Abstract: It is configured to output a first I signal having passed through a first inverse characteristic circuit having inverse frequency characteristics to frequency characteristics of a first loop filter circuit, to the first loop filter circuit, and output a first Q signal having passed through a second inverse characteristic circuit having inverse frequency characteristics to frequency characteristics of a second loop filter circuit, to the second loop filter circuit.

Abstract: It is configured to output a first I signal having passed through a first inverse characteristic circuit having inverse frequency characteristics to frequency characteristics of a first loop filter circuit, to the first loop filter circuit, and output a first Q signal having passed through a second inverse characteristic circuit having inverse frequency characteristics to frequency characteristics of a second loop filter circuit, to the second loop filter circuit.

Abstract: A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material. The thickness of the oxide film on a surface to the molten solder plate layer is suppressed to be not more than 7 nm.

Abstract: A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material formed rectangular in a cross section thereof so as to be bonded by soldering to an electrode of a solar cell, using a flux. A thickness of an oxide film on a surface of the molten solder plated layer, which is a sum of a thickness of an SnO layer and a thickness of an SnO2 layer on the surface of the molten solder plated layer, is not more than 7 nm.

Abstract: A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.

Abstract: A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.

Abstract: Disclosed is a lead wire for a solar cell having excellent bondability with a solar cell. The solar cell lead wire (10) has a band plate-shaped electroconductive material (12) that is formed with straight-angled cross-sectional shape and is covered by a molten solder plating layer (13), with the thickness of the oxide film on the surface of the molten solder plating layer (13) being 7 nm or less.

Abstract: A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.

Abstract: A solar cell lead wire includes a conducting material, and a molten solder plated layer formed on the conducting material. The conducting material includes a concave-convex conducting material that includes a concavity on top and under surfaces thereof, respectively, and a convexity on a side surface thereof, and that is formed by die processing a strip-shaped conducting material, and the molten solder plated layer comprises a flat surface formed by supplying a molten solder to the concavity of the concave-convex conducting material.

Abstract: A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.

Abstract: A metallic material is rolled to provide a conductor 3 having a rectangular cross section. A surface of the rectangular conductor 3 is plated with a plating layer 14. A thickness of the plating layer 14 at a surface facing to the Si cell is not more than 5 ?m to provide a connecting lead wire 12 for a solar battery. The connecting lead wire 12 for a solar battery has 0.2% proof stress of not more than 60 MPa. The connecting lead wire 12 for a solar battery is connected to a predetermined contact region of a Si cell 1 of a solar battery at a high temperature.

Abstract: A metallic material is rolled to provide a conductor 3 having a rectangular cross section. A surface of the rectangular conductor 3 is plated with a plating layer 14. A thickness of the plating layer 14 at a surface facing to the Si cell is not more than 5 ?m to provide a connecting lead wire 12 for a solar battery. The connecting lead wire 12 for a solar battery has 0.2% proof stress of not more than 60 MPa. The connecting lead wire 12 for a solar battery is connected to a predetermined contact region of a Si cell 1 of a solar battery at a high temperature.