Patents by Inventor Hirotaka Fujii

Hirotaka Fujii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230239305
    Abstract: Provided is an apparatus including: a storage unit configured to store an account having a use authority for each of a plurality of learning algorithms; a use control unit configured to restrict use of each learning algorithm to a user of an account having a use authority for the learning algorithm; and a learning processing unit configured to perform learning processing of a learning model by one learning algorithm of the plurality of learning algorithms by using learning data supplied from a user of an account having a use authority for the one learning algorithm.
    Type: Application
    Filed: January 5, 2023
    Publication date: July 27, 2023
    Inventors: Hideyuki FUJII, Hirotaka KATAYAMA
  • Publication number: 20230175210
    Abstract: A processing apparatus is used for surface treatment of undried concrete. The processing apparatus comprises a main body portion placed on the undried concrete; a first roller provided on a bottom portion of the main body portion; a second roller provided on a back side of the first roller on the bottom portion and arranged in parallel to the first roller; a driving portion mounted on the main body portion and configured to give a rotational driving force to the first roller and the second roller; and a handle portion protruded forward from the main body portion to be held by an operator who stands in front of the main body portion. The first roller and the second roller are configured to idle in such a state that the first roller and the second roller come into contact with a surface of the undried concrete by the rotational driving force of the driving portion, when the operator holds the handle portion to move the main body portion forward.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 8, 2023
    Applicant: F-tec Co., Ltd
    Inventor: Hirotaka FUJII
  • Patent number: 11661292
    Abstract: A paper feeder includes a processor configured to, in a case of lowering a paper feed tray on which paper is placed in an accommodation section that accommodates paper and replenishing paper, the paper feed tray being controlled to be raised/lowered in a case of replenishing paper, control a lowering amount of the paper feed tray according to a number of sheets of paper to be replenished.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: May 30, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Shinya Harada, Hirotaka Sato, Kenji Tomizawa, Hirofumi Ogasawara, Katsuyuki Fujii, Takayoshi Sato, Ryoji Kawaguchi, Junichi Furusawa, Daiji Kato, Yuichi Hoshino, Masashi Hara, Yuki Akechi, Shinichi Kinoshita
  • Patent number: 11636972
    Abstract: A multilayer substrate includes a stacked body of insulating base material layers and conductor patterns on the insulating base material layers. A thickness adjustment base material layer includes a frame portion, an opening portion inside the frame portion, and an island shaped portion inside the frame portion, and connection portions to connect the island shaped portion to the frame portion. The conductor patterns, in a stacking direction of the insulating base material layers, are wound around the island shaped portion. A line width of the connection portions is smaller than the width of the island shaped portion connected to the frame portion through the connection portions. An area overlapped with the conductor patterns is larger in the opening portion than in the frame portion and the island shaped portion.
    Type: Grant
    Filed: May 24, 2022
    Date of Patent: April 25, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shingo Ito, Naoki Gouchi, Hirotaka Fujii, Kazutaka Muraoka
  • Patent number: 11515069
    Abstract: A multilayer substrate includes a stacked body, coil conductor patterns, and a connection conductor pattern. The stacked body includes insulating layers. A first coil conductor pattern is provided on the front surface of an insulating layer and has a wound shape including outer and inner end portions. A second coil conductor pattern is provided on the front surface of the insulating layer and includes an end portion. The connection conductor pattern is provided in the stacked body, and connects the coil conductor patterns. The outer end portion is connected to a terminal conductor on a back surface of the stacked body. The end portion of the second coil conductor pattern is connected to the terminal conductor on the back surface of the stacked body. The first coil conductor pattern extends parallel or substantially parallel to the second coil conductor pattern along an outer periphery of the second coil conductor pattern.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: November 29, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shingo Ito, Hirotaka Fujii
  • Publication number: 20220285083
    Abstract: A multilayer substrate includes a stacked body of insulating base material layers and conductor patterns on the insulating base material layers. A thickness adjustment base material layer includes a frame portion, an opening portion inside the frame portion, and an island shaped portion inside the frame portion, and connection portions to connect the island shaped portion to the frame portion. The conductor patterns, in a stacking direction of the insulating base material layers, are wound around the island shaped portion. A line width of the connection portions is smaller than the width of the island shaped portion connected to the frame portion through the connection portions. An area overlapped with the conductor patterns is larger in the opening portion than in the frame portion and the island shaped portion.
