Abstract: An adhesive silicone elastomer film obtained by forming a radiation-curable silicone rubber composition into a film and curing the resulting film by radiation; the composition including (A) an oily organopolysiloxane, (B) a radiation sensitizer and (C) an alkoxysilane and/or a partial hydrolysis-condensation product thereof. The oily organopolysiloxane includes, e.g., a compound represented by the formula: This film can be produced in a short time as clean films easy to handle and having a uniform shape, can rationalize work steps when used, and also has a low elasticity and sufficient heat resistance, adhesiveness and workability. This film is useful in the covering or bonding of articles.

Abstract: A radiation-curable silicone rubber composition is provided which includes:(A) a specific organopolysiloxane having radiation-sensitive (meth)acryloyl groups at the both terminals of the molecular chain,(B) a photosensitizer;(C) a tetraalkoxysilane or a partial hydrolysis-condensation product thereof; and(D) optionally together with a specific organic titanium compound. This composition is curable upon irradiation by ultraviolet rays for a short time and exhibits adhesion quickly. Hence, it is useful for the bonding, coating and potting of various substrates. This composition also has a relatively weak adhesion immediately after curing, and can be peeled from the substrate with ease for a while. Hence, it is also suited for uses where repair is required. Because of a high curing rate, it can be effective for, e.g., making a process short, improving productivity and saving energy in the manufacture of electric and electronic parts.

Abstract: A zinc oxide-filled addition-curable silicone rubber composition comprises (A) a diorganopolysiloxane containing at least two alkenyl groups in its molecule, (B) an organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to silicon atoms in its molecule, (C) a platinum family metal catalyst, and (D) a zinc oxide powder surface treated with a tetraalkoxy silane and/or a partial hydrolysis-condensation product thereof. The composition can further comprise (E) a high thermal-conductive filler. The composition scarcely generates hydrogen gas during storage so as to have an excellent storage stability and provides a cured product excellent in heat resistance, electrical insulating properties, and adhesion to various metals, semiconductors, etc. while keeping good physical properties as a rubber.

Abstract: The composition comprises a (meth)acryloyloxyl group-containing organopolysiloxane having an average molecular weight of 3,000 to 100,000, in terms of polystyrene, and a photosensitizer. Such an organopolysiloxane having an average molecular weight of 3,000 or more is produced by subjecting (meth)acryloyloxypropyltrimethoxysilane and phenyltrimethoxysilane to cohydrolysis and subsequent condensation polymerization to produce a cohydrolysis-condensation polymerization product and then reacting and silylating the same product with a silylating agent such as hexamethyldisilazane. The composition containing such a high molecular weight (meth)acryloyloxyl-group-containing organopolysiloxane is excellent in sensitivity, resolution and storage stability and has little tackiness in uncured state after being coated, as well as being excellent in heat resistance after being cured.

Abstract: A photosensitive resin composition which is adapted for protecting articles and particularly, electronic parts, therewith comprises a polyimide precursor of the following general formula ##STR1## wherein each X individually represents a tetravalent organic group, each Y individually represents a divalent organic group, R.sup.1, R.sup.2 and R.sup.3 may be the same or different and represent a hydrogen atom or a monovalent organic group having form 1 to 10 carbon atoms, and p, q and m are, respectively, an integer of 1 or over, and a photosensitive diazoquinone compound.

Abstract: A polyimidesilicone resin precursor composition which comprises a polysiloxane of the following general formula ##STR1## wherein R is a monovalent organic group having up to 10 carbon atoms, R.sup.1 represents a hydrogen atom or a monovalent organic group having up to 10 carbon atoms, and m is an integer not smaller than 3, and a polyamic acid or a polyimide obtained from the polyamic acid. The composition is cured at a relatively low temperature within a short time to provide a cured film having improved solvent and heat resistances and good adhesion to various substrates.

Abstract: A novel curable polyimide resin of structural formula (1) or (2) is provided wherein R.sup.1 and R.sup.2 are independently substituted or unsubstituted monovalent C.sub.1-10 hydrocarbon groups, R.sup.3 is a divalent C.sub.1-10 organic group, X is a tetravalent organic group containing an aromatic or aliphatic ring, Y is a divalent organic group, Z is a divalent organic group containing an aromatic ring, W is a trivalent organic group containing an aromatic ring, m is an integer of 1 to 3, and n is an integer of at least 1. It can be prepared by reacting a polyimide with a silicon compound. The curable resin forms with a solvent a solution having a low viscosity and shelf stability and cures at relatively low temperatures below 300.degree. C. into coatings having heat resistance, mechanical strength, electrical properties, solvent resistance and substrate adherence.

Abstract: The invention provides a method of protecting an electronic or electric part by coating the part with a silicone rubber composition comprising an organopolysiloxane, an organohydrogenpolysiloxane, an addition reaction catalyst, and a filler. When metal oxide fine particles obtained by deflagration of metal powder dust in an oxygen-containing atmosphere are blended as the filler, the composition has sufficient purity to cover electronic and electric parts and cured products of the composition are improved in electrical properties and heat resistance, thereby protecting the electronic or electric part.

