Patents by Inventor Hiroyasu Hara

Hiroyasu Hara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190170179
    Abstract: The nut of the present invention is an encased nut including: a case body 2 which is welded to a body 1; and a nut 3 which is freely movably held inside the case body 2. The nut 3 is composed of a hexagonal nut body 4 and an insulating member 5 made of a resin and insert-molded on the outer surface of this hexagonal nut body 4. The insulating member 5 is provided with a plurality of protrusions 9 on the side, abutting on the body 1, of the outer circumferential part. The nut 3 is insulated, and thus is not affixed by electrodeposition coating.
    Type: Application
    Filed: March 11, 2016
    Publication date: June 6, 2019
    Applicants: AOYAMA SEISAKUSHO CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Mototsugu HARA, Yoshihiro MURASE, Yukinori FUJIMOTO, Hiroyasu ICHIKAWA, Katsuhisa KATOH, Ryuji UTSUNO, Takahiro SEKO
  • Patent number: 8110065
    Abstract: A heat-curable fluoropolyether adhesive composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure, (B) a fluorinated organohydrogensiloxane having at least two SiH groups, (C) a platinum group metal catalyst, (D) an organosiloxane having at least one SiH group and at least one epoxy and/or trialkoxysilyl group, and (E) a compound having at least two allyloxycarbonyl groups can be cured to metal and plastic substrates by heating at a temperature from 20° C. to less than 100° C.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: February 7, 2012
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hidenori Koshikawa, Mikio Shiono, Hiroyasu Hara, Takashi Aketa
  • Patent number: 7825177
    Abstract: An addition cure silicone rubber adhesive composition comprising (A) an organopolysiloxane, (B) an inorganic filler, (C) an alkoxysilane, (D) a hydrolytic catalyst selected from titanium, zirconium and aluminum compounds, (E) an organohydrogenpolysiloxane, (F) a cure regulator, and (G) a platinum compound is prepared by mixing components (A), (B), (C) and (D), in the absence of component (G), at 0-200° C. and a reduced pressure to form a premix, and thereafter, adding component (G) and the remaining components to the premix and mixing at 0-60° C. and a reduced pressure.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: November 2, 2010
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Hiroyasu Hara
  • Patent number: 7704607
    Abstract: A silicone rubber composition containing 0.5-90% by weight of a metal powder and curable into a non-conductive silicone rubber having a volume resistivity of at least 1×109 ?·cm is useful for the sealing and encapsulation of electric and electronic parts because the metal powder is sulfided with a sulfur gas into a metal sulfide powder which prevents or retards the sulfur gas from reaching the electric and electronic parts.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: April 27, 2010
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hiroyasu Hara, Hideki Sugahara, Yoshifumi Inoue
  • Patent number: 7674348
    Abstract: When an air bag is prepared by laying a pair of silicone rubber-impregnated and/or coated base fabric pieces one on the other, with the coated surfaces of the pieces inside, and joining peripheral portions of the pieces together to form a bag, an addition curable silicone rubber composition which is loaded with aluminum hydroxide powder and cures into a silicone rubber having an elongation at break of at least 1000% is used as a sealer and applied to the peripheral portions of the base fabric pieces, thereby achieving improved adhesion therebetween.
    Type: Grant
    Filed: April 22, 2004
    Date of Patent: March 9, 2010
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takashi Aketa, Hiroyasu Hara
  • Patent number: 7671160
    Abstract: Curable perfluoropolyether rubber compositions are provided comprising (A) a linear perfluoropolyether compound containing at least two alkenyl groups and having a perfluoropolyether structure containing recurring units —CaF2aO— in its backbone, (B) an organosilicon compound containing at least two SiH groups, (C) an inorganic powder capable of chemical and/or physical adsorption of acidic gases and/or sulfur-containing gases, and (D) a hydrosilylation catalyst. The compositions cure into rubber or gel products having minimal permeability to acidic gases and sulfur-containing gases.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: March 2, 2010
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kenichi Fukuda, Mikio Shiono, Hiroyasu Hara
  • Publication number: 20100004410
    Abstract: A hydrosilylation inhibitor comprising a reaction product of (1) a titanium compound having an alkoxy group in its ligand, and (2) an organosilicon compound having at least one hydrogen atom bonded to silicon atom per molecule is provided. This hydrosilylation inhibitor exhibits inhibitory activity for catalytic activity of a PGE (platinum group element)-bearing hydrosilylation catalyst in an oxygen atmosphere of up to 100 ppm and/or a moisture atmosphere of up to 100 ppm. By using the present invention, catalytic function of the hydrosilylation catalyst is reliably inhibited in the absence of oxygen and moisture while the same catalytic function is easily provided in the presence of the oxygen or the moisture.
