Patents by Inventor Hiroyasu Matsugai

Hiroyasu Matsugai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10866345
    Abstract: To prevent the resin from oozing out during the lens molding due to the capillary action. A laminated lens structure according to the present disclosure includes: a plurality of lens structures including a substrate provided with an opening part, a lens inserted into the opening part to be fixed to the substrate, and a recessed part provided at an area in which a lateral face of the opening part and a surface of the substrate are intersected, and recessed more than the surface of the substrate. The lenses are arrayed in an optical axis direction by the substrates being joined. This configuration makes it possible to prevent the resin from oozing out during the lens molding due to the capillary action.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: December 15, 2020
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Atsushi Yamamoto, Hiroyasu Matsugai, Kensaku Maeda, Tomoharu Ogita
  • Patent number: 10854667
    Abstract: There is provided solid-state imaging devices and methods of forming the same, the solid-state imaging devices including: a semiconductor substrate; a glass substrate; an adhesion layer provided between the semiconductor substrate and the glass substrate; and a warpage correction film provided adjacent to one of the semiconductor substrate and the glass substrate.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: December 1, 2020
    Assignee: Sony Corporation
    Inventor: Hiroyasu Matsugai
  • Publication number: 20200365639
    Abstract: A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.
    Type: Application
    Filed: July 31, 2020
    Publication date: November 19, 2020
    Applicant: Sony Corporation
    Inventors: Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Masanori IWASAKI, Toshihiko HAYASHI, Shuzo SATO, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Minoru ISHIDA
  • Patent number: 10818717
    Abstract: A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: October 27, 2020
    Assignee: Sony Corporation
    Inventors: Hiroyasu Matsugai, Hiroyuki Itou, Suguru Saito, Keiji Ohshima, Masanori Iwasaki, Toshihiko Hayashi, Shuzo Sato, Nobutoshi Fujii, Hiroshi Tazawa, Toshiaki Shiraiwa, Minoru Ishida
  • Publication number: 20200328248
    Abstract: The present disclosure relates to a camera package, a manufacturing method of a camera package, and an electronic device capable of reducing a manufacturing cost for forming a lens. The manufacturing method of the camera package according to the present disclosure includes forming a high-contact angle film around a lens forming region on an upper side of a transparent substrate that protects a solid-state imaging element, dropping a lens material in the lens forming region on the upper side of the transparent substrate, and molding the dropped lens material by a mold to form a lens. The present disclosure is applicable to, for example, a camera package and the like in which a lens is arranged above a solid-state imaging element.
    Type: Application
    Filed: December 21, 2018
    Publication date: October 15, 2020
    Inventor: HIROYASU MATSUGAI
  • Patent number: 10712543
    Abstract: A positional shift of a lens of a stacked lens structure is reduced. A plurality of through-holes is formed at a position shifted from a first target position on a substrate according to a first shift. A lens is formed on an inner side of each of the through-holes using a first mold in which a plurality of first transfer surfaces is disposed at a position shifted from a predetermined second target position according to a second shift and a second mold in which a plurality of second transfer surfaces is disposed at a position shifted from a predetermined third target position according to a third shift. The plurality of substrates having the lenses formed therein is formed according to direct bonding, and the plurality of stacked substrates is divided. The present technique can be applied to a stacked lens structure or the like, for example.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: July 14, 2020
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Kunihiko Hikichi, Koichi Takeuchi, Toshihiro Kurobe, Hiroyasu Matsugai, Hiroyuki Itou, Suguru Saito, Keiji Ohshima, Nobutoshi Fujii, Hiroshi Tazawa, Toshiaki Shiraiwa, Minoru Ishida
  • Patent number: 10690814
    Abstract: Influence of chipping in case of dicing a plurality of stacked substrates is reduced. Provided is a semiconductor device where a substrate, in which a groove surrounding a pattern configured with a predetermined circuit or part is formed, is stacked. The present technology can be applied to, for example, a stacked lens structure where through-holes are formed in each substrate and lenses are disposed in inner sides of the through-holes, a camera module where a stacked lens structure and a light-receiving device are incorporated, a solid-state imaging device where a pixel substrate and a control substrate are stacked, and the like.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: June 23, 2020
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Toshiaki Shiraiwa, Masaki Okamoto, Hiroyasu Matsugai, Hiroyuki Itou, Suguru Saito, Keiji Ohshima, Nobutoshi Fujii, Hiroshi Tazawa, Minoru Ishida
  • Patent number: 10627549
    Abstract: Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked based on an alignment mark. The alignment mark is formed simultaneously with the through-hole. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: April 21, 2020
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Atsushi Yamamoto, Koichi Takeuchi, Toshihiro Kurobe, Hiroyasu Matsugai, Hiroyuki Itou, Suguru Saito, Keiji Ohshima, Nobutoshi Fujii, Hiroshi Tazawa, Toshiaki Shiraiwa, Minoru Ishida
  • Publication number: 20200049959
    Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
    Type: Application
    Filed: July 10, 2019
    Publication date: February 13, 2020
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yusuke MORIYA, Masanori IWASAKI, Takashi OINOUE, Yoshiya HAGIMOTO, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Minoru ISHIDA
  • Patent number: 10534162
    Abstract: Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked. In particular, one or more air grooves formed in surfaces of the substrates reduces an influence of air inside a void portion between adjacent lenses of a layered lens structure.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: January 14, 2020
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Hirotaka Yoshioka, Hiroyasu Matsugai, Hiroyuki Itou, Suguru Saito, Keiji Ohshima, Nobutoshi Fujii, Hiroshi Tazawa, Toshiaki Shiraiwa, Minoru Ishida
  • Publication number: 20200006415
    Abstract: A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.
