Patents by Inventor Hiroshi Ogata
Hiroshi Ogata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11960224Abstract: A fixing device includes an endless belt, a rotatable pressing member, a pad member inside of the belt, and a sliding member held by the pad member and sliding on an inner circumferential surface of the belt in a nip. The rotatable pressing member nips and feeds a recording material in the nip in cooperation with the belt and fixes a toner image on the recording material by applying heat and pressure. The sliding member includes a base material layer on which a plurality of projections projecting toward the rotatable pressing member are formed on a side sliding with the belt and a sliding layer provided on an outer surface of the plurality of projections. A leading end of the plurality of projections is a plane and an average roughness (Ra) of the plane satisfies 0.13 ?m?Ra?1.67 ?m.Type: GrantFiled: February 16, 2023Date of Patent: April 16, 2024Assignee: CANON KABUSHIKI KAISHAInventors: Akiyoshi Shinagawa, Yasuharu Toratani, Hiroshi Miyamoto, Daigo Matsuura, Hiroki Kawai, Ayano Ogata, Masanobu Tanaka, Asuna Fukamachi, Misa Kawashima
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Publication number: 20240079453Abstract: A semiconductor device according to an embodiment includes a semiconductor chip having a transistor region and a diode region, a first conductor, and a second conductor. The semiconductor chip includes a first electrode, a second electrode, a silicon carbide layer between the first electrode and the second electrode, and a gate electrode. The transistor region is provided with a third electrode spaced apart from the first electrode and close to the diode region. One end of the first conductor is in contact with the first electrode, and one end of the second conductor is in contact with the third electrode.Type: ApplicationFiled: March 3, 2023Publication date: March 7, 2024Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Teruyuki OHASHI, Hiroshi KONO, Shunsuke ASABA, Takahiro OGATA
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Publication number: 20240079491Abstract: A semiconductor device according to an embodiment includes a semiconductor chip having a transistor region and a diode region, and a conductor. The semiconductor chip includes a first electrode, a second electrode, a silicon carbide layer between the first electrode and the second electrode, and a gate electrode. The first electrode includes a first region in the transistor region and a second region in the diode region. A first contact area between the conductor and the first region is larger than a second contact area between the conductor and the second region.Type: ApplicationFiled: March 3, 2023Publication date: March 7, 2024Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Teruyuki OHASHI, Hiroshi KONO, Shunsuke ASABA, Takahiro OGATA
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Publication number: 20240072121Abstract: A semiconductor device according to an embodiment includes a transistor region and a diode region. The transistor region includes n-type first SiC region having a first portion contacting a first plane, p-type second SiC region, n-type third SiC region, and a gate electrode. The diode region includes the first SiC region having a second portion contacting the first plane and p-type fourth SiC region. The semiconductor device includes a first electrode contacting the first portion and the second portion and a second electrode contacting a second plane. An occupied area per unit area of the fourth SiC region is larger than an occupied area per unit area of the second SiC region. In addition, a first diode region is provided between a first transistor region and a second transistor region. An inorganic insulating layer is provided between the first electrode and a gate wiring adjacent to the first electrode.Type: ApplicationFiled: March 2, 2023Publication date: February 29, 2024Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Teruyuki OHASHI, Tatsuo SHIMIZU, Hiroshi KONO, Shunsuke ASABA, Takahiro OGATA
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Publication number: 20240072120Abstract: A semiconductor device according to an embodiment includes a transistor region and a diode region. The transistor region includes a first silicon carbide region of n-type having a first portion in contact with a first plane, a second silicon carbide region of p-type, a third silicon carbide region of n-type, and a gate electrode. The diode region includes the first silicon carbide region of n-type having a second portion in contact with the first plane and a fourth silicon carbide region of p-type. The semiconductor device includes a gate wiring electrically connected to the gate electrode. A distance between a high-concentration portion included in the fourth silicon carbide region and the gate wiring is larger than a distance between a high-concentration portion included in the second silicon carbide region and the gate wiring.Type: ApplicationFiled: March 2, 2023Publication date: February 29, 2024Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Teruyuki OHASHI, Hiroshi KONO, Shunsuke ASABA, Takahiro OGATA
