Patents by Inventor Hiroshi Tsuyuki

Hiroshi Tsuyuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4737416
    Abstract: A copper electrode is firmly bonded to a sintered aluminum nitride body by applying a copper film on a sintered aluminum nitride body by electroless or electrolytic plating, evaporation or sputtering, and heat treating the copper film on the body at a temperature of 900.degree. to 1083.degree. C. in a weakly oxidizing atmosphere.
    Type: Grant
    Filed: February 20, 1986
    Date of Patent: April 12, 1988
    Assignee: TDK Corporation
    Inventors: Tetsuo Akoh, Hiroshi Tsuyuki, Toshihiro Suzuki, Kentaro Sawamura
  • Patent number: 4429346
    Abstract: A ceramic capacitor having an extremely thin plate (as little as 10 .mu.m) with a pair of electrodes on both the surfaces of the plate, said thin plate is supported by the thick dielectric plate which is laminated with said thin plate. The thick plate has a through hole, in the vertical direction of the same, and said through hole is filled with a through hole conductor which connects electrically the external terminal on the outer surface of the thick plate and the inner electrode on the thin plate. The material of the thick plate is the same as that of the thin plate, and a pair of lead lines are soldered to the external terminal and the outer electrode on the thin plate.
    Type: Grant
    Filed: March 4, 1982
    Date of Patent: January 31, 1984
    Assignee: TDK Electronics
    Inventors: Atsushi Sato, Hiroshi Tsuyuki
  • Patent number: 4356530
    Abstract: A ceramic capacitor having an extremely thin plate (as little as 10 .mu.m) with a pair of electrodes on both the surfaces of the plate, said thin plate is supported by the thick dielectric plate which is laminated with said thin plate. The thick plate has a through hole, in the vertical direction of the same, and said through hole is filled with a through hole conductor which connects electrically the external terminal on the outer surface of the thick plate and the inner electrode on the thin plate. The material of the thick plate is the same as that of the thin plate, and a pair of lead lines are soldered to the external terminal and the outer electrode on the thin plate.
    Type: Grant
    Filed: July 24, 1980
    Date of Patent: October 26, 1982
    Assignee: TDK Electronics Co., Ltd.
    Inventors: Atsushi Sato, Hiroshi Tsuyuki
  • Patent number: 4315846
    Abstract: This application relates to novel metal salts of N-substituted alkylenebisdithiocarbamic acids and their use as agricultural fungicides.
    Type: Grant
    Filed: March 26, 1980
    Date of Patent: February 16, 1982
    Assignee: Tokyo Organic Chemical Industries, Ltd.
    Inventors: Masuo Kuchikata, Hiroshi Tsuyuki, Toshio Furukawa, Yoshihiro Nitta, Hiroshi Kuyama