Abstract: A composition comprising (A) an organopolysiloxane having a unit of the formula: R.sup.1 SiO.sub.3/2 wherein R.sup.1 is methyl, phenyl or vinyl in its molecule and having at least 0.05 alkenyl groups each directly attached to a silicon atom per silicon atom, (B) an organohydrogenpolysiloxane having at least 2 hydrogen atoms each directly attached to a silicon atom per molecule, (C) a platinum catalyst, and (D) an organosilane or organopolysiloxane of the formula: R.sup.2.sub.a (R.sup.3 O).sub.b SiO.sub.(4-a-b)/2 wherein R.sup.2 and R.sup.3 are hydrogen, methyl, phenyl or vinyl maintains good light transmission in cured form when exposed to humidity and is thus suitable for forming cores of optical fibers. Similar benefits are obtained with a composition comprising components (A) and (B), (C') a platinum catalyst and/or a radical polymerization initiator, and (E) a carboxylate.

Abstract: A semiconductor rectifying device, suitable for installation in vehicles, comprises a cup-shaped metallic container, a semiconductor chip having a pn junction, one of whose main surfaces is bonded to the bottom surface of the container, a lead bonded to the other main surface of the semiconductor chip, and a silicone resin layer containing silica powder, with which layer an exposed portion of the semiconductor chip is covered.

Abstract: A photosensitive polymer composition comprising, in admixture, a polymer predominantly comprising a recurring unit of the formula (I): ##STR1## wherein x is a tri- or tetravalent organic group, Y is a divalent organic group, and n is equal to 1 or 2 and a compound having a urea bond of the formula (II): ##STR2## wherein R.sup.1 is a group having a functional group capable of forming a dimer or polymer upon exposure to radiation, R.sup.2 and R.sup.3 are independently a hydrogen atom or a monovalent organic group is shelf stable and applicable as relatively thick coatings having sufficient photosensitivity to form semiconductor element surface protective films.

Abstract: A curable resin composition comprising a mixture or cocondensate of a compound containing imide and alkoxysilyl groups and an organosilane or organopolysiloxane is shelf stable and cures into a film which is improved in heat resistance, mechanical strength, electrical properties, solvent resistance and adhesion to substrates and thus suitable as a protective film on electronic parts.

Abstract: The present polyamido-acid copolymer has a polymerization backbone chain represented by the following formula: ##STR1## wherein q represents a bivalent organic group and R represents a tetravalent aromatic group. This copolymer forms a polyimide resin film excellent in adhesion to various inorganic substances and mechanical strength.

Abstract: A silicone rubber composition comprising (A) a vinyl-containing diorganopolysiloxane, (B) an organohydrogenpolysiloxane, and (C) a platinum catalyst is improved in adhesion to metallic, ceramic and plastic substrates by blending therein (D) an alkoxyhydrogensiloxane and (E) a polysiloxane having at least one epoxy group attached to a silicon atom through a carbon atom.

Abstract: A polyimide resin is prepared by polymerizing (A) a tetracarboxylic acid dianhydride component consisting essentially of 10 to 50 mol % of 2,2-bis(3,4-benzene-dicarboxylic anhydride)perfluoropropane and 90 to 50 mol % of pyromellitic dianhydride or similar acid dianhydride and (B) a diamine component consisting essentially of 10 to 80 mol % of a silicon diamine and 90 to 20 mol % of an ether diamine. The polyimide resin is dissolved in an organic solvent and blended with finely divided silica to form a composition which is useful for protecting semiconductor elements.

Abstract: Siloxane compounds having the general formula [1]: ##STR1## wherein R is a substituted or unsubstituted monovalent hydrocarbon group having from 1 to 10 carbon atoms, and n is an integer of from 0 to 100. The compound, because of the two vinylsilyl groups and two acid anhydride groups introduced into the molecule thereof, is useful as an intermediate or modifying agent in the synthesis of various organic resins such as polyimide resins.

Abstract: A solution composition of a polyimide resin type curable resin having imide and alkoxysilyl groups is prepared by reacting a polyimide with a silicon compound in an organic solvent. The solution can be cured through relatively mild heating into coatings having enhanced substrate adherence and solvent resistance and thus suitable as protective coatings on electronic parts.

Abstract: A curable silicone composition comprising an organosilicon compound (A) having at least two alkynyl groups in its molecule and an organosilicon compound (B) having in its molecule at least two organic groups containing a vinyl group. The composition of this invention is advantageous in that it has a high stability particularly at room temperature, and hence a superior storage stability and workability.

Abstract: Siloxane compounds having the following formula [1]: ##STR1## wherein each R is a substituted or unsubstituted monovalent hydrocarbon group having from 1 to 10 carbon atoms, and n is an integer of from 0 to 100. The compounds are extremely high in reactivity and, therefore, useful as an intermediate or modifying agent in the synthesis of silicone resins and other various organic resins.

Abstract: A silicon rubber composition comprising (I) a vinyl-containing diorganopolysiloxane, (II) an organohydrogenpolysiloxane, and (III) platinum or a platinum compound is improved in adhesive bond to various substrates under low-temperature curing conditions by blending (IV) an ester siloxane compound free of a silicon-to-carbon bond and (V) an epoxy-containing polysiloxane compound.