Abstract: A polyketone composition includes: (A) a polyketone having, in a main chain, a structural unit represented by the following Formula (I); and (B) an epoxy compound. In Formula (I), X represents a bivalent group that has from 1 to 50 carbon atoms and that may have a substituent group, Y represents a bivalent hydrocarbon group that has from 1 to 30 carbon atoms and that may have a substituent group, and n represents an integer from 1 to 1500.

Abstract: A polyketone composition contains: a polyketone containing a structural unit represented by the following Formula (I), and inorganic particles; in which a content of the inorganic particle is from 10 parts by mass to 70 parts by mass, based on 100 parts by mass of a total amount of the polyketone and the inorganic particles, and an average particle diameter of the inorganic particles is from 10 nm to 200 nm.

Abstract: An aromatic polyketone including, in a structural unit, at least one alicyclic skeleton and at least one carbon atom bound by two rotatable single bonds, or an aromatic polyketone including a structural unit represented by the following Formula (1), the following Formula (2), or the following Formula (4), and a structural unit represented by the following Formula (5) is provided.

Abstract: A polymer includes: a structural unit represented by the following Formula (I-1) and a structural unit represented by the following Formula (I-2). In Formulae (I-1) and (I-2), X and X? each independently represent a divalent group having 6 to 50 carbon atoms and containing an aromatic ring; Y represents a divalent group having 5 to 50 carbon atoms, the divalent group including an alicyclic ring and alkylene groups, and the alkylene groups each having 1 to 10 carbon atoms connecting carbon atoms included in carbonyl groups adjacent to Y with the alicyclic ring; Y? represents a divalent group having 3 to 50 carbon atoms and containing an alicyclic ring directly bonded to carbon atoms included in carbonyl groups adjacent to Y?; and m and n each represent an integer from 3 to 1,000.

Abstract: A polyketone composition includes: (A) a polyketone having, in a main chain, a structural unit represented by the following Formula (I); and (B) an epoxy compound. In Formula (I), X represents a bivalent group that has from 1 to 50 carbon atoms and that may have a substituent group, Y represents a bivalent hydrocarbon group that has from 1 to 30 carbon atoms and that may have a substituent group, and n represents an integer from 1 to 1500.

Abstract: The invention provides a photosensitive resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound that generates an acid by light, and (C) an acrylic resin having a group that crosslinks with the component (A), as well as a method for manufacturing a patterned cured film, and an electronic component prepared therewith.

Abstract: Provided is a method of manufacturing an aromatic polyketone film, the method including: applying a coating liquid to at least a part of a surface of a substrate to form a coating liquid layer, the coating liquid including a solvent and an aromatic polyketone having a structural unit represented by Formula (1) or (2); drying the coating liquid layer; and after the drying, subjecting the coating liquid layer to a heat treatment. In Formula (1) or (2), each R1 independently represents an alkyl group having 1 to 20 carbon atoms; each R2 and each R3 independently represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms; X represents a specific divalent aromatic hydrocarbon group, or a divalent alicyclic hydrocarbon group having 3 to 30 carbon atoms; and Y represents a specific divalent functional group.

Abstract: Provided is a method of manufacturing an aromatic polyketone film, the method including: applying a coating liquid to at least a part of a surface of a substrate to form a coating liquid layer, the coating liquid including a solvent and an aromatic polyketone having a structural unit represented by Formula (1) or (2); drying the coating liquid layer; and after the drying, subjecting the coating liquid layer to a heat treatment. In Formula (1) or (2), each R1 independently represents an alkyl group having 1 to 20 carbon atoms; each R2 and each R3 independently represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms; X represents a specific divalent aromatic hydrocarbon group, or a divalent alicyclic hydrocarbon group having 3 to 30 carbon atoms; and Y represents a specific divalent functional group.

Abstract: An aromatic polyketone including, in a structural unit, at least one alicyclic skeleton and at least one carbon atom bound by two rotatable single bonds, or an aromatic polyketone including a structural unit represented by the following Formula (1), the following Formula (2), or the following Formula (4), and a structural unit represented by the following Formula (5) is provided.

