Patents by Inventor Hiroto Takenaka

Hiroto Takenaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200254821
    Abstract: A tyre includes a tread portion including first and second land portions. The first middle land portion is provided with first middle lateral grooves traversing the first middle land portion completely. The second middle land portion is provided with second middle lateral grooves traversing the second middle land portion completely. One of the first middle lateral grooves includes a raised portion in which a groove bottom thereof is raised, the raised portion traversing an axial center location of the first middle land portion. One of the second middle lateral grooves includes a raised portion in which a groove bottom thereof is raised, the raised portion traversing an axial center location of the second middle land portion. An axial length of the raised portion of the first middle lateral groove is greater than an axial length of the raised portion of the second middle lateral groove.
    Type: Application
    Filed: January 23, 2020
    Publication date: August 13, 2020
    Applicant: Sumitomo Rubber Industries, Ltd.
    Inventors: Hiroto TAKENAKA, Junya TAMAI, Akari KAWAZU
  • Publication number: 20200001665
    Abstract: In a tire 22, a length from a center PM in an axial direction of a boundary 60 between a core 48 and an apex 50 to an outer edge PA of the apex 50 is not less than 10 mm and not greater than 15 mm. In a state where the tire 22 is mounted on a normal rim and an internal pressure of the tire 22 is adjusted to 10% of a normal internal pressure, a main body portion 54 of a carcass ply 52 extending along an inner surface 62 of the apex 50 is tilted relative to the axial direction, and an angle of the main body portion 54 relative to the axial direction is not less than 40° and not greater than 60°.
    Type: Application
    Filed: June 24, 2019
    Publication date: January 2, 2020
    Applicant: Sumitomo Rubber Industries, Ltd.
    Inventors: Toshiaki HAMADA, Masahiro TATSUTA, Hiroki UNO, Hiroto TAKENAKA
  • Publication number: 20190061430
    Abstract: A pneumatic radial tire 1 for a passenger car comprises a carcass 6 having a radial structure, a belt layer 7, and a tread portion 2. The tread portion 2 has an outer tread edge (To) and an inner tread edge (Ti). A tread pattern is formed in an asymmetric shape with respect to a tire equator (C). The tread portion 2 is divided into a plurality of circumferential land regions by a plurality of main grooves 10. The circumferential land regions include an outer shoulder land region 16, an inner shoulder land region 17, and a middle land region 18 arranged therebetween. The outer shoulder land region 16 is larger than the inner shoulder land region 17 with respect to rigidity in a tire circumferential direction and the rigidity in a tire axial direction.
    Type: Application
    Filed: August 7, 2018
    Publication date: February 28, 2019
    Applicant: Sumitomo Rubber Industries, Ltd.
    Inventors: Atsushi KAMIGORI, Kenji UEDA, Makoto SONODA, Hiroto TAKENAKA, Takuya OSAWA, Kota HAYASHI, Masahiro NAGASE, Tomohisa KURIYAMA
  • Patent number: 8853734
    Abstract: Provided are: a curable epoxy resin composition including an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by following Formula (1) where each of R1s and R2 represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, and a curing agent (C) or curing catalyst (D); and a cured article obtained through curing of the curable epoxy resin composition. The alicyclic epoxy compound (A) preferably has cyclohexene oxide group as the alicyclic epoxy group.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: October 7, 2014
    Assignee: Daicel Corporation
    Inventors: Hiroto Takenaka, Atsuo Tatsumi
  • Publication number: 20130158167
    Abstract: A curable epoxy resin composition according to the present invention is a curable epoxy resin composition which includes a rubber-particle-dispersed epoxy compound (A) including an alicyclic epoxy compound and, dispersed therein, rubber particles. The curable epoxy resin composition further includes an alumina (B); and an aliphatic polyglycidyl ether (C) having a viscosity of 8000 mPa·s or more at 25° C. The rubber particles include a polymer derived from a (meth)acrylic ester as an essential monomer component, have hydroxyl group and/or carboxyl group on a surface thereof, and have an average particle diameter of 10 nm to 500 nm and a maximum particle diameter of 50 nm to 1000 nm. The curable epoxy resin composition gives a cured product having a refractive index with a difference from the refractive index of the rubber particles of within ±0.03.
