Patents by Inventor Hirotaka Nishizawa

Hirotaka Nishizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190181059
    Abstract: A method for evaluating surface defects of a substrate to be bonded: preparing a mirror-polished silicon single crystal substrate; inspecting surface defects on the mirror-polished silicon single crystal substrate; depositing a polycrystalline silicon layer on a surface of the silicon single crystal substrate subjected to the defect inspection; performing mirror edge polishing to the silicon single crystal substrate having the polycrystalline silicon layer deposited thereon; polishing a surface of the polycrystalline silicon layer; inspecting surface defects on the polished polycrystalline silicon layer; and comparing coordinates of defects detected at the step of inspecting the surface defects on the silicon single crystal substrate with counterparts detected at the step of inspecting the surface defects on the polycrystalline silicone layer and determining quality of the silicon single crystal substrate having the polycrystalline silicon layer as a substrate to be bonded on the basis of presence/absence of
    Type: Application
    Filed: July 26, 2017
    Publication date: June 13, 2019
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Kazuya SATO, Hiromasa HASHIMOTO, Tsuyoshi NISHIZAWA, Hirotaka HORIE
  • Publication number: 20160254780
    Abstract: A power conversion apparatus that is connected between a solar panel and a power system, in which the power conversion apparatus includes a power generating mode that converts a generated power of the solar panel into an alternating current power, and a snow melting mode that heats the solar panel by obtaining the power from the power system, and supplying the power to the solar panel, and at the time of the snow melting mode, the power conversion apparatus controls a voltage which is output to the solar panel such that a first current value being a value where a current that is supplied to the solar panel from the power conversion apparatus is smaller than an overcurrent level of the solar panel flows in a predetermined period.
    Type: Application
    Filed: February 19, 2016
    Publication date: September 1, 2016
    Inventors: Tomomichi ITO, Hideaki KUNISADA, Kaoru SONOBE, Hirotaka NISHIZAWA, Yoshiro NAKAJIMA, Tamaki WADA
  • Publication number: 20110227234
    Abstract: A multifunction card device has an external connection terminal, an interface controller, a memory, and the security controller connected to the interface controller and the external connection terminal. The interface controller has a plurality of interface control modes, and controls an external-interface action and a memory interface action by the control mode according to the instruction from the outside. The external connection terminals have an individual terminal individualized for every interface control mode, and a communalized common terminal. A clock input terminal, a power supply terminal, and an earthing terminal are included in the common terminals. A data terminal, and a dedicated terminal of the security controller are included in the individual terminals. Partial communalization and individualization of an external connection terminal attain a guarantee of the reliability of an interface, and increase control of physical magnitude to some kinds of interface control modes.
    Type: Application
    Filed: June 3, 2011
    Publication date: September 22, 2011
    Inventors: Hirotaka Nishizawa, Akira Higuchi, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama
  • Patent number: 8018038
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Grant
    Filed: July 14, 2010
    Date of Patent: September 13, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Hirotaka Nishizawa, Yosuke Yukawa, Takashi Totsuka
  • Patent number: 7971791
    Abstract: A multifunction card device has an external connection terminal, an interface controller, a memory, and the security controller connected to the interface controller and the external connection terminal. The interface controller has a plurality of interface control modes, and controls an external-interface action and a memory interface action by the control mode according to the instruction from the outside. The external connection terminals have an individual terminal individualized for every interface control mode, and a communalized common terminal. A clock input terminal, a power supply terminal, and an earthing terminal are included in the common terminals. A data terminal, and a dedicated terminal of the security controller are included in the individual terminals. Partial communalization and individualization of an external connection terminal attain a guarantee of the reliability of an interface, and increase control of physical magnitude to some kinds of interface control modes.
    Type: Grant
    Filed: July 3, 2003
    Date of Patent: July 5, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Hirotaka Nishizawa, Akira Higuchi, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama
  • Patent number: 7971793
    Abstract: The present invention provides a memory card equipped with an interface controller connected to external connecting terminals, a memory connected to the interface controller, and a security controller connected to the interface controller. A second external connecting terminal capable of supplying an operating power supply to the security controller is provided aside from a first external connecting terminal which supplies an operating power supply to the interface controller and the memory. An interface unit of the interface controller connected to the security controller receives the operating power supply from the second external connecting terminal and thereby enables a stop of the supply of the operating power supply from the first external connecting terminal. Even if the supply of the operating power supply to the interface controller is cut off, the output of the interface unit is not brought to an indefinite state.
