Patents by Inventor Hiroshi Ogata

Hiroshi Ogata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11960224
    Abstract: A fixing device includes an endless belt, a rotatable pressing member, a pad member inside of the belt, and a sliding member held by the pad member and sliding on an inner circumferential surface of the belt in a nip. The rotatable pressing member nips and feeds a recording material in the nip in cooperation with the belt and fixes a toner image on the recording material by applying heat and pressure. The sliding member includes a base material layer on which a plurality of projections projecting toward the rotatable pressing member are formed on a side sliding with the belt and a sliding layer provided on an outer surface of the plurality of projections. A leading end of the plurality of projections is a plane and an average roughness (Ra) of the plane satisfies 0.13 ?m?Ra?1.67 ?m.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: April 16, 2024
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Akiyoshi Shinagawa, Yasuharu Toratani, Hiroshi Miyamoto, Daigo Matsuura, Hiroki Kawai, Ayano Ogata, Masanobu Tanaka, Asuna Fukamachi, Misa Kawashima
  • Publication number: 20240079453
    Abstract: A semiconductor device according to an embodiment includes a semiconductor chip having a transistor region and a diode region, a first conductor, and a second conductor. The semiconductor chip includes a first electrode, a second electrode, a silicon carbide layer between the first electrode and the second electrode, and a gate electrode. The transistor region is provided with a third electrode spaced apart from the first electrode and close to the diode region. One end of the first conductor is in contact with the first electrode, and one end of the second conductor is in contact with the third electrode.
    Type: Application
    Filed: March 3, 2023
    Publication date: March 7, 2024
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Teruyuki OHASHI, Hiroshi KONO, Shunsuke ASABA, Takahiro OGATA
  • Publication number: 20240079491
    Abstract: A semiconductor device according to an embodiment includes a semiconductor chip having a transistor region and a diode region, and a conductor. The semiconductor chip includes a first electrode, a second electrode, a silicon carbide layer between the first electrode and the second electrode, and a gate electrode. The first electrode includes a first region in the transistor region and a second region in the diode region. A first contact area between the conductor and the first region is larger than a second contact area between the conductor and the second region.
    Type: Application
    Filed: March 3, 2023
    Publication date: March 7, 2024
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Teruyuki OHASHI, Hiroshi KONO, Shunsuke ASABA, Takahiro OGATA
  • Publication number: 20240072121
    Abstract: A semiconductor device according to an embodiment includes a transistor region and a diode region. The transistor region includes n-type first SiC region having a first portion contacting a first plane, p-type second SiC region, n-type third SiC region, and a gate electrode. The diode region includes the first SiC region having a second portion contacting the first plane and p-type fourth SiC region. The semiconductor device includes a first electrode contacting the first portion and the second portion and a second electrode contacting a second plane. An occupied area per unit area of the fourth SiC region is larger than an occupied area per unit area of the second SiC region. In addition, a first diode region is provided between a first transistor region and a second transistor region. An inorganic insulating layer is provided between the first electrode and a gate wiring adjacent to the first electrode.
    Type: Application
    Filed: March 2, 2023
    Publication date: February 29, 2024
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Teruyuki OHASHI, Tatsuo SHIMIZU, Hiroshi KONO, Shunsuke ASABA, Takahiro OGATA
  • Publication number: 20240072120
    Abstract: A semiconductor device according to an embodiment includes a transistor region and a diode region. The transistor region includes a first silicon carbide region of n-type having a first portion in contact with a first plane, a second silicon carbide region of p-type, a third silicon carbide region of n-type, and a gate electrode. The diode region includes the first silicon carbide region of n-type having a second portion in contact with the first plane and a fourth silicon carbide region of p-type. The semiconductor device includes a gate wiring electrically connected to the gate electrode. A distance between a high-concentration portion included in the fourth silicon carbide region and the gate wiring is larger than a distance between a high-concentration portion included in the second silicon carbide region and the gate wiring.
