Patents by Inventor Hiroshi Kotani

Hiroshi Kotani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11545473
    Abstract: A light-emitting device according to the present invention comprises: a mounting board; a plurality of light-emitting elements that each include a supporting substrate and a semiconductor structure layer, the supporting substrate being disposed on the mounting board, and the semiconductor structure layer being formed on the supporting substrate and including a light-emitting layer, a wavelength conversion member that covers the plurality of light-emitting elements above the light-emitting elements and converts a wavelength of a light emitted from the light-emitting layer; a translucent member that covers a lower surface of the wavelength conversion member and covers the semiconductor structure layer on the supporting substrate; and a resin member filled between the plurality of light-emitting elements, the resin member being formed of a resin material containing particles having a light reflectivity.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: January 3, 2023
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Kyotaro Koike, Ji-Hao Liang, Mitsunori Harada, Shunya Ide, Hiroshi Kotani, Soji Owada, Satoshi Ando
  • Patent number: 11404614
    Abstract: Provided is a light-emitting device having a plurality of light-emitting elements with high operation stability and light extraction efficiency. The light-emitting device includes: a light-emitting element; a translucent member which is disposed on the light-emitting element and has a columnar first portion having a bottom surface opposed to an upper surface of the light-emitting element, a second portion formed continuously with the first portion on the first portion and narrowed upward, and a columnar third portion formed continuously with the second portion on the second portion; and a reflective member configured to cover the side surfaces of the translucent member. In this light-emitting device, the height of the first portion of the translucent member in a direction perpendicular to the bottom surface thereof is ? or more the height of the translucent member in the direction perpendicular to the bottom surface.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: August 2, 2022
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Kyotaro Koike, Ji-Hao Liang, Mitsunori Harada, Kaori Tachibana, Shunya Ide, Hiroshi Kotani, Satoshi Ando
  • Publication number: 20210305216
    Abstract: A light-emitting device according to the present invention comprises: a mounting board; a plurality of light-emitting elements that each include a supporting substrate and a semiconductor structure layer, the supporting substrate being disposed on the mounting board, and the semiconductor structure layer being formed on the supporting substrate and including a light-emitting layer, a wavelength conversion member that covers the plurality of light-emitting elements above the light-emitting elements and converts a wavelength of a light emitted from the light-emitting layer; a translucent member that covers a lower surface of the wavelength conversion member and covers the semiconductor structure layer on the supporting substrate; and a resin member filled between the plurality of light-emitting elements, the resin member being formed of a resin material containing particles having a light reflectivity.
    Type: Application
    Filed: March 19, 2021
    Publication date: September 30, 2021
    Applicant: STANLEY ELECTRIC CO., LTD.
    Inventors: Kyotaro KOIKE, Ji-Hao LIANG, Mitsunori HARADA, Shunya IDE, Hiroshi KOTANI, Soji OWADA, Satoshi ANDO
  • Publication number: 20200365775
    Abstract: Provided is a light-emitting device having a plurality of light-emitting elements with high operation stability and light extraction efficiency. The light-emitting device includes: a light-emitting element; a translucent member which is disposed on the light-emitting element and has a columnar first portion having a bottom surface opposed to an upper surface of the light-emitting element, a second portion formed continuously with the first portion on the first portion and narrowed upward, and a columnar third portion formed continuously with the second portion on the second portion; and a reflective member configured to cover the side surfaces of the translucent member. In this light-emitting device, the height of the first portion of the translucent member in a direction perpendicular to the bottom surface thereof is ? or more the height of the translucent member in the direction perpendicular to the bottom surface.
    Type: Application
    Filed: May 15, 2020
    Publication date: November 19, 2020
    Applicant: STANLEY ELECTRIC CO., LTD.
