Patents by Inventor Hiroto Shimokawa

Hiroto Shimokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9373735
    Abstract: A polyimide-metal laminate comprising a polyimide film and a metal layer for use as an electrode, which is formed on the side (Side B) of the polyimide film which was in contact with a support when producing a self-supporting film in the production of the polyimide film, is used to produce a CIS solar cell.
    Type: Grant
    Filed: May 20, 2009
    Date of Patent: June 21, 2016
    Assignee: UBE INDUSTRIES, LTD.
    Inventors: Hiroto Shimokawa, Takeshi Uekido, Naoyuki Matsumoto, Ken Kawagishi, Hiroaki Yamaguchi
  • Patent number: 9209333
    Abstract: Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component and an aromatic diamine component, which has a dimensional change from 25° C. to 500° C. within a range of from ?0.3% to +0.6% based on the initial dimension at 25° C. The polyimide film may be used as a substrate for a CIS solar cell.
    Type: Grant
    Filed: May 20, 2009
    Date of Patent: December 8, 2015
    Assignee: UBE Industries, Ltd.
    Inventors: Hiroto Shimokawa, Takeshi Uekido, Ken Kawagishi, Hiroaki Yamaguchi
  • Patent number: 8858751
    Abstract: A method for producing a flexible metal laminate includes continuously thermocompression-bonding laminate metal foils to a resin film. The thermocompression-bonding step is conducted by placing a protection metal foil between a pressure surface of a heat and pressure forming apparatus and the laminate metal foils. When the protection metal foil is subjected to an abrasion resistance test, in which the protection metal foil is placed such that a matte surface of the protection metal foil contacts a plate material having a surface equivalent to the pressure surface and in which the matte surface is rubbed against the surface of the plate material by applying a load to a shiny surface of the protection metal foil and pulling the protection metal foil, a streak is found on the matte surface only in a case where the load is over 500 g per area of 76 mm×26 mm.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: October 14, 2014
    Assignees: Ube Industries, Ltd., Ube-Nitto Kasei Co., Ltd.
    Inventors: Takuro Kochiyama, Hiroto Shimokawa, Yoshitaka Mineki, Masami Sasaki
  • Patent number: 8624125
    Abstract: The present invention relates to a metal foil laminated polyimide resin substrate wherein a metal foil is directly laminated on one side or both sides of a polyimide resin substrate; and the surface of the metal foil to be bonded to the polyimide resin substrate has a surface roughness (Rzjis) of 3.0 ?m or less; a surface area ratio (B) of 1.25 to 2.50, in which the surface area ratio (B) is calculated as a ratio [A/6550] of a surface area of a two-dimensional region with a surface area of 6550 ?m2 which is determined by a laser method (three-dimensional area: A ?m2) to the area of the two-dimensional region; and a chromium content per unit area of the two-dimensional region of 2.0 mg/m2 or more.
    Type: Grant
    Filed: October 24, 2008
    Date of Patent: January 7, 2014
    Assignee: Ube Industries, Ltd.
    Inventors: Hiroto Shimokawa, Atsushi Okabe
  • Publication number: 20120168053
    Abstract: A method for producing a flexible metal laminate includes continuously thermocompression-bonding laminate metal foils to a resin film. The thermocompression-bonding step is conducted by placing a protection metal foil between a pressure surface of a heat and pressure forming apparatus and the laminate metal foils. When the protection metal foil is subjected to an abrasion resistance test, in which the protection metal foil is placed such that a matte surface of the protection metal foil contacts a plate material having a surface equivalent to the pressure surface and in which the matte surface is rubbed against the surface of the plate material by applying a load to a shiny surface of the protection metal foil and pulling the protection metal foil, a streak is found on the matte surface only in a case where the load is over 500 g per area of 76 mm×26 mm.
    Type: Application
    Filed: September 9, 2010
    Publication date: July 5, 2012
    Applicants: UBE-NITTO KASEI CO., LTD., UBE INDUSTRIES, LTD
    Inventors: Takuro Kochiyama, Hiroto Shimokawa, Yoshitaka Mineki, Masami Sasaki
  • Publication number: 20110079277
    Abstract: A polyimide-metal laminate comprising a polyimide film and a metal layer for use as an electrode, which is formed on the side (Side B) of the polyimide film which was in contact with a support when producing a self-supporting film in the production of the polyimide film, is used to produce a CIS solar cell.
    Type: Application
    Filed: May 20, 2009
    Publication date: April 7, 2011
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Hiroto Shimokawa, Takeshi Uekido, Naoyuki Matsumoto, Ken Kawagishi, Hiroaki Yamaguchi
  • Publication number: 20110067760
    Abstract: Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component and an aromatic diamine component, which has a dimensional change from 25° C. to 500° C. within a range of from ?0.3% to +0.6% based on the initial dimension at 25° C. The polyimide film may be used as a substrate for a CIS solar cell.