    Type: Application
    Filed: March 2, 2023
    Publication date: February 29, 2024
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Teruyuki OHASHI, Hiroshi KONO, Shunsuke ASABA, Takahiro OGATA
  • Patent number: 10228115
    Abstract: A movable lighting apparatus for raising natural lawn grass includes a frame, main support legs supporting the frame, and casters attached to the lower ends of the main support legs. A movable beam is provided such that it can be advanced and retracted relative to the frame in a left-right direction. A stationary beam is fixed to the frame. A sub-support leg is provided at an advancement direction forward end portion of the movable beam so as to support a distal end of the movable beam when the movable beam is advanced. A caster is attached to the lower end of the sub-support leg. LED lamps are attached to the movable beam and the stationary beam. When the movable beam is retracted, the lower end of the caster of the sub-support leg is moved to a position above the lower ends of the casters of the main support legs.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: March 12, 2019
    Assignees: SHOWA DENKO K.K., SEKISHIN DENKI CO., LTD.
    Inventors: Hiroshi Ogata, Shigetoshi Jogan, Kouichi Ishitaka
  • Publication number: 20170051901
    Abstract: A movable lighting apparatus for raising natural lawn grass includes a frame, main support legs supporting the frame, and casters attached to the lower ends of the main support legs. A movable beam is provided such that it can be advanced and retracted relative to the frame in a left-right direction. A stationary beam is fixed to the frame. A sub-support leg is provided at an advancement direction forward end portion of the movable beam so as to support a distal end of the movable beam when the movable beam is advanced. A caster is attached to the lower end of the sub-support leg. LED lamps are attached to the movable beam and the stationary beam. When the movable beam is retracted, the lower end of the caster of the sub-support leg is moved to a position above the lower ends of the casters of the main support legs.
    Type: Application
    Filed: February 1, 2016
    Publication date: February 23, 2017
    Applicants: SHOWA DENKO K.K., SEKISHIN DENKI CO., LTD.
    Inventors: Hiroshi OGATA, Shigetoshi JOGAN, Kouichi ISHITAKA
  • Publication number: 20160030970
    Abstract: A paste application device includes a substrate holding part that holds a substrate, an application head that applies paste to the substrate, a test-application stage where test-application of the paste is performed, an imaging camera that images the paste applied to the test-application stage by the application head from a lateral direction, and a storage part that stores an image imaged by the imaging camera.
    Type: Application
    Filed: March 6, 2014
    Publication date: February 4, 2016
    Inventors: Hiroshi OKAMURA, Masaaki TOKUNAGA, Hiroshi OGATA, Toshihiko NAGAYA
  • Publication number: 20150377075
    Abstract: A power generating system can recover exhaust heat from a working fluid of a fluid coupling and utilize the recovered exhaust heat to generate power. In the power generating system, water is supplied to a boiler by a feed pump to generate steam, a steam turbine is driven by using the generated steam to generate power, the steam discharged from the steam turbine is condensed in a condenser, and then the condensed water is resupplied to the boiler by the feed pump. The power generating system includes a fluid coupling provided between the feed pump and a motor to transmit a torque from the motor to the feed pump by a working fluid, and the condensed water supplied from the condenser is heated by the working fluid discharged from the fluid coupling.