    Inventors: Kyotaro KOIKE, Ji-Hao LIANG, Mitsunori HARADA, Kaori TACHIBANA, Shunya IDE, Hiroshi KOTANI, Satoshi ANDO
  • Patent number: 10304996
    Abstract: A semiconductor light-emitting apparatus is constructed by a substrate; a semiconductor light-emitting element mounted on the substrate; a wavelength-converting structure, provided on the semiconductor light-emitting element, at least an outer edge portion of the wavelength-converting structure having an uneven top surface; and a white-light reflective layer provided on the substrate to surround sidewalls of the semiconductor light-emitting element and the wavelength-converting structure. The white-light reflective layer further includes an additional transparent resin layer excluding the reflective fillers on at least the outer edge portion of the wavelength-converting structure. The additional transparent resin layer is coupled to the transparent resin layer.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: May 28, 2019
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Takayoshi Yamane, Hiroshi Kotani
  • Patent number: 10290516
    Abstract: Provided is a substrate processing apparatus which may update an accumulated film thickness of each dummy substrate when a dummy substrate carrier is reloaded. The substrate processing apparatus includes: a process chamber where a plurality of substrates including a dummy substrate are processed; a substrate receiving unit whereon a dummy substrate carrier accommodating at least the dummy substrate is placed; a memory unit configured to store a film thickness of the dummy substrate in the dummy substrate carrier when the dummy substrate carrier is unloaded from the substrate receiving unit; and a management unit configured to update the film thickness of the dummy substrate in the dummy substrate carrier based on the film thickness stored in the memory unit when the dummy substrate carrier is reloaded onto the substrate receiving unit.
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: May 14, 2019
    Assignee: KOKUSAI ELECTRIC CORPOATION
    Inventors: Akihiko Yoneda, Hiroshi Kotani, Yasuhiro Mizuguchi
  • Patent number: 10269603
    Abstract: A substrate processing apparatus includes a process chamber configured to process a substrate, a carrier mounting part configured to mount a carrier which accommodates the substrate, the substrate capable of being brought into and out of the carrier when a door of the carrier mounted on the carrier mounting part is opened, a carrier opener configured to open and close the door of the carrier mounted on the carrier mounting part, a purge gas supply part configured to supply an inert gas into the carrier with the door kept opened, and a control part configured to perform control so as to carry out at least one inert gas purge among a load purge, an unload purge and a standby purge.
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: April 23, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yoshihiko Nakagawa, Hiroshi Kotani
  • Patent number: 10014453
    Abstract: A reliable semiconductor light-emitting device can include a mounting board, at least one semiconductor light-emitting chip mounted on the mounting board, a wavelength converting layer having a side surface covering the light-emitting chip, and a seal member having an opening contacting the side surface of the wavelength converting layer and covering chip electrodes. The light-emitting device can also include a transparent layer disposed into the opening of the sealing member so as to be located over the light-emitting chip and within a top surface of the light-emitting chip, and can be configured to emit various mixture lights having a high uniformity by using lights emitted from the light-emitting chip and the wavelength converting layer. Thus, the disclosed subject matter can provide the reliable light-emitting device, which can emit the mixture lights including a substantially white color light from a small light-emitting surface as a light source for a headlight, etc.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: July 3, 2018
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Hiroshi Kotani, Takaaki Sakai
  • Publication number: 20180158989
    Abstract: A semiconductor light-emitting apparatus is constructed by a substrate; a semiconductor light-emitting element mounted on the substrate; a wavelength-converting structure, provided on the semiconductor light-emitting element, at least an outer edge portion of the wavelength-converting structure having an uneven top surface; and a white-light reflective layer provided on the substrate to surround sidewalls of the semiconductor light-emitting element and the wavelength-converting structure. The white-light reflective layer further includes an additional transparent resin layer excluding the reflective fillers on at least the outer edge portion of the wavelength-converting structure. The additional transparent resin layer is coupled to the transparent resin layer.
    Type: Application
    Filed: November 20, 2017
    Publication date: June 7, 2018
    Applicant: STANLEY ELECTRIC CO., LTD.
    Inventors: Takayoshi YAMANE, Hiroshi KOTANI
  • Publication number: 20160189993
    Abstract: A substrate processing apparatus includes a process chamber configured to process a substrate, a carrier mounting part configured to mount a carrier which accommodates the substrate, the substrate capable of being brought into and out of the carrier when a door of the carrier mounted on the carrier mounting part is opened, a carrier opener configured to open and close the door of the carrier mounted on the carrier mounting part, a purge gas supply part configured to supply an inert gas into the carrier with the door kept opened, and a control part configured to perform control so as to carry out at least one inert gas purge among a load purge, an unload purge and a standby purge.