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Patent number: 10228115Abstract: A movable lighting apparatus for raising natural lawn grass includes a frame, main support legs supporting the frame, and casters attached to the lower ends of the main support legs. A movable beam is provided such that it can be advanced and retracted relative to the frame in a left-right direction. A stationary beam is fixed to the frame. A sub-support leg is provided at an advancement direction forward end portion of the movable beam so as to support a distal end of the movable beam when the movable beam is advanced. A caster is attached to the lower end of the sub-support leg. LED lamps are attached to the movable beam and the stationary beam. When the movable beam is retracted, the lower end of the caster of the sub-support leg is moved to a position above the lower ends of the casters of the main support legs.Type: GrantFiled: February 1, 2016Date of Patent: March 12, 2019Assignees: SHOWA DENKO K.K., SEKISHIN DENKI CO., LTD.Inventors: Hiroshi Ogata, Shigetoshi Jogan, Kouichi Ishitaka
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Publication number: 20170051901Abstract: A movable lighting apparatus for raising natural lawn grass includes a frame, main support legs supporting the frame, and casters attached to the lower ends of the main support legs. A movable beam is provided such that it can be advanced and retracted relative to the frame in a left-right direction. A stationary beam is fixed to the frame. A sub-support leg is provided at an advancement direction forward end portion of the movable beam so as to support a distal end of the movable beam when the movable beam is advanced. A caster is attached to the lower end of the sub-support leg. LED lamps are attached to the movable beam and the stationary beam. When the movable beam is retracted, the lower end of the caster of the sub-support leg is moved to a position above the lower ends of the casters of the main support legs.Type: ApplicationFiled: February 1, 2016Publication date: February 23, 2017Applicants: SHOWA DENKO K.K., SEKISHIN DENKI CO., LTD.Inventors: Hiroshi OGATA, Shigetoshi JOGAN, Kouichi ISHITAKA
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Publication number: 20160030970Abstract: A paste application device includes a substrate holding part that holds a substrate, an application head that applies paste to the substrate, a test-application stage where test-application of the paste is performed, an imaging camera that images the paste applied to the test-application stage by the application head from a lateral direction, and a storage part that stores an image imaged by the imaging camera.Type: ApplicationFiled: March 6, 2014Publication date: February 4, 2016Inventors: Hiroshi OKAMURA, Masaaki TOKUNAGA, Hiroshi OGATA, Toshihiko NAGAYA
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Publication number: 20150377075Abstract: A power generating system can recover exhaust heat from a working fluid of a fluid coupling and utilize the recovered exhaust heat to generate power. In the power generating system, water is supplied to a boiler by a feed pump to generate steam, a steam turbine is driven by using the generated steam to generate power, the steam discharged from the steam turbine is condensed in a condenser, and then the condensed water is resupplied to the boiler by the feed pump. The power generating system includes a fluid coupling provided between the feed pump and a motor to transmit a torque from the motor to the feed pump by a working fluid, and the condensed water supplied from the condenser is heated by the working fluid discharged from the fluid coupling.Type: ApplicationFiled: September 9, 2015Publication date: December 31, 2015Inventor: Hiroshi OGATA
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Patent number: 9188027Abstract: A power generating system can recover exhaust heat from a working fluid of a fluid coupling and utilize the recovered exhaust heat to generate power. In the power generating system, water is supplied to a boiler by a feed pump to generate steam, a steam turbine is driven by using the generated steam to generate power, the steam discharged from the steam turbine is condensed in a condenser, and then the condensed water is resupplied to the boiler by the feed pump. The power generating system includes a fluid coupling provided between the feed pump and a motor to transmit a torque from the motor to the feed pump by a working fluid, and the condensed water supplied from the condenser is heated by the working fluid discharged from the fluid coupling.Type: GrantFiled: September 28, 2010Date of Patent: November 17, 2015Assignee: EBARA CORPORATIONInventor: Hiroshi Ogata
