Patents by Inventor Hiroto Tamaki

Hiroto Tamaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9728689
    Abstract: A method of manufacturing a light emitting device includes: providing on a mounting substrate a soluble member which is soluble in a solvent and which has a lower surface, an upper surface opposite to the lower surface in a height direction, and an outer side surface provided between the lower surface and the upper surface, the lower surface contacting the mounting substrate; providing a light blocking member made of resin to cover the outer side surface of the soluble member so that an inner side wall of the light blocking member contacts the outer side surface of the soluble member; removing the soluble member using the solvent to provide a recess surrounded by the inner side wall of the light blocking member; and mounting a light emitting element in the recess.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: August 8, 2017
    Assignee: NICHIA CORPORATION
    Inventor: Hiroto Tamaki
  • Publication number: 20170213941
    Abstract: A method of manufacturing a light emitting device including: forming a supporting body on a mounting surface of each of semiconductor light emitting elements; arranging the semiconductor light emitting elements to be spaced apart from each other by a predetermined distance; and forming a wavelength conversion layer to continuously cover an upper surface and side surfaces of at least one of the semiconductor light emitting elements. The forming the wavelength conversion layer includes spraying a slurry provided by mixing particles of a wavelength conversion member and a thermosetting resin in a solvent onto the upper surface and the side surfaces of the semiconductor light emitting element, so that a thickness of the wavelength conversion layer at a lower portion of the side surfaces of the supporting body is smaller than the thickness on the upper surface and the side surfaces of the semiconductor light emitting element.
    Type: Application
    Filed: April 10, 2017
    Publication date: July 27, 2017
    Inventors: Takeshi IKEGAMI, Tadao HAYASHI, Hiroto TAMAKI
  • Patent number: 9711691
    Abstract: A light emitting device has a base body equipped with a base material and a pair of connection terminals disposed from a first main face to a second main face that is on the opposite side from the first main face; a plurality of light emitting elements connected to the connection terminals on the first main face; and a light reflecting member that covers the side faces of the light emitting elements, the base material having a protruding component on the second main face, the protruding component being one of a heat releasing terminal, a reinforcement terminal, and an insulating film, and the connection terminals being disposed on the first main face from the second main face on both sides of the protruding component, and being partly exposed from the light reflecting member on both sides of the first main face.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: July 18, 2017
    Assignee: NICHIA CORPORATION
    Inventors: Hiroto Tamaki, Takuya Nakabayashi
  • Patent number: 9711491
    Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: July 18, 2017
    Assignee: NICHIA CORPORATION
    Inventors: Yukitoshi Marutani, Hiroto Tamaki, Tadaaki Miyata
  • Publication number: 20170200868
    Abstract: A light emitting device includes a base body, a light emitting element and a sealing member. The base body includes a base material and a pair of connection terminals on at least a first main surface of the base material. The light emitting element is connected to the connection terminals. The sealing member seals the light emitting element. The sealing member includes a light transmissive member disposed on an upper surface of the light emitting element, and a light shielding member sealing an end surface of the light emitting element and an end surface of the light transmissive member. The base material has a linear expansion coefficient within ±10 ppm/° C. of a linear expansion coefficient of the light emitting element.
