Patents by Inventor Hiroto Shimokawa
Hiroto Shimokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9373735Abstract: A polyimide-metal laminate comprising a polyimide film and a metal layer for use as an electrode, which is formed on the side (Side B) of the polyimide film which was in contact with a support when producing a self-supporting film in the production of the polyimide film, is used to produce a CIS solar cell.Type: GrantFiled: May 20, 2009Date of Patent: June 21, 2016Assignee: UBE INDUSTRIES, LTD.Inventors: Hiroto Shimokawa, Takeshi Uekido, Naoyuki Matsumoto, Ken Kawagishi, Hiroaki Yamaguchi
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Patent number: 9209333Abstract: Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component and an aromatic diamine component, which has a dimensional change from 25° C. to 500° C. within a range of from ?0.3% to +0.6% based on the initial dimension at 25° C. The polyimide film may be used as a substrate for a CIS solar cell.Type: GrantFiled: May 20, 2009Date of Patent: December 8, 2015Assignee: UBE Industries, Ltd.Inventors: Hiroto Shimokawa, Takeshi Uekido, Ken Kawagishi, Hiroaki Yamaguchi
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Patent number: 8858751Abstract: A method for producing a flexible metal laminate includes continuously thermocompression-bonding laminate metal foils to a resin film. The thermocompression-bonding step is conducted by placing a protection metal foil between a pressure surface of a heat and pressure forming apparatus and the laminate metal foils. When the protection metal foil is subjected to an abrasion resistance test, in which the protection metal foil is placed such that a matte surface of the protection metal foil contacts a plate material having a surface equivalent to the pressure surface and in which the matte surface is rubbed against the surface of the plate material by applying a load to a shiny surface of the protection metal foil and pulling the protection metal foil, a streak is found on the matte surface only in a case where the load is over 500 g per area of 76 mm×26 mm.Type: GrantFiled: September 9, 2010Date of Patent: October 14, 2014Assignees: Ube Industries, Ltd., Ube-Nitto Kasei Co., Ltd.Inventors: Takuro Kochiyama, Hiroto Shimokawa, Yoshitaka Mineki, Masami Sasaki
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Patent number: 8624125Abstract: The present invention relates to a metal foil laminated polyimide resin substrate wherein a metal foil is directly laminated on one side or both sides of a polyimide resin substrate; and the surface of the metal foil to be bonded to the polyimide resin substrate has a surface roughness (Rzjis) of 3.0 ?m or less; a surface area ratio (B) of 1.25 to 2.50, in which the surface area ratio (B) is calculated as a ratio [A/6550] of a surface area of a two-dimensional region with a surface area of 6550 ?m2 which is determined by a laser method (three-dimensional area: A ?m2) to the area of the two-dimensional region; and a chromium content per unit area of the two-dimensional region of 2.0 mg/m2 or more.Type: GrantFiled: October 24, 2008Date of Patent: January 7, 2014Assignee: Ube Industries, Ltd.Inventors: Hiroto Shimokawa, Atsushi Okabe
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Publication number: 20120168053Abstract: A method for producing a flexible metal laminate includes continuously thermocompression-bonding laminate metal foils to a resin film. The thermocompression-bonding step is conducted by placing a protection metal foil between a pressure surface of a heat and pressure forming apparatus and the laminate metal foils. When the protection metal foil is subjected to an abrasion resistance test, in which the protection metal foil is placed such that a matte surface of the protection metal foil contacts a plate material having a surface equivalent to the pressure surface and in which the matte surface is rubbed against the surface of the plate material by applying a load to a shiny surface of the protection metal foil and pulling the protection metal foil, a streak is found on the matte surface only in a case where the load is over 500 g per area of 76 mm×26 mm.Type: ApplicationFiled: September 9, 2010Publication date: July 5, 2012Applicants: UBE-NITTO KASEI CO., LTD., UBE INDUSTRIES, LTDInventors: Takuro Kochiyama, Hiroto Shimokawa, Yoshitaka Mineki, Masami Sasaki
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Publication number: 20110079277Abstract: A polyimide-metal laminate comprising a polyimide film and a metal layer for use as an electrode, which is formed on the side (Side B) of the polyimide film which was in contact with a support when producing a self-supporting film in the production of the polyimide film, is used to produce a CIS solar cell.Type: ApplicationFiled: May 20, 2009Publication date: April 7, 2011Applicant: UBE INDUSTRIES, LTD.Inventors: Hiroto Shimokawa, Takeshi Uekido, Naoyuki Matsumoto, Ken Kawagishi, Hiroaki Yamaguchi
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Publication number: 20110067760Abstract: Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component and an aromatic diamine component, which has a dimensional change from 25° C. to 500° C. within a range of from ?0.3% to +0.6% based on the initial dimension at 25° C. The polyimide film may be used as a substrate for a CIS solar cell.Type: ApplicationFiled: May 20, 2009Publication date: March 24, 2011Applicant: UBE INDUSTRIES, LTD.Inventors: Hiroto Shimokawa, Takeshi Uekido, Ken Kawagishi, Hiroaki Yamaguchi
