Abstract: In a tire 22, a length from a center PM in an axial direction of a boundary 60 between a core 48 and an apex 50 to an outer edge PA of the apex 50 is not less than 10 mm and not greater than 15 mm. In a state where the tire 22 is mounted on a normal rim and an internal pressure of the tire 22 is adjusted to 10% of a normal internal pressure, a main body portion 54 of a carcass ply 52 extending along an inner surface 62 of the apex 50 is tilted relative to the axial direction, and an angle of the main body portion 54 relative to the axial direction is not less than 40° and not greater than 60°.

Abstract: A tyre includes a tread portion including first and second land portions. The first middle land portion is provided with first middle lateral grooves traversing the first middle land portion completely. The second middle land portion is provided with second middle lateral grooves traversing the second middle land portion completely. One of the first middle lateral grooves includes a raised portion in which a groove bottom thereof is raised, the raised portion traversing an axial center location of the first middle land portion. One of the second middle lateral grooves includes a raised portion in which a groove bottom thereof is raised, the raised portion traversing an axial center location of the second middle land portion. An axial length of the raised portion of the first middle lateral groove is greater than an axial length of the raised portion of the second middle lateral groove.

Abstract: In a tire 22, a length from a center PM in an axial direction of a boundary 60 between a core 48 and an apex 50 to an outer edge PA of the apex 50 is not less than 10 mm and not greater than 15 mm. In a state where the tire 22 is mounted on a normal rim and an internal pressure of the tire 22 is adjusted to 10% of a normal internal pressure, a main body portion 54 of a carcass ply 52 extending along an inner surface 62 of the apex 50 is tilted relative to the axial direction, and an angle of the main body portion 54 relative to the axial direction is not less than 40° and not greater than 60°.

Abstract: A pneumatic radial tire 1 for a passenger car comprises a carcass 6 having a radial structure, a belt layer 7, and a tread portion 2. The tread portion 2 has an outer tread edge (To) and an inner tread edge (Ti). A tread pattern is formed in an asymmetric shape with respect to a tire equator (C). The tread portion 2 is divided into a plurality of circumferential land regions by a plurality of main grooves 10. The circumferential land regions include an outer shoulder land region 16, an inner shoulder land region 17, and a middle land region 18 arranged therebetween. The outer shoulder land region 16 is larger than the inner shoulder land region 17 with respect to rigidity in a tire circumferential direction and the rigidity in a tire axial direction.

Abstract: Provided are: a curable epoxy resin composition including an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by following Formula (1) where each of R1s and R2 represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, and a curing agent (C) or curing catalyst (D); and a cured article obtained through curing of the curable epoxy resin composition. The alicyclic epoxy compound (A) preferably has cyclohexene oxide group as the alicyclic epoxy group.

Abstract: A curable epoxy resin composition according to the present invention is a curable epoxy resin composition which includes a rubber-particle-dispersed epoxy compound (A) including an alicyclic epoxy compound and, dispersed therein, rubber particles. The curable epoxy resin composition further includes an alumina (B); and an aliphatic polyglycidyl ether (C) having a viscosity of 8000 mPa·s or more at 25° C. The rubber particles include a polymer derived from a (meth)acrylic ester as an essential monomer component, have hydroxyl group and/or carboxyl group on a surface thereof, and have an average particle diameter of 10 nm to 500 nm and a maximum particle diameter of 50 nm to 1000 nm. The curable epoxy resin composition gives a cured product having a refractive index with a difference from the refractive index of the rubber particles of within ±0.03.

Abstract: Provided are: a curable epoxy resin composition including an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by following Formula (1) where each of R1s and R2 represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, and a curing agent (C) or curing catalyst (D); and a cured article obtained through curing of the curable epoxy resin composition. The alicyclic epoxy compound (A) preferably has cyclohexene oxide group as the alicyclic epoxy group.

Abstract: A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the wafer.

Abstract: A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the wafer.

Abstract: An apparatus for treating a substrate which includes a chamber and an opening formed in the chamber allowing the substrate to be conveyed into the chamber or taken out thereof. The chamber, also, includes a detachable baffle plate that fits around an electrode. For treatment to commence, the substrate is placed on the electrode and the chamber is exhausted of or supplied with gases. The electrode is then vertically lifted together with the baffle plate and the baffle plate is moved either to a position that is higher in level than an upper end of the opening of the chamber or to a position that is lower in level than a lower end of the opening of the chamber. This allows the baffle plate to shield a region near the opening of the chamber from a treatment region and allows reaction products to be adhered to the baffle plate.

Abstract: A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the wafer.

Abstract: A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the water.

Abstract: A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f.sub.1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f.sub.2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the wafer.