    Type: Application
    Filed: May 24, 2022
    Publication date: September 8, 2022
    Inventors: Shingo ITO, Naoki GOUCHI, Hirotaka FUJII, Kazutaka MURAOKA
  • Patent number: 11396249
    Abstract: A ventilation mat according to the present invention includes: a ventilation mat body; and an ventilation guide with a fan attachment hole provided at one end thereof, and the other end of the ventilation guide being connected to a connection hole provided on a side surface of the ventilation mat body, in which the ventilation mat body includes: a first base material having an air-permeable three-dimensional structure; an air-permeable cover configured to cover a surface of the first first base material; a side barrier configured to cover an outer periphery of the first base material other than the connection hole, the side barrier having an air permeability lower than that of the air-permeable cover; and an opening surface that is surrounded by the side barrier and exposes the first base material.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: July 26, 2022
    Assignee: KURABE INDUSTRIAL CO., LTD.
    Inventors: Norishige Morishita, Hiroya Takeda, Hirotaka Fujii
  • Patent number: 11373793
    Abstract: A multilayer substrate includes a stacked body of insulating base material layers and conductor patterns on the insulating base material layers. A thickness adjustment base material layer includes a frame portion, an opening portion inside the frame portion, and an island shaped portion inside the frame portion, and connection portions to connect the island shaped portion to the frame portion. The conductor patterns, in a stacking direction of the insulating base material layers, are wound around the island shaped portion. A line width of the connection portions is smaller than the width of the island shaped portion connected to the frame portion through the connection portions. An area overlapped with the conductor patterns is larger in the opening portion than in the frame portion and the island shaped portion.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: June 28, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shingo Ito, Naoki Gouchi, Hirotaka Fujii, Kazutaka Muraoka
  • Publication number: 20210337656
    Abstract: A multilayer resin substrate includes a base material including stacked resin layers including an opening resin layer, a conductor pattern, and an interlayer connection conductor. A concave portion is provided in the base material. The opening resin layer is closer to a first main surface than other resin layers. The concave portion includes a first opening portion provided by a cutting process from one surface of the opening resin layer, and another resin layer. The interlayer connection conductor is provided by filling a conductor in a second opening portion provided by a cutting process from an opposite surface of the opening resin layer. The end portion of the one surface of the first opening portion is not in contact with the conductor pattern.
    Type: Application
    Filed: July 7, 2021
    Publication date: October 28, 2021
    Inventors: Tomohiro FURUMURA, Shigeru TAGO, Hirotaka FUJII
  • Publication number: 20200108752
    Abstract: A ventilation mat according to the present invention includes: a ventilation mat body; and an ventilation guide with a fan attachment hole provided at one end thereof, and the other end of the ventilation guide being connected to a connection hole provided on a side surface of the ventilation mat body, in which the ventilation mat body includes: a first base material having an air-permeable three-dimensional structure; an air-permeable cover configured to cover a surface of the first first base material; a side barrier configured to cover an outer periphery of the first base material other than the connection hole, the side barrier having an air permeability lower than that of the air-permeable cover; and an opening surface that is surrounded by the side barrier and exposes the first base material.