    Type: Application
    Filed: March 24, 2017
    Publication date: July 13, 2017
    Inventors: Takuya NAKABAYASHI, Takeshi IKEGAMI, Tadaaki IKEDA, Tadao HAYASHI, Hiroto TAMAKI
  • Patent number: 9705053
    Abstract: A light emitting device includes at least one semiconductor light emitting element, and a wavelength conversion layer which is formed on a surface of the semiconductor light emitting element and which includes a resin layer containing a wavelength conversion member for converting a wavelength of light emitted from the semiconductor light emitting element. The wavelength conversion layer covers an upper surface or the upper surface and a side surface of the semiconductor light emitting element. A content of an inorganic material including the wavelength conversion member, or a content of an inorganic material including the wavelength conversion member and an inorganic filler, in the resin layer is 30% by mass or more and 99% by mass or less.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: July 11, 2017
    Assignee: NICHIA CORPORATION
    Inventors: Takeshi Ikegami, Hiroto Tamaki
  • Patent number: 9680078
    Abstract: A wiring substrate includes ceramic layers and a conductive member. The ceramic layers have an uppermost ceramic layer and a lowermost ceramic layer. The conductive member includes an upper conductive layer disposed on an upper surface of the uppermost ceramic layer, an internal conductive layer interposed between the ceramic layers, and a lower conductive layer disposed on a lower surface of the lowermost ceramic layer. The conductive member defines vias electrically connecting the upper conductive layer, the internal conductive layer, and the lower conductive layer. A total number of a first vias connected to the lower conductive layer is larger than a total number of a second vias connected to the upper conductive layer.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: June 13, 2017
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Nakabayashi, Hiroto Tamaki
  • Patent number: 9666774
    Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: May 30, 2017
    Assignee: NICHIA CORPORATION
    Inventors: Suguru Beppu, Yoichi Bando, Hiroto Tamaki, Takuya Nakabayashi
  • Patent number: 9660151
    Abstract: A method for manufacturing a light emitting device has: forming a first phosphor layer including a first phosphor that is based on KSF or quantum dots on a light emitting element by a method other than spraying, and forming a second phosphor layer including a second phosphor that is different from the first phosphor on the first phosphor layer by spraying.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: May 23, 2017
    Assignee: NICHIA CORPORATION
    Inventor: Hiroto Tamaki
  • Patent number: 9653659
    Abstract: Provided is a light emitting device having a phosphor layer on a surface of a semiconductor light emitting element and reducing unevenness in light distribution color, and a method of manufacturing the same. A light emitting device 100 includes a light emitting element 20 with a supporting body which is composed of a semiconductor light emitting element 1 and a supporting body 10, and a phosphor layer 7 which continuously covers an upper surface and side surfaces of the semiconductor light emitting element 1, and side surfaces of the supporting body 10. The phosphor layer 7 is configured such that at least a lower portion of the side surface of the supporting body 10 is thinner than the upper surface and the side surface of the semiconductor light emitting element 1.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: May 16, 2017
    Assignee: NICHIA CORPORATION
    Inventors: Takeshi Ikegami, Tadao Hayashi, Hiroto Tamaki
  • Publication number: 20170120390
    Abstract: A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.
    Type: Application
    Filed: October 28, 2016
    Publication date: May 4, 2017
    Inventors: Kock Khuen SEET, Masayuki HAYASHIDA, Masakazu SAKAMOTO, Hiroto TAMAKI
  • Patent number: 9640734
    Abstract: Provided is a small and thin light emitting device which has no connection failure, a high life, high performance and good light extraction efficiency. The light emitting device includes a base body comprising a base material having a pair of connection terminals on at least a first main surface, a light emitting element connected to the connection terminals, and a sealing member that seals the light emitting element, wherein the base material has a linear expansion coefficient within ±10 ppm/° C. of the linear expansion coefficient of the light emitting element.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: May 2, 2017
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Nakabayashi, Takeshi Ikegami, Tadaaki Ikeda, Tadao Hayashi, Hiroto Tamaki
  • Publication number: 20170098742
    Abstract: A light emitting device includes at least one semiconductor light emitting element, and a wavelength conversion layer which is formed on a surface of the semiconductor light emitting element and which includes a resin layer containing a wavelength conversion member for converting a wavelength of light emitted from the semiconductor light emitting element. The wavelength conversion layer covers an upper surface or the upper surface and a side surface of the semiconductor light emitting element. A content of an inorganic material including the wavelength conversion member, or a content of an inorganic material including the wavelength conversion member and an inorganic filler, in the resin layer is 30% by mass or more and 99% by mass or less.
    Type: Application
    Filed: December 19, 2016
    Publication date: April 6, 2017
    Inventors: Takeshi IKEGAMI, Hiroto TAMAKI
  • Patent number: 9615493
    Abstract: A method for manufacturing a circuit board constituted by a light emitting device and a mounting board includes the steps of: conveying the light emitting device onto the mounting board in a state in which a top face is chucked by a nozzle so that the nozzle and an exposed part of a first terminal part of the light emitting device are in contact; and placing the light emitting device onto the mounting board so that the first terminal part and a wiring component are in contact in a state in which the top face is chucked by the nozzle.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: April 4, 2017
    Assignee: NICHIA CORPORATION
    Inventors: Ryohei Yamashita, Tomohide Miki, Hiroto Tamaki
  • Publication number: 20170069801
    Abstract: A light emitting device has; a light emitting element, a light reflecting member that is disposed so as to cover the lateral surfaces of the light emitting element and expose a top surface of the light emitting element, a frame that is disposed on the light reflecting member so as to surround an outer periphery of the top surface of the light emitting element, a light transmissive member that is disposed inside the frame, and a sealing member that covers the light reflecting member, the frame and the light transmissive member, and that has a flange covering part of the frame.