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Patent number: 8925190Abstract: It is intended to provide an electronic component mounting device and an operation performing method for mounting electronic components so that both the operation quality and the productivity can be improved. In operation performing procedures, when an electronic component belongs to the first division, an operating head is made to move up and down based on an approximate operation position height derived from an approximate curved surface of the top surface of a board which is calculated by using the height measurement result obtained by measuring a plurality of height measuring points on the surface of the board, and when the electronic component belongs to the second division, the operating head is made to move up and down based on an individual operation position height obtained by individually measuring the board height at the operation position.Type: GrantFiled: July 27, 2011Date of Patent: January 6, 2015Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Tadashi Endo, Hiroshi Ogata, Tomohiro Kimura, Takaaki Yokoi
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Publication number: 20120317804Abstract: It is intended to provide an electronic component mounting device and an operation performing method for mounting electronic components so that both the operation quality and the productivity can be improved. Height precision division information that divide the height precision required for up and down movements of operating heads into the first division which indicates a normal height precision and the second division which indicates that a high height precision is required based on the type of electronic components are stored as operation data beforehand.Type: ApplicationFiled: July 27, 2011Publication date: December 20, 2012Applicant: PANASONIC CORPORATIONInventors: Tadashi Endo, Hiroshi Ogata, Tomohiro Kimura, Takaaki Yokoi
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Publication number: 20120272650Abstract: The present invention relates to a power generating system which can recover exhaust heat from a working fluid of a fluid coupling and utilize the recovered exhaust heat to generate power. In the power generating system, water is supplied to a boiler (1) by a feed pump (BP) to generate steam, a steam turbine (2) is driven by using the generated steam to generate power, the steam discharged from the steam turbine (2) is condensed in a condenser (4), and then the condensed water is resupplied to the boiler (1) by the feed pump (BP). The power generating system includes a fluid coupling (10) provided between the feed pump (BP) and a motor (M) to transmit a torque from the motor (M) to the feed pump (BP) by a working fluid, and the condensed water supplied from the condenser (4) is heated by the working fluid discharged from the fluid coupling (10).Type: ApplicationFiled: September 28, 2010Publication date: November 1, 2012Inventor: Hiroshi Ogata
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Patent number: 8136219Abstract: A method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency is a component height measurement method applied to a mounter (100) equipped with a transfer head (8) having a component-sucking-and-holding nozzle (21), for transferring a component P and mounting the component P onto a board (3), and includes: lowering the component P to within the high-accuracy range of a first line sensor (13) for measuring the height of the component P; and measuring the height of the component P using the first line sensor (13).Type: GrantFiled: July 31, 2006Date of Patent: March 20, 2012Assignee: Panasonic CorporationInventors: Tadashi Endo, Akira Noudo, Takeyuki Kawase, Osamu Okuda, Hiroshi Ogata
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Publication number: 20100310761Abstract: [PROBLEMS] To provide a method for forming a high-definition electroconductive thin line free from blurring at low cost. [MEANS FOR SOLVING PROBLEMS] A resin film having a hardness of 20 to 70, as measured by a type A measuring method specified in JIS K 6253, is formed on a surface of a resin base material. A thin line pattern is formed on the resin film using an electroconductive paste by intaglio printing or stencil printing or using an electroless plating catalyst ink by intaglio printing or stencil printing. Subsequently, a metal film is formed on the thin line pattern by plating to form an electroconductive thin line.Type: ApplicationFiled: November 11, 2008Publication date: December 9, 2010Inventors: Masanori Tsubota, Hidekazu Shiomi, Hiroshi Ogata
