Abstract: A crawler type traveling body includes a drive wheel, an in-wheel motor incorporated in the drive wheel, a plurality of rotating wheels disposed below the drive wheel, a crawler, and a tensioner. The crawler is wound around the drive wheel and the rotating wheels and configured to be rotated by the drive wheel. The tensioner is coupled to a drive shaft of the in-wheel motor and configured to press the drive wheel against the crawler and apply tension to the crawler.

Abstract: A temperature control method of controlling a temperature of a semiconductor wafer mounted on a mounting table includes a supply process of supplying, in a state that a supply of a power to a heater configured to heat the mounting table is stopped or the power is maintained to be constant, a heat transfer gas into a gap between the semiconductor wafer and the mounting table; a measurement process of measuring a temperature variation of the mounting table due to heat exchange between the semiconductor wafer and the mounting table through the heat transfer gas; a calculation process of calculating a correction value based on the temperature variation of the mounting table; and a control process of starting the supply of the power and controlling the power such that the temperature of the mounting table reaches a target temperature corrected with the correction value.

Abstract: A substrate processing apparatus 10 applies pressure to a substrate 2 which is an object to be pressurized arranged on an upper jig plate 44. The substrate processing apparatus 10 includes a lower jig plate 46 arranged below the upper jig plate 44, an installation base 47 provided on the lower jig plate 46 and the substrate 2 is arranged; and the installation base is temporarily fixed to the installation base 47 in a deformable manner.

Abstract: Provided is a substrate processing apparatus capable applying a uniform load to an object to be pressurized. The substrate processing apparatus includes a lower jig plate 46 for arranging a substrate 2 which is an object to be pressurized, an upper jig plate 44 applying pressure to the substrate 2 arranged to the lower jig plate 46, and a support member 45 supporting the lower jig plate 46 and providing a support force to the lower jig plate 46 in accordance with a in-plane distribution of a load applied to the lower jig plate 46.

Abstract: A substrate processing apparatus 10 having a lower jig plate 46 for arranging a substrate 2 as an object to be pressurized, a support member 45 including an installation portion 52 for installing columnar members 50 supporting the lower jig plate 46, in which the columnar members 50 are placed to the installation portion 52 in accordance with a in-plane distribution of a load applied to the lower jig plate 46.

Abstract: A substrate processing apparatus including a lower jig plate for arranging a substrate which is an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members.

Abstract: An element array pressurizing device has a pressurizing plate having a pressurizing unit that pressurizes an element array comprising a plurality of elements disposed on a mounting substrate. The pressurizing unit has a plate-shaped hard material for which a surface precision is higher than that of a surface of the pressurizing plate.

Abstract: A display control device includes a receiver configured to receive data indicating a movement of an object and data indicating a direction of a face or a body of the object, that are detected based on moving image data, and a display controller configured to output graphic data each representing a position of the object, a moving direction of the object, and the direction of the face or the body of the object, at each time point in the moving image data.

Abstract: A transfer device can have a high durability and no limit in an operation of an arm member. An electrostatic pick 44 of a first transfer device 17 is advanced into a process module 12, and a wafer W is electrostatically attracted to and held on the electrostatic pick 44. While the wafer W is being transferred into a load lock module 14 by driving the first transfer device 17, the electrostatic pick 44 is turned into an electrically floating state, so that a state in which the wafer W is electrostatically attracted to and held on the electrostatic pick 44 is maintained. After the transferring of the wafer W to the load lock module 14 is completed, charges of the electrostatic pick 44 are neutralized, so that the wafer W is not electrostatically attracted to and held on the electrostatic pick 44.

Abstract: A semiconductor device includes a wiring substrate provided with a plurality of pads electrically connected to a semiconductor chip in a flip-chip interconnection. The wiring substrate includes a pad forming layer in which a signal pad configured to receive transmission of a first signal and a second pad configured to receive transmission of a second signal different from the first signal are formed and a first wiring layer located at a position closest to the pad forming layer. In the wiring layer, a via land overlapping with the signal pad, a wiring connected to the via land, and a wiring connected to the second pad and extending in an X direction are formed. In a Y direction intersecting the X direction, a width of the via land is larger than a width of the wiring. A wiring is adjacent to the via land and overlaps with the signal pad.

Abstract: A temperature control method of controlling a temperature of a semiconductor wafer mounted on a mounting table includes a supply process of supplying, in a state that a supply of a power to a heater configured to heat the mounting table is stopped or the power is maintained to be constant, a heat transfer gas into a gap between the semiconductor wafer and the mounting table; a measurement process of measuring a temperature variation of the mounting table due to heat exchange between the semiconductor wafer and the mounting table through the heat transfer gas; a calculation process of calculating a correction value based on the temperature variation of the mounting table; and a control process of starting the supply of the power and controlling the power such that the temperature of the mounting table reaches a target temperature corrected with the correction value.