    Type: Application
    Filed: July 2, 2014
    Publication date: June 30, 2016
    Applicant: Hitachi Kokusai Electric Inc.
    Inventors: Yoshihiko NAKAGAWA, Hiroshi KOTANI
  • Publication number: 20150108523
    Abstract: A reliable semiconductor light-emitting device can include a mounting board, at least one semiconductor light-emitting chip mounted on the mounting board, a wavelength converting layer having a side surface covering the light-emitting chip, and a seal member having an opening contacting the side surface of the wavelength converting layer and covering chip electrodes. The light-emitting device can also include a transparent layer disposed into the opening of the sealing member so as to be located over the light-emitting chip and within a top surface of the light-emitting chip, and can be configured to emit various mixture lights having a high uniformity by using lights emitted from the light-emitting chip and the wavelength converting layer. Thus, the disclosed subject matter can provide the reliable light-emitting device, which can emit the mixture lights including a substantially white color light from a small light-emitting surface as a light source for a headlight, etc.
    Type: Application
    Filed: October 16, 2014
    Publication date: April 23, 2015
    Inventors: Hiroshi Kotani, Takaaki Sakai
  • Patent number: 8860061
    Abstract: A semiconductor light-emitting device, a method for manufacturing the same and a vehicle headlight can include the light-emitting device, which is composed of a light-emitting structure including a transparent plate, at least one semiconductor light-emitting chip and a wavelength converting layer between the transparent plate and the light-emitting chip to emit various colored lights including white light. The light-emitting device can also include a mounting board mounting the light-emitting structure and a frame thereon, a reflective material disposed between the frame and the light-emitting structure and the transparent material located on the reflective material to prevent an occurrence of oil-bleeding phenomenon. Thus, the disclosed subject matter can provide the light-emitting device having a high reliability for the vehicle headlight and the like, which can be maintained at a high quality even when they have been used for a long time under harsh conditions, and methods of manufacturing such devices.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: October 14, 2014
    Assignee: Stanley Electric Co., Ltd.
    Inventor: Hiroshi Kotani
  • Patent number: 8757826
    Abstract: A light-emitting device having an LED element and a resin layer including a convex portion covering the LED element can suppress color unevenness to achieve light emission with uniform color distribution. The light-emitting device can include a substrate, an LED element mounted on the substrate, a resin layer which contains a wavelength conversion material and is formed on the substrate to cover the LED element, the resin layer including a convex portion directly covering the LED element and a flat thin film portion extending around the convex portion, and a reflective portion which is formed over the thin film portion around the convex portion. A diffusion portion can be formed to cover the convex portion of the resin layer.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: June 24, 2014
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Takaaki Sakai, Hiroshi Kotani, Takahiko Nozaki
  • Patent number: 8746932
    Abstract: In the production of a light emitting device, in which a plurality of light emitting element parts carrying LED elements are formed on a substrate, and the substrate is diced, generation of shaving dusts is suppressed at the time of the dicing, and breakage of the substrate during the production process can be prevented. In the process of forming a slit crossing a region for forming a light emitting element part in a metal substrate, a recess which serves as a resin reservoir can be formed so as to cross the slit. The slit can be filled with an insulating material, the recess can be filled with a resin, and they both can be cured. A light emitting element part can be formed in the region for forming the light emitting element part, the metal substrate can be cut into units comprising one or a plurality of the light emitting element parts, and can be mounted on a printed circuit board on which a pattern is formed.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: June 10, 2014
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Shunya Ide, Masanori Sato, Takahiko Nozaki, Takaaki Sakai, Hiroshi Kotani
  • Patent number: 8546827