    Type: Application
    Filed: September 7, 2016
    Publication date: March 9, 2017
    Inventors: Yuta OKA, Hiroto TAMAKI
  • Publication number: 20170054062
    Abstract: A method of manufacturing a light emitting device includes: providing on a mounting substrate a soluble member which is soluble in a solvent and which has a lower surface, an upper surface opposite to the lower surface in a height direction, and an outer side surface provided between the lower surface and the upper surface, the lower surface contacting the mounting substrate; providing a light blocking member made of resin to cover the outer side surface of the soluble member so that an inner side wall of the light blocking member contacts the outer side surface of the soluble member; removing the soluble member using the solvent to provide a recess surrounded by the inner side wall of the light blocking member; and mounting a light emitting element in the recess.
    Type: Application
    Filed: August 19, 2016
    Publication date: February 23, 2017
    Applicant: NICHIA CORPORATION
    Inventor: Hiroto TAMAKI
  • Publication number: 20170040498
    Abstract: A light emitting device has a base body equipped with a base material and a pair of connection terminals disposed from a first main face to a second main face that is on the opposite side from the first main face; a plurality of light emitting elements connected to the connection terminals on the first main face; and a light reflecting member that covers the side faces of the light emitting elements, the base material having a protruding component on the second main face, the protruding component being one of a heat releasing terminal, a reinforcement terminal, and an insulating film, and the connection terminals being disposed on the first main face from the second main face on both sides of the protruding component, and being partly exposed from the light reflecting member on both sides of the first main face.
    Type: Application
    Filed: October 18, 2016
    Publication date: February 9, 2017
    Inventors: Hiroto TAMAKI, Takuya NAKABAYASHI
  • Publication number: 20170033267
    Abstract: A light emitting device is provided. The light emitting device includes a light emitting element, a wavelength converting member, a light transmissive member, an adhesive member, and a light reflective member. The wavelength converting member has an upper surface and lateral surfaces, contains a fluorescent substance, and is placed on the light emitting element. The light transmissive member covers the upper surface of the wavelength converting member. The adhesive member is interposed between the light emitting element and the wavelength converting member, and covers the lateral surfaces of the wavelength converting member. The light reflective member covers the lateral surfaces of the wavelength converting member via the adhesive member.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 2, 2017
    Applicant: NICHIA CORPORATION
    Inventors: Hiroto TAMAKI, Yoshiki SATO, Yoichi BANDO
  • Patent number: 9548261
    Abstract: A lead frame of high quality which can endure direct bonding to a semiconductor element, and a semiconductor device of high reliability which utilizing the lead frame. A lead frame includes a plurality of connected units, each unit including a pair of lead portions arranged spaced apart and opposite from each other, for mounting a semiconductor element and electrically connecting to a pair of electrodes of the semiconductor element respectively. The lead portions respectively include an element mounting region arranged on a surface thereof to mount the semiconductor element, and a groove extending from opposing end surfaces of each of the pair of lead portions, in a direction away from the end surfaces and bending in a surrounding manner along outer periphery of the element mounting region.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: January 17, 2017
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Nakabayashi, Yoshitaka Bando, Hiroto Tamaki
  • Patent number: 9515027
    Abstract: A printed circuit board includes a printed circuit board, a semiconductor device mounted on the printed circuit board, a capacitor element mounted on the printed circuit board 2, a ground conductor plane to which a ground terminal of the semiconductor device is connected, and first and second power source conductor planes which are arranged so as not to contact with each other. The second power source conductor plane and the ground conductor plane are arranged so as to oppose to each other to form a planar capacitor. The printed circuit board has a first connecting conductor which connects a power source terminal of the semiconductor device with the second power source conductor plane, and a second connecting conductor which connects the first power source conductor plane with the second power source conductor plane through a first terminal of the capacitor element. Thereby, an electromagnetic radiation noise is reduced.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: December 6, 2016
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Hiroto Tamaki