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Publication number: 20110005812Abstract: The present invention relates to a metal foil laminated polyimide resin substrate wherein a metal foil is directly laminated on one side or both sides of a polyimide resin substrate; and the surface of the metal foil to be bonded to the polyimide resin substrate has a surface roughness (Rzjis) of 3.0 ?m or less; a surface area ratio (B) of 1.25 to 2.50, in which the surface area ratio (B) is calculated as a ratio [A/6550] of a surface area of a two-dimensional region with a surface area of 6550 ?m2 which is determined by a laser method (three-dimensional area: A ?m2) to the area of the two-dimensional region; and a chromium content per unit area of the two-dimensional region of 2.0 mg/m2 or more.Type: ApplicationFiled: October 24, 2008Publication date: January 13, 2011Applicant: UBE INDUSTRIES, LTD.Inventors: Hiroto Shimokawa, Atsushi Okabe
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Publication number: 20090266589Abstract: Is disclosed a process for producing a metal wiring substrate comprising a heat resistant resin substrate and a metal wiring which is laminated on the substrate and in which a surface laminated with the substrate is surface-treated with at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo or an alloy comprising at least one of these metals (hereafter, the metal used for the surface-treatment is referred to as a surface-treatment metal). This process comprises the steps of forming the metal wiring on the resin substrate, and washing at least a surface of the resin substrate with an etching solution capable of removing the surface-treatment metal to increase adhesion of the surface of the resin substrate. The produced metal wiring substrate has excellent adhesion with adhesives for affixing anisotropic conductive films and IC chips to films.Type: ApplicationFiled: October 13, 2006Publication date: October 29, 2009Applicant: UBE INDUSTRIES, LTD.Inventors: Hiroto Shimokawa, Nobu Iizumi, keita Bamba, Tadahiro Yokozawa
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Publication number: 20090211786Abstract: Is disclosed a process for producing a copper-wiring polyimide film from a carrier-accompanied copper foil laminated polyimide film by a subtractive method or a semi-additive method. Washing the polyimide surface exposed by etching the copper foil with a etching solution capable of removing mainly at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo or an alloy comprising at least one of these metals used for a surface treatment of the copper foil restrains an anomalous deposition of plating substances when the copper wiring is plated with tin.Type: ApplicationFiled: October 13, 2006Publication date: August 27, 2009Inventors: Keita Bamba, Tadahiro Yokozawa, Hiroto Shimokawa, Nobu Iizumi
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Publication number: 20090136725Abstract: There is disclosed a copper wiring polyimide film having wiring with ultra fine pitch and excellent in the linearity. The copper wiring polyimide film is produced by a process for producing a copper wiring polyimide film having a 20 to 45 ?m-pitch copper wiring part by a semi-additive method using a copper foil laminated polyimide film with carrier. The process comprises (a) a step of providing a copper foil laminated film comprising a copper foil having a film side surface roughness Rz of not more than 1.0 ?m and a thickness in the range of 0.5 to 2 ?m laminated on a surface of a polyimide film, (b) a step of forming a plating resist pattern layer in which a wiring pattern having 20 to 45 ?m pitch can be formed on the upper surface of the copper foil, (c) a step of conducting copper plating on the copper foil part exposed from the resist, (d) a step of removing the plating resist, and (e) a step of removing the copper foil exposed on the plating resist-removed part to expose a polyimide film.Type: ApplicationFiled: March 23, 2007Publication date: May 28, 2009Inventors: Hiroto Shimokawa, Keita Bamba
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Publication number: 20060154037Abstract: A polyimide-copper composite laminate is composed of a metallic carrier having a thickness of 10-35 ?m and a thin copper film having a thickness of 1-8 ?m, and an intervening heat-resistant layer and an aromatic polyimide film directly fixed to the thin copper film without adhesive.Type: ApplicationFiled: February 9, 2005Publication date: July 13, 2006Applicant: UBE INDUSTRIES, LTD.Inventors: Hiroto Shimokawa, Kohji Narui, Toshinori Hosoma, Toshihiko Anno
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Publication number: 20050019598Abstract: A copper-clad laminate is composed of a polyimide film and an electrolytically plated copper film placed on at least one surface side of the polyimide film, in which the copper film has at most 200 protrusions having a diameter of 15 ?m or more on its surface not facing the polyimide film, and the laminate has a peel strength of 1 kgf/cm or more and shows a peel strength of 0.6 kgf/cm or more after heating at 150° C. for 24 hours.Type: ApplicationFiled: October 29, 2003Publication date: January 27, 2005Applicant: Ube Industries, Ltd.Inventors: Shozo Katsuki, Hiroto Shimokawa
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Patent number: 6440576Abstract: A metal-plated aromatic polyimide film composed of an aromatic polyimide resin film, a surface layer of which contains a dispersed palladium metal or a palladium compound, and a metal layer which is chemically plated on the surface layer of the polyimide resin film. The surface layer is preferably formed by placing a palladium compound on a self-supporting aromatic polyimide precursor film and heating the self-supporting film having the palladium compound on its surface layer to a temperature at which the polyimide precursor is converted into its corresponding aromatic polyimide.Type: GrantFiled: February 3, 2000Date of Patent: August 27, 2002Assignee: Ube Industries, Ltd.Inventors: Tomohiko Yamamoto, Jun Takagi, Hiroto Shimokawa