    Type: Application
    Filed: September 9, 2019
    Publication date: January 2, 2020
    Applicant: Sony Corporation
    Inventors: Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Masanori IWASAKI, Toshihiko HAYASHI, Shuzo SATO, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Minoru ISHIDA
  • Publication number: 20190369355
    Abstract: There is provided a camera module including a stacked lens structure including a plurality of lens substrates. The plurality of lens substrates includes a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate. The camera module further includes an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element.
    Type: Application
    Filed: January 16, 2018
    Publication date: December 5, 2019
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Munekatsu FUKUYAMA, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Masanori IWASAKI, Toshihiko HAYASHI, Shuzo SATO, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Yusuke MORIYA, Minoru ISHIDA
  • Publication number: 20190355780
    Abstract: There is provided solid-state imaging devices and methods of forming the same, the solid-state imaging devices including: a semiconductor substrate; a glass substrate; an adhesion layer provided between the semiconductor substrate and the glass substrate; and a warpage correction film provided adjacent to one of the semiconductor substrate and the glass substrate.
    Type: Application
    Filed: June 3, 2019
    Publication date: November 21, 2019
    Applicant: Sony Corporation
    Inventor: Hiroyasu MATSUGAI
  • Patent number: 10431618
    Abstract: A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: October 1, 2019
    Assignee: Sony Corporation
    Inventors: Hiroyasu Matsugai, Hiroyuki Itou, Suguru Saito, Keiji Ohshima, Masanori Iwasaki, Toshihiko Hayashi, Shuzo Sato, Nobutoshi Fujii, Hiroshi Tazawa, Toshiaki Shiraiwa, Minoru Ishida
  • Patent number: 10379323
    Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: August 13, 2019
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Yusuke Moriya, Masanori Iwasaki, Takashi Oinoue, Yoshiya Hagimoto, Hiroyasu Matsugai, Hiroyuki Itou, Suguru Saito, Keiji Ohshima, Nobutoshi Fujii, Hiroshi Tazawa, Toshiaki Shiraiwa, Minoru Ishida
  • Patent number: 10355042
    Abstract: There is provided solid-state imaging devices and methods of forming the same, the solid-state imaging devices including: a semiconductor substrate; a glass substrate; an adhesion layer provided between the semiconductor substrate and the glass substrate; and a warpage correction film provided adjacent to one of the semiconductor substrate and the glass substrate.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: July 16, 2019
    Assignee: Sony Corporation
    Inventor: Hiroyasu Matsugai
  • Publication number: 20190162880
    Abstract: To prevent the resin from oozing out during the lens molding due to the capillary action. A laminated lens structure according to the present disclosure includes: a plurality of lens structures including a substrate provided with an opening part, a lens inserted into the opening part to be fixed to the substrate, and a recessed part provided at an area in which a lateral face of the opening part and a surface of the substrate are intersected, and recessed more than the surface of the substrate. The lenses are arrayed in an optical axis direction by the substrates being joined. This configuration makes it possible to prevent the resin from oozing out during the lens molding due to the capillary action.
    Type: Application
    Filed: June 27, 2017
    Publication date: May 30, 2019
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Atsushi YAMAMOTO, Hiroyasu MATSUGAI, Kensaku MAEDA, Tomoharu OGITA
  • Publication number: 20190004293
    Abstract: A positional shift of a lens of a stacked lens structure is reduced. A plurality of through-holes is formed at a position shifted from a first target position on a substrate according to a first shift. A lens is formed on an inner side of each of the through-holes using a first mold in which a plurality of first transfer surfaces is disposed at a position shifted from a predetermined second target position according to a second shift and a second mold in which a plurality of second transfer surfaces is disposed at a position shifted from a predetermined third target position according to a third shift. The plurality of substrates having the lenses formed therein is formed according to direct bonding, and the plurality of stacked substrates is divided. The present technique can be applied to a stacked lens structure or the like, for example.
    Type: Application
    Filed: July 15, 2016
    Publication date: January 3, 2019
    Inventors: Kunihiko HIKICHI, Koichi TAKEUCHI, Toshihiro KUROBE, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Minoru ISHIDA
  • Publication number: 20180259749
    Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
    Type: Application
    Filed: July 15, 2016
    Publication date: September 13, 2018
    Applicant: Sony Semiconductor Solutions Corporation
    Inventors: Yusuke MORIYA, Masanori IWASAKI, Takashi OINOUE, Yoshiya HAGIMOTO, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Minoru ISHIDA
  • Publication number: 20180246258
    Abstract: Influence of chipping in case of dicing a plurality of stacked substrates is reduced. Provided is a semiconductor device where a substrate, in which a groove surrounding a pattern configured with a predetermined circuit or part is formed, is stacked. The present technology can be applied to, for example, a stacked lens structure where through-holes are formed in each substrate and lenses are disposed in inner sides of the through-holes, a camera module where a stacked lens structure and a light-receiving device are incorporated, a solid-state imaging device where a pixel substrate and a control substrate are stacked, and the like.
    Type: Application
    Filed: July 19, 2016
    Publication date: August 30, 2018
    Inventors: Toshiaki SHIRAIWA, Masaki OKAMOTO, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Nobutoshi FUJII, Hiroshi TAZAWA, Minoru ISHIDA