Abstract: Disclosed are novel high-sensitivity positive- and negative-working chemical-sensitization photoresist compositions capable of giving a highly heat-resistant patterned resist layer of high resolution having excellently orthogonal cross sectional profile without being influenced by standing waves. The composition contains, as an acid generating agent by irradiation with actinic rays, a specific cyano-substituted oximesulfonate compound such as .alpha.-(methylsulfonyloxyimino)-4-methoxybenzyl cyanide. The advantages obtained by the use of this specific acid-generating agent is remarkable when the film-forming resinous ingredient has such a molecular weight distribution that the ratio of the weight-average molecular weight to the number-average molecular weight does not exceed 3.5.

Abstract: Disclosed is a novel positive-working or negative-working chemical-sensitization photoresist composition useful in the photolithographic patterning works for the manufacture of electronic devices. The photoresist composition is characterized by a unique acid-generating agent capable of releasing an acid by the pattern-wise exposure of the resist layer to actinic rays so as to increase or decrease the solubility of the resist layer in an aqueous alkaline developer solution. The acid-generating agent proposed is a novel cyano group-containing oxime sulfonate di- or triester compound represented by the general formulaA?C(CN).dbd.N--O--SO.sub.2 --R!.sub.n,in which each R is, independently from the others, an unsubstituted or substituted monovalent hydrocarbon group such as alkyl groups, A is a divalent or tervalent organic group or, preferably, phenylene group and the subscript n is 2, when A is a divalent group, or 3, when A is a tervalent group or, preferably 2.

Abstract: A photosensitive resin composition comprising a high polymer binder, a monomer, a photopolymerization initiator generating a radical on exposure to visible light of a wavelength of 400 to 700 nm such as triazine compounds, titanocene compounds, or acridine compounds, an optically-activated acid generating agent generating an acid on exposure to light of a wavelength of 200 to 380 nm, and a color former developing a color in the presence of an acid, and a method manufacturing a printing master plate comprising the steps of exposing a photosensitive printing plate which has a laminated layer made from a photosensitive resin composition thereon to visible light of wavelength in the range of 400 to 600 nm selectively in an imagewise configuration in order to harden the resin composition layer, developing the photosensitive printing plate, and further exposing the developed plate to light of a wavelength in the range 200 to 380 nm.

Abstract: Disclosed is a novel and improved photoresist composition which comprises:(A) a film-forming resinous compound which is, in the presence of an acid, subject to a change in the solubility in an alkaline solution; and(B) an acid-generating agent capable of releasing an acid by the exposure to actinic rays which is an oxime sulfonate compound represented by the general formulaNC--CR.sup.1 .dbd.N--O--SO.sub.2 --R.sup.2,in which R.sup.1 and R.sup.2 are, each independently from the other, an unsubstituted or halogen-substituted monovalent aliphatic hydrocarbon group, e.g., alkyl, cycloalkyl, alkenyl and cycloalkenyl groups.

Abstract: Disclosed is a class of novel cyanooxime sulfonate compounds represented by the general formulaNC--CR.sup.1 .dbd.N--O--SO.sub.2 --R.sup.2,in which R.sup.1 and R.sup.2 are, each independently from the other, an unsubstituted or halogen-substituted monovalent aliphatic hydrocarbon group selected from the group consisting of alkyl, cycloalkyl, alkenyl and cycloalkenyl groups. The group R.sup.1 is preferably a cycloalkenyl group, e.g. 1-cyclopentenyl or 1-cyclohexenyl group, and R.sup.2 is preferably a lower alkyl group having 1 to 4 carbon atoms. The compound releases an acid by the irradiation with ultraviolet light and is useful as an acid generating agent in an acid-sensitive photoresist composition.

Abstract: A photosensitive resin composition for forming light shielding films is of particular utility in forming a black matrix for use in display elements such as of a CRT display, a liquid crystal panel, a plasma display and the like. The photosensitive resin composition is comprised of a photopolymerizable compound, a photopolymerization initiator, and light shielding materials composed of an oxide of copper and an oxide or oxides of at least one metal selected from iron, manganese, chromium, cobalt and nickel. The black matrix so obtained is conducive to high heat resistance, greatly light shielding and sharp image contrast as well as to excellent electrical insulation resistance. For use in the plasma display in particular, a black matrix is producible by coating of the photosensitive resin composition on a given substrate, followed by exposure of the coat to selective irradiation with active light rays to form a pattern therein and by subsequently burning of the pattern.