    Type: Application
    Filed: September 9, 2015
    Publication date: December 31, 2015
    Inventor: Hiroshi OGATA
  • Patent number: 9188027
    Abstract: A power generating system can recover exhaust heat from a working fluid of a fluid coupling and utilize the recovered exhaust heat to generate power. In the power generating system, water is supplied to a boiler by a feed pump to generate steam, a steam turbine is driven by using the generated steam to generate power, the steam discharged from the steam turbine is condensed in a condenser, and then the condensed water is resupplied to the boiler by the feed pump. The power generating system includes a fluid coupling provided between the feed pump and a motor to transmit a torque from the motor to the feed pump by a working fluid, and the condensed water supplied from the condenser is heated by the working fluid discharged from the fluid coupling.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: November 17, 2015
    Assignee: EBARA CORPORATION
    Inventor: Hiroshi Ogata
  • Patent number: 8925190
    Abstract: It is intended to provide an electronic component mounting device and an operation performing method for mounting electronic components so that both the operation quality and the productivity can be improved. In operation performing procedures, when an electronic component belongs to the first division, an operating head is made to move up and down based on an approximate operation position height derived from an approximate curved surface of the top surface of a board which is calculated by using the height measurement result obtained by measuring a plurality of height measuring points on the surface of the board, and when the electronic component belongs to the second division, the operating head is made to move up and down based on an individual operation position height obtained by individually measuring the board height at the operation position.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: January 6, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Tadashi Endo, Hiroshi Ogata, Tomohiro Kimura, Takaaki Yokoi
  • Publication number: 20120317804
    Abstract: It is intended to provide an electronic component mounting device and an operation performing method for mounting electronic components so that both the operation quality and the productivity can be improved. Height precision division information that divide the height precision required for up and down movements of operating heads into the first division which indicates a normal height precision and the second division which indicates that a high height precision is required based on the type of electronic components are stored as operation data beforehand.
    Type: Application
    Filed: July 27, 2011
    Publication date: December 20, 2012
    Applicant: PANASONIC CORPORATION
    Inventors: Tadashi Endo, Hiroshi Ogata, Tomohiro Kimura, Takaaki Yokoi
  • Publication number: 20120272650
    Abstract: The present invention relates to a power generating system which can recover exhaust heat from a working fluid of a fluid coupling and utilize the recovered exhaust heat to generate power. In the power generating system, water is supplied to a boiler (1) by a feed pump (BP) to generate steam, a steam turbine (2) is driven by using the generated steam to generate power, the steam discharged from the steam turbine (2) is condensed in a condenser (4), and then the condensed water is resupplied to the boiler (1) by the feed pump (BP). The power generating system includes a fluid coupling (10) provided between the feed pump (BP) and a motor (M) to transmit a torque from the motor (M) to the feed pump (BP) by a working fluid, and the condensed water supplied from the condenser (4) is heated by the working fluid discharged from the fluid coupling (10).
    Type: Application
    Filed: September 28, 2010
    Publication date: November 1, 2012
    Inventor: Hiroshi Ogata
  • Patent number: 8136219
    Abstract: A method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency is a component height measurement method applied to a mounter (100) equipped with a transfer head (8) having a component-sucking-and-holding nozzle (21), for transferring a component P and mounting the component P onto a board (3), and includes: lowering the component P to within the high-accuracy range of a first line sensor (13) for measuring the height of the component P; and measuring the height of the component P using the first line sensor (13).
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: March 20, 2012
    Assignee: Panasonic Corporation
    Inventors: Tadashi Endo, Akira Noudo, Takeyuki Kawase, Osamu Okuda, Hiroshi Ogata
  • Publication number: 20100310761
    Abstract: [PROBLEMS] To provide a method for forming a high-definition electroconductive thin line free from blurring at low cost. [MEANS FOR SOLVING PROBLEMS] A resin film having a hardness of 20 to 70, as measured by a type A measuring method specified in JIS K 6253, is formed on a surface of a resin base material. A thin line pattern is formed on the resin film using an electroconductive paste by intaglio printing or stencil printing or using an electroless plating catalyst ink by intaglio printing or stencil printing. Subsequently, a metal film is formed on the thin line pattern by plating to form an electroconductive thin line.