    Type: Application
    Filed: August 17, 2009
    Publication date: January 7, 2010
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shinji Kimura, Hiroyasu Hara, Masayuki Ikeno
  • Patent number: 7635508
    Abstract: When an air bag is prepared by laying a pair of silicone rubber-impregnated and/or coated base fabric pieces one on the other, with the coated surfaces of the pieces inside, and joining peripheral portions of the pieces together to form a bag, an addition reaction curing type silicone rubber composition which cures into a silicone rubber having an elongation at break of at least 1000% is used as a sealer and applied to the peripheral portions of the base fabric pieces, thereby achieving improved adhesion therebetween.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: December 22, 2009
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takashi Aketa, Hiroyasu Hara, Yoshifumi Inoue
  • Publication number: 20090274845
    Abstract: An addition curable silicone adhesive composition that can be cured at room temperature, exhibits favorable adhesiveness, and yields a cured product upon curing that exhibits excellent transparency and a suitable degree of hardness. The addition curable silicone adhesive composition of the present invention comprises: (A) a diorganopolysiloxane containing at least two silicon atom-bonded alkenyl groups, (B) a three dimensional organopolysiloxane resin that comprises trifunctional siloxane units and/or tetrafunctional siloxane units represented by SiO4/2, (C) an organohydrogenpolysiloxane containing at least two silicon atom-bonded hydrogen atoms, (D) a hydrosilylation reaction catalyst, (E) an organosilicon compound as an adhesion-imparting agent, and (F) an acid anhydride that is liquid at room temperature.
    Type: Application
    Filed: July 10, 2009
    Publication date: November 5, 2009
    Applicant: Shin -Etsu Chemical Co., Ltd.
    Inventors: Takashi AKETA, Hiroyasu Hara
  • Patent number: 7501183
    Abstract: A silicone rubber composition containing 0.5-90% by weight of a metal powder and curable into a non-conductive silicone rubber having a volume resistivity of at least 1×109 ?·cm is useful for the sealing and encapsulation of electric and electronic parts because the metal powder is sulfided with a sulfur gas into a metal sulfide powder which prevents or retards the sulfur gas from reaching the electric and electronic parts.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: March 10, 2009
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hiroyasu Hara, Hideki Sugahara, Yoshifumi Inoue
  • Publication number: 20090043029
    Abstract: A silicone rubber composition containing 0.5-90% by weight of a metal powder and curable into a non-conductive silicone rubber having a volume resistivity of at least 1×109 ?·cm is useful for the sealing and encapsulation of electric and electronic parts because the metal powder is sulfided with a sulfur gas into a metal sulfide powder which prevents or retards the sulfur gas from reaching the electric and electronic parts.
    Type: Application
    Filed: October 2, 2008
    Publication date: February 12, 2009
    Inventors: Hiroyasu Hara, Hideki Sugahara, Yoshifumi Inoue
  • Publication number: 20080289760
    Abstract: A heat-curable fluoropolyether adhesive composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure, (B) a fluorinated organohydrogensiloxane having at least two SiH groups, (C) a platinum group metal catalyst, (D) an organosiloxane having at least one SiH group and at least one epoxy and/or trialkoxysilyl group, and (E) a compound having at least two allyloxycarbonyl groups can be cured to metal and plastic substrates by heating at a temperature from 20° C. to less than 100° C.
    Type: Application
    Filed: May 21, 2008
    Publication date: November 27, 2008
    Applicant: Shin-Etsu Chemical Co, Ltd.
    Inventors: Hidenori Koshikawa, Mikio Shiono, Hiroyasu Hara, Takashi Aketa
  • Publication number: 20080287603
    Abstract: Provided is an addition curing silicone composition for CIPG, including: (A) 100 parts by mass of an organopolysiloxane containing at least two alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane, in sufficient quantity to provide from 0.4 to 10.0 mols of hydrogen atoms bonded to silicon atoms within this component (B) for every 1 mol of alkenyl groups bonded to silicon atoms within the entire composition, (C) an effective quantity of a platinum group metal-based catalyst, (D) a curing retarder, and (E) an acid-receiving agent which is inorganic. The composition yields a cured product with particularly superior compression set, and exhibits excellent storage stability, curing stability (curability following storage), and adhesion.
    Type: Application
    Filed: July 25, 2008
    Publication date: November 20, 2008
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventor: Hiroyasu HARA
  • Publication number: 20080227938
    Abstract: A hydrosilylation inhibitor comprising a reaction product of (1) a titanium compound having an alkoxy group in its ligand, and (2) an organosilicon compound having at least one hydrogen atom bonded to silicon atom per molecule is provided. This hydrosilylation inhibitor exhibits inhibitory activity for catalytic activity of a PGE (platinum group element)-bearing hydrosilylation catalyst in an oxygen atmosphere of up to 100 ppm and/or a moisture atmosphere of up to 100 ppm. By using the present invention, catalytic function of the hydrosilylation catalyst is reliably inhibited in the absence of oxygen and moisture while the same catalytic function is easily provided in the presence of the oxygen or the moisture.