    Type: Application
    Filed: December 13, 2011
    Publication date: June 20, 2013
    Applicant: DAICEL CORPORATION
    Inventor: Hiroto Takenaka
  • Publication number: 20120248498
    Abstract: Provided are: a curable epoxy resin composition including an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by following Formula (1) where each of R1s and R2 represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, and a curing agent (C) or curing catalyst (D); and a cured article obtained through curing of the curable epoxy resin composition. The alicyclic epoxy compound (A) preferably has cyclohexene oxide group as the alicyclic epoxy group.
    Type: Application
    Filed: January 21, 2011
    Publication date: October 4, 2012
    Applicant: DAICEL CORPORATION
    Inventors: Hiroto Takenaka, Atsuo Tatsumi
  • Patent number: 6991701
    Abstract: A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the wafer.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: January 31, 2006
    Assignee: Tokyo Electron Limited
    Inventors: Hiroto Takenaka, Hiroshi Nishikawa
  • Publication number: 20040026372
    Abstract: A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the wafer.
    Type: Application
    Filed: February 14, 2003
    Publication date: February 12, 2004
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Hiroto Takenaka, Hiroshi Nishikawa
  • Patent number: 6544380
    Abstract: An apparatus for treating a substrate which includes a chamber and an opening formed in the chamber allowing the substrate to be conveyed into the chamber or taken out thereof. The chamber, also, includes a detachable baffle plate that fits around an electrode. For treatment to commence, the substrate is placed on the electrode and the chamber is exhausted of or supplied with gases. The electrode is then vertically lifted together with the baffle plate and the baffle plate is moved either to a position that is higher in level than an upper end of the opening of the chamber or to a position that is lower in level than a lower end of the opening of the chamber. This allows the baffle plate to shield a region near the opening of the chamber from a treatment region and allows reaction products to be adhered to the baffle plate.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: April 8, 2003
    Assignee: Tokyo Electron Limited
    Inventors: Masayuki Tomoyasu, Akira Koshiishi, Kosuke Imafuku, Shosuke Endo, Kazuhiro Tahara, Yukio Naito, Kazuya Nagaseki, Keizo Hirose, Mitsuaki Komino, Hiroto Takenaka, Hiroshi Nishikawa, Yoshio Sakamoto
  • Publication number: 20020088547
    Abstract: A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the wafer.
    Type: Application
    Filed: February 19, 2002
    Publication date: July 11, 2002
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Masayuki Tomoyasu, Akira Koshiishi, Kosuke Imafuku, Shosuke Endo, Kazuhiro Tahara, Yukio Naito, Kazuya Nagaseki, Keizo Hirose, Mitsuaki Komino, Hiroto Takenaka, Hiroshi Nishikawa, Yoshio Sakamoto
  • Patent number: 6264788
    Abstract: A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the water.
    Type: Grant
    Filed: April 21, 2000
    Date of Patent: July 24, 2001
    Assignee: Tokyo Electron Limited
    Inventors: Masayuki Tomoyasu, Akira Koshiishi, Kosuke Imafuku, Shosuke Endo, Kazuhiro Tahara, Yukio Naito, Kazuya Nagaseki, Keizo Hirose, Mitsuaki Komino, Hiroto Takenaka, Hiroshi Nishikawa, Yoshio Sakamoto
  • Patent number: 6106737
    Abstract: A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f.sub.1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f.sub.2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the wafer.
    Type: Grant
    Filed: June 10, 1998
    Date of Patent: August 22, 2000
    Assignee: Tokyo Electron Limited
    Inventors: Masayuki Tomoyasu, Akira Koshiishi, Kosuke Imafuku, Shosuke Endo, Kazuhiro Tahara, Yukio Naito, Kazuya Nagaseki, Keizo Hirose, Mitsuaki Komino, Hiroto Takenaka, Hiroshi Nishikawa, Yoshio Sakamoto
  • Patent number: D877048
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: March 3, 2020
    Inventor: Hiroto Takenaka