Patents by Inventor Hiroshi Ogino

Hiroshi Ogino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250092293
    Abstract: A method for producing an adhesive composition for use in debonding with light irradiation, which composition can achieve debonding through irradiation with light, wherein the adhesive composition contains an adhesive component and carbon black, and the adhesive component contains a component (A) which is cured through hydrosilylation.
    Type: Application
    Filed: November 29, 2024
    Publication date: March 20, 2025
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Hiroshi OGINO, Tetsuya SHINJO, Ryo KARASAWA, Takahisa OKUNO
  • Publication number: 20250047222
    Abstract: A converter controller of a thyristor starter includes: a current controller that generates a voltage command value of an output voltage of a converter by performing a control operation using an integral element of a deviation of a direct current with respect to a current command value; a corrector that adds a correction value to the voltage command value; and a control angle calculator that calculates a phase control angle of a thyristor in the converter based on the voltage command value to which the correction value is added. In an intermittent commutation mode, the correction value is set to increase as a rotation speed of a synchronous machine increases.
    Type: Application
    Filed: November 15, 2021
    Publication date: February 6, 2025
    Applicant: TMEIC Corporation
    Inventors: Yasuaki MATSUMOTO, Hiroshi OGINO, Akinobu ANDO
  • Publication number: 20240376356
    Abstract: A temporary adhesive having excellent spin coating properties of a circuit side of a wafer and a support, and excellent heat resistance when the circuit side of the wafer or the support is attached to an adhesion layer or a rear surface of the wafer is processed, and is capable of easily separating the circuit side of the wafer from the support after polishing the rear surface of the wafer, and simply removing a adhesive attached to the wafer or the support after the separation. The adhesive contains a component (A) to be cured by a hydrosilylation reaction, and a component (B) containing an epoxy-modified polyorganosiloxane at a ratio in % by mass of the component (A) to the component (B) of 99.995:0.005 to 30:70. The component (B) is an epoxy-modified polyorganosiloxane having an epoxy value of 0.1 to 5.
    Type: Application
    Filed: July 23, 2024
    Publication date: November 14, 2024
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Kazuhiro SAWADA, Tetsuya SHINJO, Hiroshi OGINO, Satoshi KAMIBAYASHI, Shunsuke MORIYA
  • Patent number: 12077686
    Abstract: A temporary adhesive has excellent spin coating properties of a circuit side of a wafer and a support, and excellent heat resistance when the circuit side of the wafer or the support is attached to an adhesion layer or a rear surface of the wafer is processed, and is capable of easily separating the circuit side of the wafer from the support after polishing the rear surface of the wafer, and simply removing an adhesive attached to the wafer or the support after the separation. The adhesive contains a component (A) to be cured by a hydrosilylation reaction, and a component (B) containing an epoxy-modified polyorganosiloxane at a ratio in % by mass of the component (A) to the component (B) of 99.995:0.005 to 30:70. The component (B) is an epoxy-modified polyorganosiloxane having an epoxy value of 0.1 to 5.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: September 3, 2024
    Assignee: NISSAN CHEMICAL CORPORATION
    Inventors: Kazuhiro Sawada, Tetsuya Shinjo, Hiroshi Ogino, Satoshi Kamibayashi, Shunsuke Moriya
  • Publication number: 20240218293
    Abstract: A cleaning agent composition for use in removal of a polysiloxane adhesive remaining on a substrate, the composition containing a tetrahydrocarbylammonium fluoride and an organic solvent, wherein the organic solvent contains an alkylene glycol dialkyl ether and a lactam compound represented by formula (1).
    Type: Application
    Filed: January 9, 2024
    Publication date: July 4, 2024
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Hiroshi OGINO, Tetsuya SHINJO, Ryo KARASAWA, Takahisa OKUNO
  • Patent number: 12015881
    Abstract: A light source apparatus includes a light source, a light collection optical system configured to collect a pencil of light emitted from the light source using multiple lenses, a microlens array formed into a size corresponding to a collected light diameter of a pencil of light collected by the light collection optical system and caused to be incident thereon from the light collection optical system, and a display device on to which light transmitted through the microlens array to be superimposed together is incident.
    Type: Grant
    Filed: March 15, 2023
    Date of Patent: June 18, 2024
    Assignee: CASIO COMPUTER CO., LTD.