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Publication number: 20090300908Abstract: It is an object to provide a method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency. This method is a component height measurement method applied to a mounter (100) equipped with a transfer head (8) having a component-sucking-and-holding nozzle (21), for transferring a component P and mounting the component P onto a board (3), and includes: lowering the component P to within the high-accuracy range of a first line sensor (13) for measuring the height of the component P; and measuring the height of the component P using the first line sensor (13).Type: ApplicationFiled: July 31, 2006Publication date: December 10, 2009Inventors: Tadashi Endo, Akira Noudo, Takeyuki Kawase, Osamu Okuda, Hiroshi Ogata
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Publication number: 20070019514Abstract: The lens driving device according to the present invention concentrates a light beam emitted by a light source and reflected by a mirror onto a recording layer of a recording medium by use of an objective lens and includes an objective lens holding section for holding the objective lens so that the objective lens is movable in an optical axis direction, and the objective lens holding section is shaped so that the objective lens holding section is prevented from touching the mirror when the objective lens is made closer to the mirror. As a result, it is possible to reduce a space necessary for preventing the objective lens holding section from touching the mirror, so that it is possible to provide the lens driving device which is made thinner.Type: ApplicationFiled: July 25, 2006Publication date: January 25, 2007Applicant: SHARP KABUSHIKI KAISHAInventor: Hiroshi Ogata
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Patent number: 7014021Abstract: A fluid coupling transmits power from a drive side to a driven side by utilizing kinetic energy of fluid such as oil. The fluid coupling comprises a pump impeller (4) provided on a drive shaft (1), a turbine impeller (5) provided on a driven shaft (9), a housing (20) fixed to the pump impeller (4) and surrounding the turbine impeller, and a multiple disc clutch provided between a drive shaft side and a driven shaft side. The multiple disc clutch is operated to couple the drive shaft (1) and the driven shaft (9) mechanically so that the drive shaft and the driven shaft are rotated at the same rotational speed. Thus, the fluid coupling can improve a power transmitting efficiency because of no slip between the rotational speed of the drive shaft and the rotational speed of the driven shaft.Type: GrantFiled: December 4, 2001Date of Patent: March 21, 2006Assignee: Ebara CorporationInventors: Katsumi Kimura, Kazuo Hattori, Hiroshi Ogata, Yoshinori Kataya, Kazuhiko Sugiyama
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Patent number: 6779259Abstract: Two or more parts feeding sections are provided, and in each of the parts feeding sections, identical combinations of parts cassettes aligned in the same arrangement are prepared. If one or more type of components that are to be picked up at one time by a plurality of suction nozzles is exhausted, the mounting head moves to the other parts feeding section, which provides the same combination of components for all the suction nozzles to pick up the components at one time, so that the mounting operation can be continued without stopping the apparatus for replenishment of components.Type: GrantFiled: October 1, 2002Date of Patent: August 24, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Naoto Mimura, Hirofumi Obara, Hiroshi Ogata, Chikashi Konishi
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Patent number: 6765071Abstract: This invention relates to a resin composition containing an aromatic episulfide which exhibits excellent moldability, heat resistance and optical properties. The composition comprises an aromatic episulfide compound (A) having two or more reactive groups represented by the following formula (1) (wherein X is O or S with S accounting for 50 mol % or more of X on the average and R1-R4 are independently hydrogen, halogen or an alkyl group with 1-4 carbon atoms) in its molecule, a glycidyl compound (B) composed of an aromatic glycidyl ether compound having two or more glycidyl groups in its molecule or a glycidyl ester compound having two or more glycidyl groups in its molecule, an acid anhydride (C) and a curing catalyst (D) as essential components and shows the following molar ratios of &bgr;-epithiopropyl group (a), glycidyl group (b) and acid anhdyride group (c); [(b)+(a)]/(c)=1.35-3.5, (a)/(c)=0.5-2.2 and (b)/(c)=0.5-1.9.Type: GrantFiled: April 26, 2002Date of Patent: July 20, 2004Assignee: Nippon Steel Chemical Co., Ltd.Inventors: Koichi Fujishiro, Hiroshi Ogata, Fumihiro Ohmori