Patents by Inventor Hiroshi Tamagawa

Hiroshi Tamagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10446302
    Abstract: A chip resistor includes: a board having a device formation surface, a back surface opposite from the device formation surface and side surfaces connecting the device formation surface to the back surface, a resistor portion provided on the device formation surface, a first connection electrode and a second connection electrode provided on the device formation surface and electrically connected to the resistor portion, and a resin film covering the device formation surface with the first connection electrode and the second connection electrode being exposed therefrom. Intersection portions of the board along which the back surface intersects the side surfaces each have a rounded shape.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: October 15, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Eiji Nukaga, Hiroshi Tamagawa, Yasuhiro Kondo, Katsuya Matsuura
  • Patent number: 10410772
    Abstract: A chip resistor has a substrate, a first connection electrode and a second connection electrode that are formed on the substrate, and a resistor network that is formed on the substrate and that has ends one of which is connected to the first connection electrode and the other one of which is connected to the second connection electrode. The resistor network is provided with a resistive circuit. The resistive circuit has a resistive element film line that is provided along inner wall surfaces of trenches. The resistive element film line extending along the inner wall surfaces of the trenches is long and has a high resistivity as a unit resistive element.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: September 10, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Hiroshi Tamagawa, Yasuhiro Kondo
  • Patent number: 10361182
    Abstract: The chip part of the present invention includes a substrate, an electrode on the substrate and having a front surface in which a plurality of recessed portions are formed toward the thickness direction thereof, and an element region having a circuit element that is electrically connected to the electrode.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: July 23, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Hiroshi Tamagawa, Yasuhiro Kondo, Hiroki Yamamoto
  • Patent number: 10342138
    Abstract: A chip part includes a substrate having a first main surface on one side thereof and a second main surface on the other side thereof, a functional device famed at a first main surface side of the substrate, an external terminal formed at the first main surface side of the substrate and electrically connected to the functional device, and a light diffusion reflection structure formed at a second main surface side of the substrate and diffusely reflecting light irradiated toward the second main surface of the substrate.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: July 2, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Yasuhiro Kondo, Katsuya Matsuura, Hiroshi Tamagawa
  • Publication number: 20190200458
    Abstract: The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.
    Type: Application
    Filed: February 26, 2019
    Publication date: June 27, 2019
    Applicant: ROHM CO., LTD.
    Inventors: Hiroshi TAMAGAWA, Koichi NIINO, Eiji NUKAGA, Keishi WATANABE
  • Patent number: 10321570
    Abstract: The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: June 11, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Hiroshi Tamagawa, Koichi Niino, Eiji Nukaga, Keishi Watanabe
  • Publication number: 20190160783
    Abstract: A transparent conductor includes: a transparent resin base material; a first metal oxide layer; a metal layer including a silver alloy; and a second metal oxide layer, in this order. The first metal oxide layer contains at least one of tin oxide and niobium oxide. When the tin oxide and the niobium oxide are respectively set in terms of SnO2 and Nb2O5, a molar basis content of the total of SnO2 and Nb2O5 with respect to the total of metal oxides contained in the first metal oxide layer is greater than a molar basis content of the total of SnO2 and Nb2O5 with respect to the total of metal oxides contained in the second metal oxide layer, and the content in the first metal oxide layer is greater than or equal to 45 mol %.
    Type: Application
    Filed: June 9, 2017
    Publication date: May 30, 2019
    Applicant: TDK CORPORATION
    Inventors: Hiroshi SHINGAI, Yoshihisa TAMAGAWA, Yoshihiko TANABE, Yoshinori SATO
  • Publication number: 20190148480
    Abstract: [Theme] A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.
    Type: Application
    Filed: January 17, 2019
    Publication date: May 16, 2019
    Applicant: ROHM CO., LTD.
    Inventors: Hiroshi TAMAGAWA, Yasuhiro KONDO, Yasuhiro FUWA, Hiroyuki OKADA, Eiji NUKAGA, Katsuya MATSUURA
  • Publication number: 20190148040
    Abstract: A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.
    Type: Application
    Filed: December 24, 2018
    Publication date: May 16, 2019
    Applicant: ROHM CO., LTD.
