Patents by Inventor Hiroyuki Higashi
Hiroyuki Higashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958385Abstract: A seat includes a seat body and a sensor configured to acquired information on an occupant seated on the seat body. The seat includes a coating as a location marker that marks a location of the sensor to render the location visually recognizable from outside the seat body.Type: GrantFiled: March 29, 2019Date of Patent: April 16, 2024Assignee: TS TECH CO., LTD.Inventors: Hiroyuki Kaku, Ryuichiro Hirose, Hiroyuki Numajiri, Satoshi Fujita, Takako Miyoshi, Munetaka Kowa, Atsushi Kusano, Yoshikazu Ito, Yousuke Higashi, Satoshi Suzuki, Ryosuke Sato, Kento Uetake, Yasuharu Otsuka, Satoru Kaneda
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Patent number: 11953807Abstract: A detection device includes a photographing unit, a first holding portion holding the photographing unit, a magnet having an attracting face facing a flow space in which fluid flows and opposed to the photographing unit via the flow space, a second holding portion holding the magnet, and a connection portion connected to the second holding portion and having an opening portion.Type: GrantFiled: February 26, 2020Date of Patent: April 9, 2024Assignee: Komatsu Ltd.Inventors: Hiroyuki Chikugo, Shuuji Hori, Haruna Higashi
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Patent number: 11932147Abstract: Disclosed is a seat including: sensors which includes a first cushion sensor provided at a seat cushion in a position corresponding to buttocks of an occupant, a second cushion sensor provided at the seat cushion and located farther frontward than the first cushion sensor, a first back sensor provided at a seat back and located in a lower position thereof, and a second back sensor provided at the seat back and located above the first back sensor; and a controller connected to the sensors and thereby allowed to acquire pressure values from the respective sensors. The controller is configured to identify the motion of the occupant based on outputs of at least two sensors of the first cushion sensor, the second cushion sensor, the first back sensor, and the second back sensor.Type: GrantFiled: February 28, 2019Date of Patent: March 19, 2024Assignee: TS TECH CO., LTD.Inventors: Hiroyuki Kaku, Atsushi Kusano, Hiroyuki Numajiri, Satoshi Fujita, Takako Miyoshi, Munetaka Kowa, Ryuichiro Hirose, Yoshikazu Ito, Yosuke Higashi, Satoshi Suzuki, Ryosuke Sato, Kento Uetake, Yasuharu Otsuka, Satoru Kaneda
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Publication number: 20240021445Abstract: A substrate processing apparatus according to the present disclosure includes a substrate holding unit, a fluid supplying unit, a processing-liquid supplying unit, a nozzle, a fluid amount adjusting unit, and a controller. The substrate holding unit holds a substrate to be rotatable. The fluid supplying unit supplies fluid including pressurized vapor or mist of deionized water. The processing-liquid supplying unit supplies processing liquid including at least a sulfuric acid. The nozzle is connected to the fluid supplying unit and the processing-liquid supplying unit to discharge mixed fluid of the fluid and the processing liquid toward the substrate. The fluid amount adjusting unit adjusts a flow volume of the fluid that is flowing through the fluid supplying unit. The controller controls the fluid amount adjusting unit to adjust a ratio of the fluid to the processing liquid.Type: ApplicationFiled: June 28, 2023Publication date: January 18, 2024Applicant: Tokyo Electron LimitedInventors: Hiroki SAKURAI, Yenrui HSU, Shoki MIZUGUCHI, Nobuhiro OGATA, Shinichi UMENO, Kazuya GODA, Minsung KIM, Hiroyuki HIGASHI
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Patent number: 11389901Abstract: A pair of separators is overlapped and placed on a base jig and thereby positioned with each other. Respective through-holes thereof are positioned to the position of a pin hole provided in the base jig. When a main jig is pressed against the base jig to clamp the pair of separators, and a pin of a sub-jig is inserted into the pin hole to clamp the pair of separators by a head, an annular light guiding path is formed by a gap generated between an opening provided in the main jig and the head of the sub-jig, and hence a laser welding position which surrounds the through-holes is exposed. The surrounding of each through-hole is seamlessly laser-welded when the laser welding position is irradiated with a laser beam.Type: GrantFiled: July 12, 2018Date of Patent: July 19, 2022Inventors: Toshihiro Shimazoe, Kento Nagamatsu, Hiroyuki Higashi
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Patent number: 10937669Abstract: A substrate solution-treatment apparatus includes: a substrate holding part for holding a substrate; a nozzle for supplying a treatment solution onto the substrate; a supply line; a flow rate control mechanism including a flow rate meter and a flow rate control valve installed in the supply line; an opening/closing valve installed in the supply line; and a control part for controlling operations of the flow rate control mechanism and the opening/closing valve. The flow rate control mechanism controls the flow rate control valve such that a detection value of the flow rate meter coincides with a flow rate target value provided from the control part. The control part controls the nozzle to supply the treatment solution onto the substrate with the opening/closing valve opened, and provides a first flow rate as the flow rate target value to the flow rate control mechanism.Type: GrantFiled: May 25, 2018Date of Patent: March 2, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Kosuke Fukuda, Mikio Nakashima, Kazuyoshi Shinohara, Hiroyuki Higashi