    Type: Application
    Filed: May 25, 2018
    Publication date: April 9, 2020
    Inventors: Norishige MORISHITA, Hiroya TAKEDA, Hirotaka FUJII
  • Patent number: 10418708
    Abstract: This disclosure provides a wideband antenna including a feed line, a ground conductor plate and a radiating conductor element connected to the feed line and facing the ground conductor plate at a distance from the ground conductor plate. A parasitic conductor element is provided on a side opposite to the ground conductor plate as viewed from the radiating conductor plate and is insulated from these plates. A coupling adjusting conductor plate is positioned between the radiating conductor element and the parasitic conductor element, is configured to adjust an amount of coupling between them, overlaps an area where the radiating conductor element and the parasitic conductor element overlap, and straddles the radiating conductor element in a direction orthogonal to the direction of a current I that flows therein. Both end sides of the coupling adjusting conductor plate are electrically connected to the ground conductor plate via via-holes.
    Type: Grant
    Filed: July 23, 2012
    Date of Patent: September 17, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kaoru Sudo, Hirotaka Fujii, Toshiro Hiratsuka
  • Publication number: 20190115136
    Abstract: A multilayer substrate includes a stacked body, coil conductor patterns, and a connection conductor pattern. The stacked body includes insulating layers. A first coil conductor pattern is provided on the front surface of an insulating layer and has a wound shape including outer and inner end portions. A second coil conductor pattern is provided on the front surface of the insulating layer and includes an end portion. The connection conductor pattern is provided in the stacked body, and connects the coil conductor patterns. The outer end portion is connected to a terminal conductor on a back surface of the stacked body. The end portion of the second coil conductor pattern is connected to the terminal conductor on the back surface of the stacked body. The first coil conductor pattern extends parallel or substantially parallel to the second coil conductor pattern along an outer periphery of the second coil conductor pattern.
    Type: Application
    Filed: December 13, 2018
    Publication date: April 18, 2019
    Inventors: Shingo ITO, Hirotaka FUJII
  • Publication number: 20190108938
    Abstract: A multilayer substrate includes a stacked body of insulating base material layers and conductor patterns on the insulating base material layers. A thickness adjustment base material layer includes a frame portion, an opening portion inside the frame portion, and an island shaped portion inside the frame portion, and connection portions to connect the island shaped portion to the frame portion. The conductor patterns, in a stacking direction of the insulating base material layers, are wound around the island shaped portion. A line width of the connection portions is smaller than the width of the island shaped portion connected to the frame portion through the connection portions. An area overlapped with the conductor patterns is larger in the opening portion than in the frame portion and the island shaped portion.
    Type: Application
    Filed: December 7, 2018
    Publication date: April 11, 2019
    Inventors: Shingo ITO, Naoki GOUCHI, Hirotaka FUJII, Kazutaka MURAOKA
  • Patent number: 9190732
    Abstract: A chip antenna is mounted on a mother substrate including a feed line. In a representative embodiment, the chip antenna includes a laminated body including plural insulating layers, a radiating conductor element, a parasitic conductor element, a coupling adjusting conductor plate, and a LGA. The radiating conductor element is connected to the feed line via a first flat electrode pad of the LGA. On the other hand, the coupling adjusting conductor plate is provided between the radiating conductor element and the parasitic conductor element, and both end sides of the coupling adjusting conductor plate are connected to second and third flat electrode pads of the LGA. Another representative embodiment does not include a coupling adjusting conductor plate in the laminated body and includes an LGA that may or may not include second and third flat electrode pads.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: November 17, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hirotaka Fujii, Eiichi Kobayashi, Kaoru Sudo, Toshiro Hiratsuka
  • Patent number: 9172142
    Abstract: This disclosure provides a horizontal radiation antenna. The antenna includes a back-surface-side grounded conductor plate on a back surface of a substrate, a radiation element to which a coplanar line is connected on the front surface of the substrate, and a passive element closer to an end portion side of the substrate than the radiation element. A front-surface-side grounded conductor plate is provided at a substantially same height as the radiation element with respect to a thickness direction of the substrate, and a conductive wall surface capable of reflecting a high-frequency signal radiated from the radiation element is provided between the front-surface-side grounded conductor plate and the back-surface-side grounded conductor plate.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: October 27, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kaoru Sudo, Hirotaka Fujii, Eiichi Kobayashi, Toshiro Hiratsuka