    Type: Grant
    Filed: November 27, 2007
    Date of Patent: July 5, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Hirotaka Nishizawa, Akira Higuchi, Kenji Osawa, Tamaki Wada, Michiaki Sugiyama, Junichiro Osako
  • Patent number: 7946500
    Abstract: An antenna connection function for a noncontact interface is provided by suppressing a modification in a pin arrangement and a pin shape of a memory card that does not correspond to the noncontact interface. Two antenna connecting pins having the memory card are divided into two areas in which a size of one potential supply pin is the largest and used as a split pin arranged at intervals. Because a size of the two antenna connecting pins is at maximum as large as the size of the potential supply pin, the two antenna connecting pins are provided and the memory card that corresponds to the noncontact interface is obtained by devoting a pin area having the size of the one potential supply pin to the memory card that does not correspond to the noncontact interface. Accordingly, the pin area of the memory card that corresponds to the noncontact interface can be formed without departing from the pin area of the memory card that does not correspond to the noncontact interface.
    Type: Grant
    Filed: December 16, 2007
    Date of Patent: May 24, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Hirotaka Nishizawa, Akira Higuchi, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama
  • Publication number: 20100277963
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Application
    Filed: July 14, 2010
    Publication date: November 4, 2010
    Inventors: Hirotaka NISHIZAWA, Yosuke YUKAWA, Takashi TOTSUKA
  • Patent number: 7823793
    Abstract: An IC card and card adapters are designed so that the IC card of a specific standard (e.g., MMC standard) is compatible with IC cards and terminals of other standards (e.g., MS card standard and USB terminal standard). In the IC card (MMC), a controller IC, which is connected to a flash memory, includes a voltage pull-down detector, a mode controller, a USB-mode interface controller, a MS-mode interface controller, and an MMC/SD-mode interface controller. The card adapters suffice to have component parts which are easy in formation and low in cost such as wiring lines and resistors. The voltage pull-down detector of the IC card detects the voltage pull-down caused by the resistors, and the mode controller selects the USB-mode interface controller, MS-mode interface controller or MMC/SD-mode interface controller so that the IC card becomes compatible with the corresponding IC card standard.
    Type: Grant
    Filed: October 30, 2008
    Date of Patent: November 2, 2010
    Assignees: Renesas Electronics Corporation, Hitachi ULSI Systems Co., Ltd.
    Inventors: Akira Higuchi, Hirotaka Nishizawa, Junichiro Osako, Kenji Osawa
  • Publication number: 20100267419
    Abstract: In an IC card, there is provided a technique capable of large expandability of a memory volume, and a memory volume and a cost matched with a user's requirement. A SIM adapter 101 has a top panel 104 for covering a recess portion. In the top panel 104, when a memory card 103 is not inserted, the top panel 104 is positioned at a first height, and, when the memory card 103 is inserted, a part of the top panel 104 is engaged with a part of the SIM adapter 101 so that the top panel is latched at a second height higher than the first height. Also, into a SIM adapter, a top panel for fixing a memory card when the memory card is inserted is inserted, and a part of the top panel is engaged with a part of the SIM adapter so that the top panel is latched when the memory card is inserted.
    Type: Application
    Filed: December 10, 2007
    Publication date: October 21, 2010
    Inventors: Hirotaka Nishizawa, Hironori Iwasaki, Hideo Koike, Junichiro Osako, Tamaki Wada, Takashi Totsuka
  • Publication number: 20100257313
    Abstract: A semiconductor device has operation modes selectable through the control by a second microcomputer (113). In a first mode, an operation of a memory controller (105) responding to a memory card command from a memory card interface terminal and an operation of a first microcomputer (106) responding to an IC card command from an IC card interface terminal are separately performed. In a second mode, the first microcomputer operates in response to the IC card command from the IC card interface terminal. In a third mode, the memory controller and the first microcomputer operate in response to an undefined IC card command from the IC card interface terminal. In a fourth mode, the memory controller and the first microcomputer operate in response to the memory card command from the memory card interface terminal. Convenience of the semiconductor device having an IC card function and a memory card function is improved.
    Type: Application
    Filed: May 16, 2007
    Publication date: October 7, 2010
    Applicant: RENESAS TECHNOLOGY CORP.
    Inventors: Hirotaka Nishizawa, Junichiro Osako, Minoru Shinohara, Tamaki Wada, Kunihirio Katayama, Shigemasa Shiota
  • Patent number: 7768110
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Grant
    Filed: October 1, 2007
    Date of Patent: August 3, 2010
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Yosuke Yukawa, Takashi Totsuka
  • Publication number: 20100072284
    Abstract: Connector terminals are arranged at the center of a thin memory card 1802, thereby preventing an electrical short circuit between the terminals. A step is provided to the thin memory card 1802, thereby allowing the IC chips to be stacked in a thick portion. Adhesion portions of the connector terminals 3303 are located at a position on a card insertion port side of a substrate 3002, thereby preventing the destruction of the connector terminals at the time of the card insertion. An upper retainer lid 3003 is provided on an upper portion of the connector terminals 3303, thereby preventing the deflection of the card.