Abstract: A positive-type photosensitive resin composition includes (A) a phenol resin modified by a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms; (B) a compound that produces an acid by light; (C) a thermal crosslinking agent; and (D) a solvent. The positive-type photosensitive resin composition according to the present invention can be developed by an alkaline aqueous solution, and an effect thereof is that a resist pattern having sufficiently high sensitivity and resolution, excellent adhesion, and good thermal shock resistance can be formed.

Abstract: Provided is a method of manufacturing an aromatic polyketone film, the method including: applying a coating liquid to at least a part of a surface of a substrate to form a coating liquid layer, the coating liquid including a solvent and an aromatic polyketone having a structural unit represented by Formula (1) or (2); drying the coating liquid layer; and after the drying, subjecting the coating liquid layer to a heat treatment. In Formula (1) or (2), each R1 independently represents an alkyl group having 1 to 20 carbon atoms; each R2 and each R3 independently represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms; X represents a specific divalent aromatic hydrocarbon group, or a divalent alicyclic hydrocarbon group having 3 to 30 carbon atoms; and Y represents a specific divalent functional group.

Abstract: Disclosed is a photosensitive resin composition comprising (A) an alkali-soluble resin having a structural unit represented by the following formula (1), (B) a compound that generates an acid by light, (C) a thermal crosslinking agent, and (D) an acryl resin having a structural unit represented by the following formula (2): wherein R1 represents a hydrogen atom or a methyl group; R2 represents an alkyl group having 1 to 10 carbon atoms, or the like; and a represents an integer of 0 to 3, b represents an integer of 1 to 3, and the total of a and b is 5 or less, and wherein R3 represents a hydrogen atom or a methyl group; and R4 represents a hydroxyalkyl group having 2 to 20 carbon atoms.

Abstract: There is provided a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a compound which generates an acid when exposed to light, (C) a thermal crosslinking agent, and (D) a nitrogen-containing aromatic compound represented by the following formula (1): wherein R1 represents a hydrogen atom or a hydrocarbon group; R2 represents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto.

Abstract: Disclosed is a photosensitive resin composition comprising (A) an alkali-soluble resin having a structural unit represented by the following formula (1), (B) a compound that generates an acid by light, (C) a thermal crosslinking agent, and (D) an acryl resin having a structural unit represented by the following formula (2): wherein R1 represents a hydrogen atom or a methyl group; R2 represents an alkyl group having 1 to 10 carbon atoms, or the like; and a represents an integer of 0 to 3, b represents an integer of 1 to 3, and the total of a and b is 5 or less, and wherein R3 represents a hydrogen atom or a methyl group; and R4 represents a hydroxyalkyl group having 2 to 20 carbon atoms.

Abstract: The invention provides a photosensitive resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound that generates an acid by light, and (C) an acrylic resin having a group that crosslinks with the component (A), as well as a method for manufacturing a patterned cured film, and an electronic component prepared therewith.

Abstract: There is provided a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a compound which generates an acid when exposed to light, (C) a thermal crosslinking agent, and (D) a nitrogen-containing aromatic compound represented by the following formula (1): wherein R1 represents a hydrogen atom or a hydrocarbon group; R2 represents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto.

Abstract: The positive-type photosensitive resin composition according to the present invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound that produces an acid by light, a thermal crosslinking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.

Abstract: The positive-type photosensitive resin composition according to the present invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound that produces an acid by light, a thermal crosslinking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.

Abstract: The positive tone photosensitive composition of the invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound producing an acid by light, a thermal crosslinking agent and an acrylic resin. It is possible to provide a positive tone photosensitive composition that can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution, and can form a resist pattern with excellent adhesiveness and thermal shock resistance.

Abstract: A positive tone photosensitive composition comprising: (A) an alkali-soluble resin having a phenolic hydroxyl group; (B) a phenol resin modified by a compound having an unsaturated hydrocarbon group containing 4 to 100 carbon atoms; (C) a compound that generates an acid by the action of light; (D) a thermal cross-linker that crosslinks the ingredient (A) and the ingredient (B) by heating; and (E) a solvent.