  • Patent number: 9172135
    Abstract: This disclosure provides a horizontal radiation antenna including a grounded conductor plate on the back surface of a multilayer substrate, a radiation element to which a microstrip line is connected on a front surface of the multilayer substrate, and a passive element on an end portion side of the multilayer substrate compared with the radiation element. An intermediate grounded conductor plate is provided within the multilayer substrate between insulation layers and faces the microstrip line. The intermediate grounded conductor plate defines a notch portion whose end portion side is open. The intermediate grounded conductor surrounds the radiation element and the passive element in the notch portion. The intermediate grounded conductor is electrically connected to the grounded conductor plate.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: October 27, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kaoru Sudo, Hirotaka Fujii, Eiichi Kobayashi, Toshiro Hiratsuka
  • Patent number: 9070490
    Abstract: A transmission line portion of a flat cable that is bent at a position along the longitudinal direction includes a dielectric element body, a first ground conductor, and a second ground conductor. The dielectric element body includes a signal conductor at the middle position of the thickness direction. The first ground conductor includes elongated conductors and bridge conductors. The elongated conductors are spaced in the width direction of the dielectric element body, and extend in the longitudinal direction. The bridge conductors connect the elongated conductors at spacings along the longitudinal direction. The spacing of bridge conductors across the bending point in a bent portion is smaller than the spacing of adjacent bridge conductors located in a straight portion.
    Type: Grant
    Filed: June 27, 2013
    Date of Patent: June 30, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koji Shiroki, Yoichi Saito, Hiromasa Koyama, Hirotaka Fujii, Noboru Kato
  • Patent number: 8803315
    Abstract: A semiconductor component is face-up mounted on a package substrate. An antenna substrate is flip-chip mounted on a front side of the semiconductor component. A device-side high-frequency signal terminal is disposed on the front side of the semiconductor component, and an antenna-side high-frequency signal terminal is disposed on a back side of the antenna substrate. The device-side high-frequency signal terminal and the antenna-side high-frequency signal terminal are electrically connected to each other. Thus, the antenna substrate for high-frequency signals can be separated from the package substrate for baseband signals.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: August 12, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koichi Takizawa, Yoshihiko Goto, Kaoru Sudo, Hirotaka Fujii
  • Publication number: 20140003007
    Abstract: A transmission line portion of a flat cable that is bent at a position along the longitudinal direction includes a dielectric element body, a first ground conductor, and a second ground conductor. The dielectric element body includes a signal conductor at the middle position of the thickness direction. The first ground conductor includes elongated conductors and bridge conductors. The elongated conductors are spaced in the width direction of the dielectric element body, and extend in the longitudinal direction. The bridge conductors connect the elongated conductors at spacings along the longitudinal direction. The spacing of bridge conductors across the bending point in a bent portion is smaller than the spacing of adjacent bridge conductors located in a straight portion.
    Type: Application
    Filed: June 27, 2013
    Publication date: January 2, 2014
    Inventors: Koji SHIROKI, Yoichi SAITO, Hiromasa KOYAMA, Hirotaka FUJII, Noboru KATO
  • Publication number: 20120287019
    Abstract: This disclosure provides a wideband antenna including a feed line, a ground conductor plate and a radiating conductor element connected to the feed line and facing the ground conductor plate at a distance from the ground conductor plate. A parasitic conductor element is provided on a side opposite to the ground conductor plate as viewed from the radiating conductor plate and is insulated from these plates. A coupling adjusting conductor plate is positioned between the radiating conductor element and the parasitic conductor element, is configured to adjust an amount of coupling between them, overlaps an area where the radiating conductor element and the parasitic conductor element overlap, and straddles the radiating conductor element in a direction orthogonal to the direction of a current I that flows therein. Both end sides of the coupling adjusting conductor plate are electrically connected to the ground conductor plate via via-holes.
    Type: Application
    Filed: July 23, 2012
    Publication date: November 15, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Kaoru SUDO, Hirotaka FUJII, Toshiro HIRATSUKA