Abstract: A light-sensitive silver halide color photographic material is disclosed. The light-sensitive material comprises a support and a silver halide emulsion layer and a non-light-sensitive hydrophilic colloid layer provided on the support. The emulsion layer comprises a mixture of at least two kinds of silver halide emulsions which different from each other in sensitivity. The emulsion layer contains a magenta coupler represented by Formula II and the non-light-sensitive layer contains a compound represented by formula II: ##STR1## wherein Ar is an aryl group; Y is a hydrogen atom or a substituent capable of releasing upon reaction with the oxidation product of a color developing agent; X is a halogen atom, an alkoxy group or an alkyl group; n is an integer of 0 to 4, Xs are the same or different when n is 2 or more; R is a strait chain or branched alkyl group having 1 to 20 carbon atoms, ##STR2## wherein R.sub.1 and R.sub.

Abstract: A silver halide light-sensitive material is disclosed, which has high light-sensitive speed and improved gradation and sharpness. The light-sensitive material comprises a paper substrate which has polyolefin resin layers on both sides thereof, and a silver halide emulsion layer provided on one of the polyolefin layers. The polyolefin layer on which the silver halide emulsion layer to be provided contains white pigment particles in an amount of not less than 13 weight percent of the polyolefin resin contained in the polyolefin layer, and surface of the polyolefin layer on which the emulsion layer to be provided has a di-dimensional arithmetical mean deviation of the profile, SRa, of not larger than 0.14 .mu.m, and the silver halide emulsion layer comprises at least two kinds of monodispersed silver halide emulsions each having a silver chloride content of not less than 90 mole % and being different from each other in speed.

Abstract: Disclosed is a method of making electrodeposited copper foil which comprises carrying electrolysis by adding a water-soluble cellulose ether to an electrolytic solution.A profile of the matte side nodules of the electrodeposited copper foil obtained by the method of the present invention can be easily controlled, and the electrodeposited copper foil which is high above IPC specification Class 3 in elongation at room temperature and high temperature can be obtained.

Abstract: An insoluble electrode device comprises a box having a plurality of faces, one of which is an open face. An outlet for discharging an electrolyte solution is provided on at least one of the other faces of the box, and a porous electrode plate is mounted on the open face of the box. A liquid flow control panel is mounted behind the porous electrode plate for the interior of the box, whereby a fresh and uniform liquid flow of an electrolyte solution is provided in the space between the electrodes, and whereby a high quality electrolytic surface treatment can be achieved.

Abstract: A copper-clad laminated board which comprises a resin substrate and a copper foil laminated on said substrate, said copper foil having a resin substrate bonding surface coated completely with a layer consisting essentially of a phosphorus-containing nickel layer formed by electrodeposition, said substrate being in face-to-face contact with said bonding surface of said copper foil.

Abstract: Disclosed is a method of making electrolytic metal foil, comprising carrying out electrolysis by filling with an electrolytic solution a space defined between a cathode drum capable of rotating on a horizontal axis and an anode provided in face of the surface of the drum, wherein the electrolytic solution is allowed to flow down from the upper part toward the lower part of the space at the flow velocity such that a gas generated in the solution during the electrolysis may virtually flow out downward in its whole quantity.

Abstract: Copper foil for printed circuits which comprises a copper layer and a nickel layer formed on one or both sides of said copper layer, the surface of said nickel layer having been subjected to a cathodic chromic acid treatment, and a method for producing the same. Said copper foil can be etched easily and completely with ammonium persulfate solution or with a cupric chloride solution, and is free from so called undercutting phenomenon. A further advantage of printed circuits prepared with said copper foil is that the exposed resin substrate is not stained and the copper foil is strongly adhered to the substrate before and after heating.

Abstract: Copper foil for a printed circuit, which comprises a copper layer and a vanadium-containing zinc layer formed on one side or each side of said copper layer, and a method for producing the copper foil. The bonding surface preferably contains a chromate surface.

Abstract: A copper foil for a printed circuit comprising a copper layer having the bonding surface coated with a tin layer and having said tin layer coated with a vanadium-containing zinc layer which optionally may be given a chromic acid treatment. The invention also provides a method for producing said copper foil.