    Inventor: Hiroshi Ogino
  • Patent number: 11982931
    Abstract: A light source device includes an excitation light irradiation unit that emits excitation light; a rotary wheel unit including a rotary wheel having a filter region that reflects or transmits light in a predetermined wavelength band different from a wavelength band of the excitation light and transmits the excitation light, and a transmission bending region that bends and transmits the excitation light; and a fixed phosphor that is irradiated with the excitation light transmitted through the filter region and emits fluorescence including light in the predetermined wavelength band toward the filter region. The rotary wheel unit is configured so that an optical axis of the excitation light that is transmitted through the rotary wheel or is reflected from the rotary wheel overlaps with an optical axis of the fluorescence in the predetermined wavelength band reflected from the filter region or transmitted through the filter region.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: May 14, 2024
    Assignee: CASIO COMPUTER CO., LTD.
    Inventor: Hiroshi Ogino
  • Patent number: 11926765
    Abstract: An adhesive composition for use in debonding with light irradiation, which composition can achieve debonding through irradiation with light, characterized in that the adhesive composition contains an adhesive component (S) and a light-absorbing organic compound (X); and the light-absorbing organic compound (X) contains, in the molecule thereof, one or more aromatic rings, one or more rings each containing a heteroatom forming the ring, and one or more groups selected from among a carbonyl group and a thiocarbonyl group.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: March 12, 2024
    Assignee: NISSAN CHEMICAL CORPORATION
    Inventors: Takahisa Okuno, Shunsuke Moriya, Hiroshi Ogino, Ryo Karasawa, Tetsuya Shinjo
  • Patent number: 11866676
    Abstract: A cleaning agent composition for use in removal of a polysiloxane adhesive remaining on a substrate, the composition containing a tetrahydrocarbylammonium fluoride and an organic solvent, wherein the organic solvent contains an alkylene glycol dialkyl ether and a lactam compound represented by formula (1). (in formula (1), R101 represents a C1 to C6 alkyl group, and R102 represents a C1 to C6 alkylene group.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: January 9, 2024
    Assignee: NISSAN CHEMICAL CORPORATION
    Inventors: Hiroshi Ogino, Tetsuya Shinjo, Ryo Karasawa, Takahisa Okuno
  • Patent number: 11774839
    Abstract: A light source apparatus includes an excitation light shining device for emitting excitation light, a rotational wheel device including a rotational wheel including a filter area for transmitting light in a predetermined wavelength range differing from a wavelength range of the excitation light and reflecting the excitation light and a direction-changing transmission area for transmitting the excitation light while changing a direction thereof, and a luminescent light emission device which receives the excitation light reflected on the filter area to thereby emit luminescent light including the light in the predetermined wavelength range towards the filter area, and the rotational wheel device is disposed so that an axis of the excitation light which passes through the direction-changing transmission area and an axis of the luminescent light in the predetermined wavelength range which passes through the filter area are superposed on each other.
    Type: Grant
    Filed: September 13, 2022
    Date of Patent: October 3, 2023
    Assignee: CASIO COMPUTER CO., LTD.
    Inventor: Hiroshi Ogino
  • Patent number: 11732214
    Abstract: A cleaning agent composition for use in removing an adhesive residue, characterized in that the composition contains a quaternary ammonium salt and a composition solvent including a first organic solvent and a second organic solvent; the first organic solvent is an amide derivative represented by formula (Z) (wherein R0 represents an ethyl group, a propyl group, or an isopropyl group; and each of RA and RB represents a C1 to C4 alkyl group); the second organic solvent is a non-amide organic solvent other than the amide derivative; and the composition has a water content less than 4.0 mass %.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: August 22, 2023
    Assignee: NISSAN CHEMICAL CORPORATION
    Inventors: Hiroshi Ogino, Tetsuya Shinjo, Shunsuke Moriya, Takahisa Okuno
  • Patent number: 11711607
    Abstract: According to an aspect of the disclosure, an information processing apparatus comprising a communication circuit and a control circuit is provided. The control circuit transmits reduced image data of captured image data, to a first external apparatus through the communication circuit; receives, from the first external apparatus, a result of evaluation processing applied to the reduced image data; on the basis of the result of the evaluation processing, determines whether to apply image processing to the captured image data corresponding to the reduced image data, by a second external apparatus; transmits the captured image data that is determined to be applied the image processing, to the second external apparatus through the communication circuit; and receives, from the second external apparatus, a result of the image processing applied to the captured image data.
    Type: Grant
    Filed: September 13, 2022
    Date of Patent: July 25, 2023
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yoshiaki Honda, Hiroshi Ogino
  • Publication number: 20230213847
    Abstract: A light source apparatus includes a light source, a light collection optical system configured to collect a pencil of light emitted from the light source using multiple lenses, a microlens array formed into a size corresponding to a collected light diameter of a pencil of light collected by the light collection optical system and caused to be incident thereon from the light collection optical system, and a display device on to which light transmitted through the microlens array to be superimposed together is incident.