    Inventors: Hiroshi TAMAGAWA, Hiroki YAMAMOTO, Katsuya MATSUURA, Yasuhiro KONDO
  • Patent number: 10224391
    Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: March 5, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Hiroshi Tamagawa, Yasuhiro Kondo, Yasuhiro Fuwa, Hiroyuki Okada, Eiji Nukaga, Katsuya Matsuura
  • Patent number: 10210971
    Abstract: A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: February 19, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Hiroshi Tamagawa, Hiroki Yamamoto, Katsuya Matsuura, Yasuhiro Kondo
  • Patent number: 10178768
    Abstract: A mounting substrate includes a substrate, a connection electrode, which is formed on a front surface of the substrate and on which an electronic component is mounted via a conductive bonding material, a resist film, formed on the front surface of the substrate so as to cover a peripheral edge portion of the connection electrode, and a receiving portion, formed in the resist film so as to expose a portion of the peripheral edge portion of the connection electrode and arranged to receive an excess portion of the conductive bonding material.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: January 8, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Katsuya Matsuura, Hiroshi Tamagawa
  • Patent number: 10128163
    Abstract: A chip part includes a substrate that has an upper surface, a lower surface positioned on an opposite side of the upper surface, and a sidewall by which the upper surface and the lower surface are connected together and that has a plurality of concavo-convex portions formed on the sidewall from a side of the upper surface toward a side of the lower surface, a functional element formed at the side of the upper surface of the substrate, a first external electrode and a second external electrode that are arranged at the upper surface of the substrate so as to be electrically connected to the functional element, and a sidewall insulating film with which the sidewall of the substrate is coated so as to fill the plurality of concavo-convex portions formed on the sidewall of the substrate with the sidewall insulating film.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: November 13, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Hiroshi Tamagawa, Yasuhiro Kondo
  • Publication number: 20180323011
    Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.
    Type: Application
    Filed: July 10, 2018
    Publication date: November 8, 2018
    Applicant: ROHM CO., LTD.
    Inventors: Hiroki YAMAMOTO, Keishi WATANABE, Hiroshi TAMAGAWA
  • Patent number: 10026557
    Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: July 17, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Hiroki Yamamoto, Keishi Watanabe, Hiroshi Tamagawa
  • Patent number: 9972427
    Abstract: A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO2, TiN, TiNO and TiSiON.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: May 15, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Yasuhiro Kondo, Hiroshi Tamagawa, Hiroki Yamamoto
  • Publication number: 20180042118
    Abstract: A chip part includes a substrate having a first main surface on one side thereof and a second main surface on the other side thereof, a functional device famed at a first main surface side of the substrate, an external terminal formed at the first main surface side of the substrate and electrically connected to the functional device, and a light diffusion reflection structure formed at a second main surface side of the substrate and diffusely reflecting light irradiated toward the second main surface of the substrate.
    Type: Application
    Filed: August 7, 2017
    Publication date: February 8, 2018
    Applicant: ROHM CO., LTD.
    Inventors: Yasuhiro KONDO, Katsuya MATSUURA, Hiroshi TAMAGAWA
  • Publication number: 20170365655
    Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.
    Type: Application
    Filed: July 12, 2017
    Publication date: December 21, 2017
    Applicant: ROHM CO., LTD.
    Inventors: Hiroshi TAMAGAWA, Yasuhiro KONDO, Yasuhiro FUWA, Hiroyuki OKADA, Eiji NUKAGA, Katsuya MATSUURA
  • Publication number: 20170250029
    Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.
    Type: Application
    Filed: May 16, 2017
    Publication date: August 31, 2017
    Applicant: ROHM CO., LTD.
    Inventors: Hiroki YAMAMOTO, Keishi WATANABE, Hiroshi TAMAGAWA
  • Publication number: 20170236765
    Abstract: A chip part includes a substrate that has an upper surface, a lower surface positioned on an opposite side of the upper surface, and a sidewall by which the upper surface and the lower surface are connected together and that has a plurality of concavo-convex portions formed on the sidewall from a side of the upper surface toward a side of the lower surface, a functional element formed at the side of the upper surface of the substrate, a first external electrode and a second external electrode that are arranged at the upper surface of the substrate so as to be electrically connected to the functional element, and a sidewall insulating film with which the sidewall of the substrate is coated so as to fill the plurality of concavo-convex portions formed on the sidewall of the substrate with the sidewall insulating film.
    Type: Application
    Filed: December 19, 2016
    Publication date: August 17, 2017
    Applicant: ROHM CO., LTD.
    Inventors: Hiroshi TAMAGAWA, Yasuhiro KONDO