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Patent number: 10685858Abstract: The substrate processing method according to an exemplary embodiment includes a low temperature dissolving processing and an etching processing. The low temperature dissolving processing dissolves oxygen in an alkaline aqueous solution cooled to a predetermined temperature lower than the room temperature. The etching processing etches a substrate by supplying the alkaline aqueous solution in which oxygen is dissolved to the substrate.Type: GrantFiled: June 27, 2018Date of Patent: June 16, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Hiroyuki Higashi, Takahisa Otsuka, Kazuyoshi Shinohara, Takashi Nakazawa, Seiya Fujimoto, Yuichi Douki
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Publication number: 20200139486Abstract: A pair of separators is overlapped and placed on a base jig and thereby positioned with each other. Respective through-holes thereof are positioned to the position of a pin hole provided in the base jig. When a main jig is pressed against the base jig to clamp the pair of separators, and a pin of a sub-jig is inserted into the pin hole to clamp the pair of separators by a head, an annular light guiding path is formed by a gap generated between an opening provided in the main jig and the head of the sub-jig, and hence a laser welding position which surrounds the through-holes is exposed. The surrounding of each through-hole is seamlessly laser-welded when the laser welding position is irradiated with a laser beam.Type: ApplicationFiled: July 12, 2018Publication date: May 7, 2020Inventors: Toshihiro SHIMAZOE, Kento NAGAMATSU, Hiroyuki HIGASHI
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Publication number: 20190006206Abstract: The substrate processing method according to an exemplary embodiment includes a low temperature dissolving processing and an etching processing. The low temperature dissolving processing dissolves oxygen in an alkaline aqueous solution cooled to a predetermined temperature lower than the room temperature. The etching processing etches a substrate by supplying the alkaline aqueous solution in which oxygen is dissolved to the substrate.Type: ApplicationFiled: June 27, 2018Publication date: January 3, 2019Inventors: Hiroyuki Higashi, Takahisa Otsuka, Kazuyoshi Shinohara, Takashi Nakazawa, Seiya Fujimoto, Yuichi Douki
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Publication number: 20180350636Abstract: A substrate solution-treatment apparatus includes: a substrate holding part for holding a substrate; a nozzle for supplying a treatment solution onto the substrate; a supply line; a flow rate control mechanism including a flow rate meter and a flow rate control valve installed in the supply line; an opening/closing valve installed in the supply line; and a control part for controlling operations of the flow rate control mechanism and the opening/closing valve. The flow rate control mechanism controls the flow rate control valve such that a detection value of the flow rate meter coincides with a flow rate target value provided from the control part. The control part controls the nozzle to supply the treatment solution onto the substrate with the opening/closing valve opened, and provides a first flow rate as the flow rate target value to the flow rate control mechanism.Type: ApplicationFiled: May 25, 2018Publication date: December 6, 2018Inventors: Kosuke FUKUDA, Mikio NAKASHIMA, Kazuyoshi SHINOHARA, Hiroyuki HIGASHI
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Patent number: 9865483Abstract: Disclosed is a substrate liquid processing method. The method includes: supplying a first processing liquid to a central portion of a substrate at a first flow rate by a first nozzle while rotating the substrate using a substrate holding unit; supplying a second processing liquid to a location between the central portion and an outer circumferential end of the substrate by a second nozzle while supplying the first processing liquid to the central portion of the substrate at the first flow rate; and changing the flow rate of the first processing liquid supplied from the first nozzle to a second flow rate lower than the first flow rate, so as to continue forming of the liquid film on the overall surface of the substrate while supplying the second processing liquid by the second nozzle to the substrate that is formed with a liquid film on the overall surface thereof.Type: GrantFiled: September 11, 2015Date of Patent: January 9, 2018Assignee: Tokyo Electron LimitedInventors: Hiroyuki Higashi, Gentaro Goshi, Takahisa Otsuka
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Publication number: 20160093517Abstract: Disclosed is a substrate liquid processing method. The method includes: supplying a first processing liquid to a central portion of a substrate at a first flow rate by a first nozzle while rotating the substrate using a substrate holding unit; supplying a second processing liquid to a location between the central portion and an outer circumferential end of the substrate by a second nozzle while supplying the first processing liquid to the central portion of the substrate at the first flow rate; and changing the flow rate of the first processing liquid supplied from the first nozzle to a second flow rate lower than the first flow rate, so as to continue forming of the liquid film on the overall surface of the substrate while supplying the second processing liquid by the second nozzle to the substrate that is formed with a liquid film on the overall surface thereof.Type: ApplicationFiled: September 11, 2015Publication date: March 31, 2016Inventors: Hiroyuki Higashi, Gentaro Goshi, Takahisa Otsuka