Abstract: A developing solution comprising (A) at least one aromatic hydrocarbon having a boiling point of from 150.degree. to 300.degree. C.; (B) at least one alcohol represented by the following formula (I):R.sup.1 OH (I)wherein R.sup.1 represents an aliphatic or alicyclic alkyl group having from 5 to 12 carbon atoms, --C.sub.n H.sub.2n Ar, --(C.sub.m H.sub.2m O).sub.p C.sub.q H.sub.2q+1, a furfuryl group or a hydrogenated furfuryl group, an alkyl group substituted by an acyl group or an epoxy group, or --CH.sub.2 CH.sub.2 (OCH.sub.2 CH.sub.2).sub.r OR.sup.2 ; in which Ar represents an aromatic group; n represents an integer of from 1 to 3; m represents an integer of from 2 to 6; p represents 1 or 2; q represents 0 or an integer of from 1 to 4; R.sup.2 represents a hydrogen atom or an alkyl group; and r represents 0, 1 or 2; and (C) at least one compound represented by the following formula (II): ##STR1## wherein R.sup.3 and R.sup.

Abstract: An integrated circuit connecting method that includes connecting electrode pads on an integrated circuit device to electrode terminals on a base with metal bumps interposed, the electrode terminals being formed in registry with the electrode pads.

Abstract: Disclosed is a novel aqueous developer solution used in the development treatment of an actinic ray-sensitive resist for the manufacture of, for example, semiconductor devices, which is capable of giving a patterned resist layer free from the troubles of film residue or scum deposition in any finest patterning. The developer solution contains, in addition to a nitrogen-containing organic basic compound, e.g., tetramethyl ammonium hydroxide, dissolved in an aqueous medium as the solvent, an anionic surface active agent which is a diphenyl ether compound having at least one ammonium sulfonate group, such as an ammonium alkyl diphenylether sulfonate, in a concentration of 0.05 to 5% by weight.

Abstract: A developing solution comprising (A) at least one aromatic hydrocarbon having a boiling point of from 150.degree. to 300.degree. C.; (B) at least one alcohol represented by the following formula (I):R.sup.1 OH (I)wherein R.sup.1 represents an aliphatic or alicyclic alkyl group having from 5 to 12 carbon atoms, --C.sub.n H.sub.2n Ar, --(C.sub.m H.sub.2m O).sub.p C.sub.q H.sub.2q+1, a furfuryl group or a hydrogenated furfuryl group, an alkyl group substituted by an acyl group or an epoxy group, or --CH.sub.2 CH.sub.2 (OCH.sub.2 CH.sub.2).sub.r OR.sup.2 ; in which Ar represents an aromatic group; n represents an integer of from 1 to 3; m represents an integer of from 2 to 6; p represents 1 or 2; q represents 0 or an integer of from 1 to 4; R.sup.2 represents a hydrogen atom or an alkyl group; and r represents 0, 1 or 2; and (C) at least one compound represented by the following formula (II): ##STR1## wherein R.sup.3 and R.sup.

Abstract: Disclosed is a photosensitive resin composition for use in a light-shielding film, comprising a photosensitive resin and a light-shielding coloring material, wherein light transmission properties after formation of the light-shielding film are controlled by the light-shielding coloring material so that (i) the light transmission through the light-shielding film is 1% or more in at least one wavelength of a light wavelength region of from 330 nm to less than 425 nm, and (ii) the light transmission through the light-shielding film is 2% or less in a light wavelength region of from 425 to 650 nm.

Abstract: Disclosed is a photosensitive resin composition for use in a light-shielding film, comprising a photosensitive resin and a light-shielding coloring material, wherein light transmission properties after formation of the light-shielding film are controlled by the light-shielding coloring material so that (i) the light transmission through the light-shielding film is 1% or more in at least one wavelength of a light wavelength region of from 330 nm to less than 425 nm, and (ii) the light transmission through the light-shielding film is 2% or less in a light wavelength region of from 425 to 650 nm.

Abstract: A method of bonding first and second circuit boards includes applying a light-sensitive adhesive over the first electrodes on a first circuit board and the areas where the first electrodes are not formed, and drying the applied adhesive to form a light-sensitive adhesive layer having the light-sensitive adhesive layer exposed selectively to active rays of light and performing development to remove only the light-sensitive adhesive layer on the first electrodes, and then performing a heat treatment to impart bonding quality to the light-sensitive adhesive layer remaining between adjacent first electrodes, placing the first and second circuit boards one on top of the other and thermocompressing the two circuit boards to have the first electrodes connected electrically to the second electrodes to form a single circuit board; and performing a heat treatment and/or exposure to active rays of light on the formed single circuit board.

Abstract: A positive type photosensitive composition capable of improving the drawback in the conventional positive type photosensitive resin composition, improving adhesion between the positive type photoresist and the substrate and improving developability is provided by incorporating benzotriazole carboxylic acids in the positive type photoresist.