignee: Nitto Denko Corporation
    Inventor: Hiroomi Hanai
  • Patent number: 6607827
    Abstract: A flame-retardant pressure-sensitive adhesive composition having both excellent tackiness and flame retardancy is described which comprises, as flame-retardants, (A) ethylenebispentabromobiphenyl, and (B) a brominated bisphenol and (C) antimony trioxide and, as a base polymer, (D) an acrylic polymer, said flame-retardant components (A), (B) and (C), in terms of weight ratio, satisfying the following equations: 2≦[(A)+(B)]/(C)≦6 and (B)≦(A), and said [(A)+(B)] being added in an amount of from 30 to 90 parts by weight and said (B) being added in an amount of 15 parts by weight or greater, each based on 100 parts by weight of the base polymer (D); and a flame-retardant pressure-sensitive adhesive tape using the composition and electronic parts or a transformer utilizing the tape are also described.
    Type: Grant
    Filed: November 16, 2001
    Date of Patent: August 19, 2003
    Assignee: Nitto Denko Corporation
    Inventor: Hiroomi Hanai
  • Publication number: 20020164469
    Abstract: A manufacturing method of a ceramic green sheet comprising steps of; forming a predetermined electrode pattern on an adhesive layer separable by being heated or an adhesive layer separable by being cured with UV of a carrier sheet, wherein the carrier sheet comprising the separable adhesive layer on one side of a base film, and forming a ceramic green sheet with a ceramic slurry on the separable adhesive layer with the electrode pattern formed thereon. The electrodes in the ceramic green sheet obtained may be formed with good patterning accuracy and the carrier sheet may easily separated after formation of the ceramic green sheet.
    Type: Application
    Filed: March 5, 2002
    Publication date: November 7, 2002
    Inventor: Hiroomi Hanai
  • Publication number: 20020102401
    Abstract: A flame-retardant pressure-sensitive adhesive composition having both excellent tackiness and flame retardancy is described which comprises, as flame-retardants, (A) ethylenebispentabromobiphenyl, and (B) a brominated bisphenol and (C) antimony trioxide and, as a base polymer, (D) an acrylic polymer, said flame-retardant components (A), (B) and (C), in terms of weight ratio, satisfying the following equations:
    Type: Application
    Filed: November 16, 2001
    Publication date: August 1, 2002
    Applicant: NITTO DENKO CORPORATION
    Inventor: Hiroomi Hanai
  • Patent number: 5441810
    Abstract: An adhesive sheet comprising a substrate having formed on one surface or both surfaces thereof a rubber-like elastic layer, a heat-expandable layer, and an adhesive layer in the order from the substrate side.
    Type: Grant
    Filed: February 28, 1994
    Date of Patent: August 15, 1995
    Assignee: Nitto Denko Corporation
    Inventors: Kaoru Aizawa, Toshiyuki Ohshima, Hiroomi Hanai, Naoki Okochi