    Type: Application
    Filed: May 20, 2009
    Publication date: March 24, 2011
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Hiroto Shimokawa, Takeshi Uekido, Ken Kawagishi, Hiroaki Yamaguchi
  • Publication number: 20110005812
    Abstract: The present invention relates to a metal foil laminated polyimide resin substrate wherein a metal foil is directly laminated on one side or both sides of a polyimide resin substrate; and the surface of the metal foil to be bonded to the polyimide resin substrate has a surface roughness (Rzjis) of 3.0 ?m or less; a surface area ratio (B) of 1.25 to 2.50, in which the surface area ratio (B) is calculated as a ratio [A/6550] of a surface area of a two-dimensional region with a surface area of 6550 ?m2 which is determined by a laser method (three-dimensional area: A ?m2) to the area of the two-dimensional region; and a chromium content per unit area of the two-dimensional region of 2.0 mg/m2 or more.
    Type: Application
    Filed: October 24, 2008
    Publication date: January 13, 2011
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Hiroto Shimokawa, Atsushi Okabe
  • Publication number: 20090266589
    Abstract: Is disclosed a process for producing a metal wiring substrate comprising a heat resistant resin substrate and a metal wiring which is laminated on the substrate and in which a surface laminated with the substrate is surface-treated with at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo or an alloy comprising at least one of these metals (hereafter, the metal used for the surface-treatment is referred to as a surface-treatment metal). This process comprises the steps of forming the metal wiring on the resin substrate, and washing at least a surface of the resin substrate with an etching solution capable of removing the surface-treatment metal to increase adhesion of the surface of the resin substrate. The produced metal wiring substrate has excellent adhesion with adhesives for affixing anisotropic conductive films and IC chips to films.
    Type: Application
    Filed: October 13, 2006
    Publication date: October 29, 2009
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Hiroto Shimokawa, Nobu Iizumi, keita Bamba, Tadahiro Yokozawa
  • Publication number: 20090211786
    Abstract: Is disclosed a process for producing a copper-wiring polyimide film from a carrier-accompanied copper foil laminated polyimide film by a subtractive method or a semi-additive method. Washing the polyimide surface exposed by etching the copper foil with a etching solution capable of removing mainly at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo or an alloy comprising at least one of these metals used for a surface treatment of the copper foil restrains an anomalous deposition of plating substances when the copper wiring is plated with tin.
    Type: Application
    Filed: October 13, 2006
    Publication date: August 27, 2009
    Inventors: Keita Bamba, Tadahiro Yokozawa, Hiroto Shimokawa, Nobu Iizumi
  • Publication number: 20090136725
    Abstract: There is disclosed a copper wiring polyimide film having wiring with ultra fine pitch and excellent in the linearity. The copper wiring polyimide film is produced by a process for producing a copper wiring polyimide film having a 20 to 45 ?m-pitch copper wiring part by a semi-additive method using a copper foil laminated polyimide film with carrier. The process comprises (a) a step of providing a copper foil laminated film comprising a copper foil having a film side surface roughness Rz of not more than 1.0 ?m and a thickness in the range of 0.5 to 2 ?m laminated on a surface of a polyimide film, (b) a step of forming a plating resist pattern layer in which a wiring pattern having 20 to 45 ?m pitch can be formed on the upper surface of the copper foil, (c) a step of conducting copper plating on the copper foil part exposed from the resist, (d) a step of removing the plating resist, and (e) a step of removing the copper foil exposed on the plating resist-removed part to expose a polyimide film.
    Type: Application
    Filed: March 23, 2007
    Publication date: May 28, 2009
    Inventors: Hiroto Shimokawa, Keita Bamba
  • Publication number: 20060154037
    Abstract: A polyimide-copper composite laminate is composed of a metallic carrier having a thickness of 10-35 ?m and a thin copper film having a thickness of 1-8 ?m, and an intervening heat-resistant layer and an aromatic polyimide film directly fixed to the thin copper film without adhesive.
    Type: Application
    Filed: February 9, 2005
    Publication date: July 13, 2006
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Hiroto Shimokawa, Kohji Narui, Toshinori Hosoma, Toshihiko Anno
  • Publication number: 20050019598
    Abstract: A copper-clad laminate is composed of a polyimide film and an electrolytically plated copper film placed on at least one surface side of the polyimide film, in which the copper film has at most 200 protrusions having a diameter of 15 ?m or more on its surface not facing the polyimide film, and the laminate has a peel strength of 1 kgf/cm or more and shows a peel strength of 0.6 kgf/cm or more after heating at 150° C. for 24 hours.
    Type: Application
    Filed: October 29, 2003
    Publication date: January 27, 2005
    Applicant: Ube Industries, Ltd.
    Inventors: Shozo Katsuki, Hiroto Shimokawa
  • Patent number: 6440576
    Abstract: A metal-plated aromatic polyimide film composed of an aromatic polyimide resin film, a surface layer of which contains a dispersed palladium metal or a palladium compound, and a metal layer which is chemically plated on the surface layer of the polyimide resin film. The surface layer is preferably formed by placing a palladium compound on a self-supporting aromatic polyimide precursor film and heating the self-supporting film having the palladium compound on its surface layer to a temperature at which the polyimide precursor is converted into its corresponding aromatic polyimide.
    Type: Grant
    Filed: February 3, 2000
    Date of Patent: August 27, 2002
    Assignee: Ube Industries, Ltd.
    Inventors: Tomohiko Yamamoto, Jun Takagi, Hiroto Shimokawa