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Patent number: 9216460Abstract: A coolant-hole equipped drill includes a drill main body, a cutting edge portion which has a tip flank, a chip discharging groove provided with a front groove wall surface and a rear groove wall surface, a cutting edge formed at a ridge line portion where the front groove wall surface and the tip flank intersect with each other, a land portion formed between the chip discharging grooves adjacent to each other in the rotating direction, and a coolant hole drilled at the land portion and opened at the tip flank. The coolant hole includes a front hole wall surface, a rear hole wall surface, and an outer-circumference hole wall surface.Type: GrantFiled: June 15, 2010Date of Patent: December 22, 2015Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Nobuyuki Matsuda, Hiroyuki Higashi, Koichiro Naruke, Tadashi Yamamoto, Kazuya Yanagida
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Publication number: 20120082524Abstract: A coolant-hole equipped drill includes a drill main body, a cutting edge portion which has a tip flank, a chip discharging groove provided with a front groove wall surface and a rear groove wall surface, a cutting edge formed at a ridge line portion where the front groove wall surface and the tip flank intersect with each other, a land portion formed between the chip discharging grooves adjacent to each other in the rotating direction, and a coolant hole drilled at the land portion and opened at the tip flank. The coolant hole includes a front hole wall surface, a rear hole wall surface, and an outer-circumference hole wall surface.Type: ApplicationFiled: June 15, 2010Publication date: April 5, 2012Applicant: Mitsubishi Materials CorporationInventors: Nobuyuki Matsuda, Hiroyuki Higashi, Koichiro Naruke, Tadashi Yamamoto, Kazuya Yanagida
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Patent number: 7762748Abstract: A plurality of cutting oil feed holes extend from the proximal side towards the distal side are provided in a drill body located on a reference line that extends towards a circumferential central portion of an outer circumferential surface of the drill body split by a chip discharge groove from an axis in a cross section orthogonal to the axis. A cutting oil feed hole that is located on the radial outermost side is used as a first cutting oil feed hole, and a cutting oil feed hole that is on the radial innermost side is used as a second cutting oil feed hole. Two or more openings of the cutting oil feed holes are provided in one cutting edge as the plurality of cutting oil feed holes are formed in the vicinity of the intersection ridgeline portion between the distal flank face and the second thinned face.Type: GrantFiled: December 3, 2007Date of Patent: July 27, 2010Assignee: Mitsubishi Materials CorporationInventors: Kazuya Yanagida, Masayuki Mabuchi, Hiroyuki Higashi
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Publication number: 20080131221Abstract: A plurality of cutting oil feed holes extend from the proximal side towards the distal side are provided in a drill body located on a reference line that extends towards a circumferential central portion of an outer circumferential surface of the drill body split by a chip discharge groove from an axis in a cross section orthogonal to the axis. A cutting oil feed hole that is located on the radial outermost side is used as a first cutting oil feed hole, and a cutting oil feed hole that is on the radial innermost side is used as a second cutting oil feed hole. Two or more openings of the cutting oil feed holes are provided in one cutting edge as the plurality of cutting oil feed holes are formed in the vicinity of the intersection ridgeline portion between the distal flank face and the second thinned face.Type: ApplicationFiled: December 3, 2007Publication date: June 5, 2008Applicant: Mitsubishi Materials CorporationInventors: Kazuya Yanagida, Masayuki Mabuchi, Hiroyuki Higashi
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Publication number: 20050114882Abstract: The information providing system receives contents and a contents code corresponding to the contents by utilizing the broadcasting waves transmitted from a broadcasting station or the Internet, for example, and stores them. The contents may be information of newspaper article or else, and the contents code may be a code uniquely assigned to the contents. On the other hand, a paper-type display medium on which a similar contents code is recorded in advance is provided to a user by selling it or free distribution. When the user sets the paper-type display medium on the broadcasting receiver in a household, the code reading unit reads the contents code recorded on the paper-type display medium. Then, the receiver obtains the contents corresponding to the read contents code and displays it on the paper-type display medium.Type: ApplicationFiled: March 7, 2003Publication date: May 26, 2005Inventors: Teruo Sakamaki, Hiroyuki Higashi, Yuji Ogura
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Patent number: D602054Type: GrantFiled: May 11, 2009Date of Patent: October 13, 2009Assignee: Mitsubishi Materials CorporationInventors: Kazuya Yanagida, Hiroyuki Higashi, Nobuyuki Matsuda
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Patent number: D602055Type: GrantFiled: May 11, 2009Date of Patent: October 13, 2009Assignee: Mitsubishi Materials CorporationInventors: Kazuya Yanagida, Hiroyuki Higashi, Nobuyuki Matsuda