    Type: Application
    Filed: March 10, 2008
    Publication date: September 18, 2008
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shinji KIMURA, Hiroyasu Hara, Masayuki Ikeno
  • Publication number: 20080153956
    Abstract: An addition cure silicone rubber adhesive composition comprising (A) an organopolysiloxane, (B) an inorganic filler, (C) an alkoxysilane, (D) a hydrolytic catalyst selected from titanium, zirconium and aluminum compounds, (E) an organohydrogenpolysiloxane, (F) a cure regulator, and (G) a platinum compound is prepared by mixing components (A), (B), (C) and (D), in the absence of component (G), at 0-200° C. and a reduced pressure to form a premix, and thereafter, adding component (G) and the remaining components to the premix and mixing at 0-60° C. and a reduced pressure.
    Type: Application
    Filed: December 21, 2007
    Publication date: June 26, 2008
    Inventor: Hiroyasu Hara
  • Publication number: 20080146709
    Abstract: An addition curable silicone adhesive composition that can be cured at room temperature, exhibits favorable adhesiveness, and yields a cured product upon curing that exhibits excellent transparency and a suitable degree of hardness. The addition curable silicone adhesive composition of the present invention comprises: (A) a diorganopolysiloxane containing at least two silicon atom-bonded alkenyl groups, (B) a three dimensional organopolysiloxane resin that comprises trifunctional siloxane units and/or tetrafunctional siloxane units represented by SiO4/2, (C) an organohydrogenpolysiloxane containing at least two silicon atom-bonded hydrogen atoms, (D) a hydrosilylation reaction catalyst, (E) an organosilicon compound as an adhesion-imparting agent, and (F) an acid anhydride that is liquid at room temperature.
    Type: Application
    Filed: December 14, 2007
    Publication date: June 19, 2008
    Applicant: Shin -Etsu Chemical Co., Ltd.
    Inventors: Takashi AKETA, Hiroyasu Hara
  • Publication number: 20070112149
    Abstract: Provided is an addition curing silicone composition for CIPQ including: (A) 100 parts by mass of an organopolysiloxane containing at least two alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane, in sufficient quantity to provide from 0.4 to 10.0 mols of hydrogen atoms bonded to silicon atoms within this component (B) for every 1 mol of alkenyl groups bonded to silicon atoms within the entire composition, (C) an effective quantity of a platinum group metal-based catalyst, (D) a curing retarder, and (E) an acid-receiving agent which is inorganic. The composition yields a cured product with particularly superior compression set, and exhibits excellent storage stability, curing stability (curability following storage), and adhesion.
    Type: Application
    Filed: November 16, 2006
    Publication date: May 17, 2007
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventor: Hiroyasu HARA
  • Patent number: 7150803
    Abstract: When an air bag is prepared by laying a pair of silicone rubber-impregnated and/or coated base fabric pieces one on the other, with the coated surfaces of the pieces inside, and joining peripheral portions of the pieces together to form a bag, an addition reaction curing type silicone rubber composition which cures into a silicone rubber having an elongation at break of at least 1000% is used as a sealer and applied to the peripheral portions of the base fabric pieces, thereby achieving improved adhesion therebetween.
    Type: Grant
    Filed: February 26, 2003
    Date of Patent: December 19, 2006
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takashi Aketa, Hiroyasu Hara, Yoshifumi Inoue
  • Publication number: 20060276600
    Abstract: In an addition type silicone adhesive composition comprising (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups, (B) an organohydrogen-polysiloxane having at least two SiH groups, and (C) a hydrosilylation catalyst, the incorporation of (D) a (meth)acryloxyalkyl-modified linear or cyclic organopolysiloxane having a viscosity of 5-10,000 mPa-s at 25° C., and (E) a zirconium compound allows bond strength to develop even by brief heating and minimizes discoloration after a long-term heat test.
    Type: Application
    Filed: June 2, 2006
    Publication date: December 7, 2006
    Inventors: Takashi Aketa, Yoshifumi Harada, Hiroyasu Hara
  • Patent number: RE40519
    Abstract: A conductive fluoro-resin composition of the addition reaction curing type is provided comprising (A) a reactive fluorinated polyether compound comprising fluorinated polyether units and having at least two aliphatic unsaturated hydrocarbon radicals in a molecule, (B) a compound having at least two hydrogen atoms each directly attached to a silicon atom, (C) a platinum group metal catalyst, and (D) silver particles. The composition cures into rubbery parts having improved heat resistance, weather resistance and solvent resistance and optionally forming firm bonds to various substrates.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: September 23, 2008
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hironao Fujiki, Hiroyasu Hara, Kenichi Fukuda