    Abstract: A light emitting device that can radiate heat generated by a semiconductor light emitting element and/or a resin layer at not only a position directly under the light emitting element, but also a position remote from such a position with respect to the main plane direction is provided. In the light emitting device, a light emitting element is carried on a substrate, and a resin covers the light emitting element. An anisotropic heat conduction material showing a heat conductivity for the substrate main plane direction larger than that for the substrate thickness direction is carried on the substrate. A side of the anisotropic heat conduction material contacts with the resin. Thereby, the anisotropic heat conduction material can receive heat of the resin, conduct it along the main plane direction, and radiate it to the substrate at a position remote from the light emitting element and/or the resin.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: October 1, 2013
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Takahiko Nozaki, Hiroshi Kotani
  • Publication number: 20130253689
    Abstract: Provided is a substrate processing apparatus which may update an accumulated film thickness of each dummy substrate when a dummy substrate carrier is reloaded. The substrate processing apparatus includes: a process chamber where a plurality of substrates including a dummy substrate are processed; a substrate receiving unit whereon a dummy substrate carrier accommodating at least the dummy substrate is placed; a memory unit configured to store a film thickness of the dummy substrate in the dummy substrate carrier when the dummy substrate carrier is unloaded from the substrate receiving unit; and a management unit configured to update the film thickness of the dummy substrate in the dummy substrate carrier based on the film thickness stored in the memory unit when the dummy substrate carrier is reloaded onto the substrate receiving unit.
    Type: Application
    Filed: March 19, 2013
    Publication date: September 26, 2013
    Applicant: Hitachi Kokusai Electric Inc.
    Inventors: Akihiko YONEDA, Hiroshi KOTANI, Yasuhiro MIZUGUCHI
  • Patent number: 8508118
    Abstract: A light-emitting device that suppresses color unevenness can be provided. A transparent member can be disposed on a fluorescence-containing resin layer. Part of excitation light can be emitted upward from an edge surface of the fluorescence-containing resin layer directly and without passing through the transparent member. Thus, fluorescent light emitted in large quantities from a place near an edge surface of the transparent member can be mixed with the excitation light emitted from the edge surface of the fluorescence-containing resin layer directly without passing through the transparent member, thereby suppressing color unevenness at a location near the edge surface of the transparent member.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: August 13, 2013
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Hiroshi Kotani, Takaaki Sakai
  • Patent number: 8436351
    Abstract: A ZnO-containing semiconductor layer contains Se added to ZnO and has an emission peak wavelength of ultraviolet light and an emission peak wavelength of visual light. By combining the ZnO-containing semiconductor layer with phosphor or a semiconductor which is excited by the emitted ultraviolet light and emits visual light, visual light at various wavelengths can be emitted.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: May 7, 2013
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Tomofumi Yamamuro, Michihiro Sano, Naochika Horio, Hiroyuki Kato, Akio Ogawa, Hiroshi Kotani
  • Patent number: 8373177
    Abstract: An LED light source can include protection members to protect bonding wires. The LED can include a substrate including electrode patterns, a sub mount substrate located on the substrate, at least one flip LED chip mounted on the sub mount substrate and a phosphor rein covering the LED chip. The bonding wires can connect each of the electrode patterns to conductor patterns connecting to electrodes of the LED chip. The protection members can be located so as to surround both sides of the bonding wires. In addition, because each height of the protection members is higher than each maximum height of the bonding wires and is lower than a height of the phosphor resin, the protection members can protect the bonding wires from external pressure while the light flux is not reduced. Thus, the disclosed subject matter can provide a reliable LED light source having a favorable light distribution.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: February 12, 2013
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Hiroshi Kotani, Takahiko Nozaki
  • Publication number: 20120242216
    Abstract: A light-emitting device that suppresses color unevenness can be provided. A transparent member can be disposed on a fluorescence-containing resin layer. Part of excitation light can be emitted upward from an edge surface of the fluorescence-containing resin layer directly and without passing through the transparent member. Thus, fluorescent light emitted in large quantities from a place near an edge surface of the transparent member can be mixed with the excitation light emitted from the edge surface of the fluorescence-containing resin layer directly without passing through the transparent member, thereby suppressing color unevenness at a location near the edge surface of the transparent member.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 27, 2012
    Inventors: Hiroshi KOTANI, Takaaki SAKAI