    Type: Application
    Filed: December 12, 2007
    Publication date: March 25, 2010
    Applicant: RENESAS TECHNOLOGY CORP.
    Inventors: Hirotaka NISHIZAWA, Hideo KOIKE, Hironori IWASAKI, Junichiro OSAKO, Minoru SHINOHARA, Tamaki WADA, Takashi TOTSUKA
  • Patent number: 7669773
    Abstract: To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals.
    Type: Grant
    Filed: October 18, 2007
    Date of Patent: March 2, 2010
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Takashi Totsuka, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama
  • Publication number: 20100025480
    Abstract: A technique for an IC capable of achieving the large expandability of the memory capacity, a memory capacity and cost burden in accordance with the requirements of users is provided. The IC card of the present invention is a flash memory card 306 mounted with a flash memory, characterized in that the flash memory card 306 can be inserted into a Plug-in SIM adaptor 305a and/or a mini UICC adaptor 305b each mounted with a secure IC, the flash memory card 306 is inserted into the Plug-in SIM adaptor 305a or the mini UICC adaptor 305b, thereby operating as a SIM attached with an expansion memory or a mini UICC attached with an expansion memory, and the flash memory card 306 can be physically removed from the Plug-in SIM adaptor 305a or the mini UICC adaptor 305b.
    Type: Application
    Filed: March 30, 2007
    Publication date: February 4, 2010
    Inventors: Hirotaka Nishizawa, Junichiro Osako, Hironori Iwasaki, Hideo Koike, Tamaki Wada, Takashi Totsuka
  • Patent number: 7646085
    Abstract: A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enough to keep touching the corresponding terminals of the host equipment for, at least, a predetermined time period since the separation of an extraction detecting terminal among the external interface terminals, from the corresponding terminal of the host equipment, and they are formed to be longer in the extraction direction of the semiconductor device than the extraction detecting terminal. Thus, a time period till the cutoff of the power source is easily made comparatively long. The power source feeding terminals should preferably be extended onto the insertion side of the semiconductor device, but an extendible distance is sometimes liable to be limited.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: January 12, 2010
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Kenji Osawa, Hideo Koike, Junichiro Osako, Tamaki Wada
  • Publication number: 20090283885
    Abstract: On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.
    Type: Application
    Filed: July 23, 2009
    Publication date: November 19, 2009
    Inventors: Tamaki Wada, Hirotaka Nishizawa, Masachika Masuda, Kenji Osawa, Junichiro Osako, Satoshi Hatakeyama, Haruji Ishihara, Kazuo Yoshizaki, Kazunori Furusawa
  • Patent number: 7615855
    Abstract: An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: November 10, 2009
    Assignee: Renesas Technology Corp.
    Inventors: Junichiro Osako, Hirotaka Nishizawa, Kenji Osawa, Akira Higuchi
  • Publication number: 20090181721
    Abstract: A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secret codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level. Owing to the adoption of a plural-column layout corresponding to a form typified by the zigzag fashion in an array of the connector terminals, a relatively simple structure can be adopted in a card slot.
    Type: Application
    Filed: March 23, 2009
    Publication date: July 16, 2009
    Inventors: Hirotaka NISHIZAWA, Haruji ISHIHARA, Atsushi SHIRAISHI, Yosuke YUKAWA
  • Patent number: 7552876
    Abstract: An IC card has a card substrate having semiconductor integrated circuit chips mounted thereon and a plurality of connector terminals formed thereon. The connector terminals are exposed from a casing. The connector terminals are laid out in plural sequences in staggered form between sequences adjacent to one another forward and backward as viewed in an IC card inserting direction. Owing to the adoption of the staggered layout, a structure or configuration wherein the amounts of protrusions of socket terminals of a card socket are changed and the socket terminals are laid out in tandem, can be adopted with relative ease. If a connector terminal arrangement of a downward or low-order IC card is adopted as a specific connector terminal sequence as it is, whereas a function dedicated for an upward or high-order IC card is assigned to another staggered connector terminal arrangement, then backward compatibility can also be implemented with ease.
    Type: Grant
    Filed: October 25, 2007
    Date of Patent: June 30, 2009
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Haruji Ishihara, Atsushi Shiraishi, Kouichi Kanemoto, Yousuke Yukawa