Abstract: A temperature control method of controlling a temperature of a semiconductor wafer mounted on a mounting table includes a supply process of supplying, in a state that a supply of a power to a heater configured to heat the mounting table is stopped or the power is maintained to be constant, a heat transfer gas into a gap between the semiconductor wafer and the mounting table; a measurement process of measuring a temperature variation of the mounting table due to heat exchange between the semiconductor wafer and the mounting table through the heat transfer gas; a calculation process of calculating a correction value based on the temperature variation of the mounting table; and a control process of starting the supply of the power and controlling the power such that the temperature of the mounting table reaches a target temperature corrected with the correction value.

Abstract: In a biological signal measurement system of this invention, biological digital data is generated from a biological signal measured by a biological signal measurement apparatus, and first feature amount data extracted from the biological digital data and downsized biological digital data are transmitted to a portable terminal. In a biological information measurement apparatus of this invention, biological feature amount data is extracted from measured biological waveform data, and at least one of the biological waveform data and the biological feature amount data is transmitted to an external device. It is possible to provide a biological signal measurement system capable of continuously measuring a biological signal for a long time without disturbing daily life and provide a biological information measurement apparatus capable of implementing downsizing and long life of a battery.

Abstract: A display control device includes a receiver configured to receive data indicating a movement of an object and data indicating a direction of a face or a body of the object, that are detected based on moving image data, and a display controller configured to output graphic data each representing a position of the object, a moving direction of the object, and the direction of the face or the body of the object, at each time point in the moving image data.

Abstract: A heartbeat detection device includes a peak search unit (4) for searching for one of a peak at which a value M obtained from a sampling data sequence of an electrocardiographic waveform of a living body changes from an increase to a decrease and a peak at which the value M changes from a decrease to an increase, and a heartbeat time determination unit (5) for checking the value M in a predetermined time domain before a time of the peak and the value M in a predetermined time domain after the time of the peak, and setting the time of the peak as a heartbeat time if differences between the value M at the time of the peak and the values M in the predetermined time domains are not smaller than a predetermined amount.

Abstract: A transfer device can have a high durability and no limit in an operation of an arm member. An electrostatic pick 44 of a first transfer device 17 is advanced into a process module 12, and a wafer W is electrostatically attracted to and held on the electrostatic pick 44. While the wafer W is being transferred into a load lock module 14 by driving the first transfer device 17, the electrostatic pick 44 is turned into an electrically floating state, so that a state in which the wafer W is electrostatically attracted to and held on the electrostatic pick 44 is maintained. After the transferring of the wafer W to the load lock module 14 is completed, charges of the electrostatic pick 44 are neutralized, so that the wafer W is not electrostatically attracted to and held on the electrostatic pick 44.

Abstract: A transfer device can have a high durability and no limit in an operation of an arm member. An electrostatic pick 44 of a first transfer device 17 is advanced into a process module 12, and a wafer W is electrostatically attracted to and held on the electrostatic pick 44. While the wafer W is being transferred into a load lock module 14 by driving the first transfer device 17, the electrostatic pick 44 is turned into an electrically floating state, so that a state in which the wafer W is electrostatically attracted to and held on the electrostatic pick 44 is maintained. After the transferring of the wafer W to the load lock module 14 is completed, charges of the electrostatic pick 44 are neutralized, so that the wafer W is not electrostatically attracted to and held on the electrostatic pick 44.

Abstract: A semiconductor device includes a wiring substrate provided with a plurality of pads electrically connected to a semiconductor chip in a flip-chip interconnection. The wiring substrate includes a pad forming layer in which a signal pad configured to receive transmission of a first signal and a second pad configured to receive transmission of a second signal different from the first signal are formed and a first wiring layer located at a position closest to the pad forming layer. In the wiring layer, a via land overlapping with the signal pad, a wiring connected to the via land, and a wiring connected to the second pad and extending in an X direction are formed. In a Y direction intersecting the X direction, a width of the via land is larger than a width of the wiring. A wiring is adjacent to the via land and overlaps with the signal pad.

Abstract: An optical modulator driver circuit (1) includes an amplifier (50, Q10, Q11, R10-R13), and a current amount adjustment circuit (51) capable of adjusting a current amount of the amplifier (50) in accordance with a desired operation mode. The current amount adjustment circuit (51) includes at least two current sources (IS10) that are individually ON/OFF-controllable in accordance with a binary control signal representing the desired operation mode.

Abstract: A wide-angle lens includes a first lens group, an aperture stop, a second lens group, and a third lens group. The first lens group has positive refractive power. The second lens group has negative refractive power. The third lens group has positive refractive power. The first lens group, the aperture stop, the second lens group, and the third lens group are disposed in order from the object side toward image side. The first lens group includes a negative lens and at least one cemented lens, the negative lens being disposed on most-object side and has a convex surface facing the object side. The following conditional expression is satisfied, 0.5<f1/f<1.0??(1) where f1 is a focal distance of the first lens group in a condition that infinite is in focus, and f is a focal distance of a whole system in the condition that the infinite is in focus.