    Type: Application
    Filed: November 11, 2008
    Publication date: December 9, 2010
    Inventors: Masanori Tsubota, Hidekazu Shiomi, Hiroshi Ogata
  • Publication number: 20090300908
    Abstract: It is an object to provide a method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency. This method is a component height measurement method applied to a mounter (100) equipped with a transfer head (8) having a component-sucking-and-holding nozzle (21), for transferring a component P and mounting the component P onto a board (3), and includes: lowering the component P to within the high-accuracy range of a first line sensor (13) for measuring the height of the component P; and measuring the height of the component P using the first line sensor (13).
    Type: Application
    Filed: July 31, 2006
    Publication date: December 10, 2009
    Inventors: Tadashi Endo, Akira Noudo, Takeyuki Kawase, Osamu Okuda, Hiroshi Ogata
  • Publication number: 20070019514
    Abstract: The lens driving device according to the present invention concentrates a light beam emitted by a light source and reflected by a mirror onto a recording layer of a recording medium by use of an objective lens and includes an objective lens holding section for holding the objective lens so that the objective lens is movable in an optical axis direction, and the objective lens holding section is shaped so that the objective lens holding section is prevented from touching the mirror when the objective lens is made closer to the mirror. As a result, it is possible to reduce a space necessary for preventing the objective lens holding section from touching the mirror, so that it is possible to provide the lens driving device which is made thinner.
    Type: Application
    Filed: July 25, 2006
    Publication date: January 25, 2007
    Applicant: SHARP KABUSHIKI KAISHA
    Inventor: Hiroshi Ogata
  • Patent number: 7014021
    Abstract: A fluid coupling transmits power from a drive side to a driven side by utilizing kinetic energy of fluid such as oil. The fluid coupling comprises a pump impeller (4) provided on a drive shaft (1), a turbine impeller (5) provided on a driven shaft (9), a housing (20) fixed to the pump impeller (4) and surrounding the turbine impeller, and a multiple disc clutch provided between a drive shaft side and a driven shaft side. The multiple disc clutch is operated to couple the drive shaft (1) and the driven shaft (9) mechanically so that the drive shaft and the driven shaft are rotated at the same rotational speed. Thus, the fluid coupling can improve a power transmitting efficiency because of no slip between the rotational speed of the drive shaft and the rotational speed of the driven shaft.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: March 21, 2006
    Assignee: Ebara Corporation
    Inventors: Katsumi Kimura, Kazuo Hattori, Hiroshi Ogata, Yoshinori Kataya, Kazuhiko Sugiyama
  • Patent number: 6779259
    Abstract: Two or more parts feeding sections are provided, and in each of the parts feeding sections, identical combinations of parts cassettes aligned in the same arrangement are prepared. If one or more type of components that are to be picked up at one time by a plurality of suction nozzles is exhausted, the mounting head moves to the other parts feeding section, which provides the same combination of components for all the suction nozzles to pick up the components at one time, so that the mounting operation can be continued without stopping the apparatus for replenishment of components.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: August 24, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Naoto Mimura, Hirofumi Obara, Hiroshi Ogata, Chikashi Konishi
  • Patent number: 6765071
    Abstract: This invention relates to a resin composition containing an aromatic episulfide which exhibits excellent moldability, heat resistance and optical properties. The composition comprises an aromatic episulfide compound (A) having two or more reactive groups represented by the following formula (1) (wherein X is O or S with S accounting for 50 mol % or more of X on the average and R1-R4 are independently hydrogen, halogen or an alkyl group with 1-4 carbon atoms) in its molecule, a glycidyl compound (B) composed of an aromatic glycidyl ether compound having two or more glycidyl groups in its molecule or a glycidyl ester compound having two or more glycidyl groups in its molecule, an acid anhydride (C) and a curing catalyst (D) as essential components and shows the following molar ratios of &bgr;-epithiopropyl group (a), glycidyl group (b) and acid anhdyride group (c); [(b)+(a)]/(c)=1.35-3.5, (a)/(c)=0.5-2.2 and (b)/(c)=0.5-1.9.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: July 20, 2004
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Koichi Fujishiro, Hiroshi Ogata, Fumihiro Ohmori