    Type: Application
    Filed: March 15, 2023
    Publication date: July 6, 2023
    Applicant: CASIO COMPUTER CO., LTD.
    Inventor: Hiroshi OGINO
  • Publication number: 20230151308
    Abstract: The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (wherein each of L1 and L2 represents a C2 to C4 alkyl group, and L3 represents O or S) in an amount of 80 mass % or more.
    Type: Application
    Filed: March 22, 2021
    Publication date: May 18, 2023
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Takahisa OKUNO, Masaki YANAI, Takuya FUKUDA, Hiroto OGATA, Shunsuke MORIYA, Hiroshi OGINO, Tetsuya SHINJO
  • Publication number: 20230151306
    Abstract: The invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (in the formula, L represents a substituent to the benzene ring, and each of a plurality of Ls represents a C1 to C4 alkyl group; and k represents the number of Ls and is an integer of 0 to 5) in an amount of 80 mass % or more.
    Type: Application
    Filed: March 22, 2021
    Publication date: May 18, 2023
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Takahisa OKUNO, Masaki YANAI, Takuya FUKUDA, Hiroto OGATA, Shunsuke MORIYA, Hiroshi OGINO, Tetsuya SHINJO
  • Publication number: 20230151307
    Abstract: The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition which contains a solvent but no salt, the solvent containing a C8 to C10 linear-chain, saturated, aliphatic hydrocarbon compound. As the C8 to C10 linear-chain, saturated, aliphatic hydrocarbon compound, a linear-chain hydrocarbon compound is used.
    Type: Application
    Filed: March 22, 2021
    Publication date: May 18, 2023
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Hiroshi OGINO, Takahisa OKUNO, Masaki YANAI, Takuya FUKUDA, Hiroto OGATA, Shunsuke MORIYA, Tetsuya SHINJO, Kazuhiro SAWADA
  • Publication number: 20230131428
    Abstract: The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (in the formula, each of L1 and L2 represents a C1 to C6 alkyl group, and the sum of the number of carbon atoms of the alkyl group L1 and that of the alkyl group L2 is 6 or less) in an amount of 80 mass % or more.
    Type: Application
    Filed: March 22, 2021
    Publication date: April 27, 2023
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Takahisa OKUNO, Masaki YANAI, Takuya FUKUDA, Hiroto OGATA, Shunsuke MORIYA, Hiroshi OGINO, Tetsuya SHINJO
  • Publication number: 20230131533
    Abstract: The invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, characterized in that the remover composition contains a solvent but no salt; the solvent includes one or more species selected from among an aliphatic hydrocarbon compound, an aromatic hydrocarbon compound, an ether compound, a thioether compound, an ester compound, and an amine compound, each having a molecular weight less than 160; and the remover composition exhibits a contact angle smaller than 31.5° with respect to the adhesive layer.
    Type: Application
    Filed: March 22, 2021
    Publication date: April 27, 2023
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Takahisa OKUNO, Masaki YANAI, Takuya FUKUDA, Hiroto OGATA, Shunsuke MORIYA, Hiroshi OGINO, Tetsuya SHINJO
  • Publication number: 20230129238
    Abstract: The invention provides a cleaning agent composition for use in removing an adhesive residue, characterized in that the composition contains a quaternary ammonium salt, a metal corrosion inhibitor, and an organic solvent, and the metal corrosion inhibitor is formed of a C7 to C40 saturated aliphatic hydrocarbon compound monocarboxylic acid, a C7 to C40 saturated aliphatic hydrocarbon compound dicarboxylic acid or anhydride, a C7 to C40 unsaturated aliphatic hydrocarbon compound monocarboxylic acid, or a C7 to C40 unsaturated aliphatic hydrocarbon compound dicarboxylic acid or anhydride.
    Type: Application
    Filed: March 30, 2021
    Publication date: April 27, 2023
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Hiroshi OGINO, Takahisa OKUNO, Masaki YANAI, Shunsuke MORIYA, Hiroto OGATA, Takuya FUKUDA, Tetsuya SHINJO
  • Publication number: 20230125907
    Abstract: A semiconductor substrate cleaning method including removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by any of formulae (L0) to (L4).
    Type: Application
    Filed: March 22, 2021
    Publication date: April 27, 2023
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Takahisa OKUNO, Masaki YANAI, Takuya FUKUDA, Hiroto OGATA, Shunsuke MORIYA, Hiroshi OGINO, Tetsuya SHINJO