Patents by Inventor Hiroyuki Higashi

Hiroyuki Higashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11958385
    Abstract: A seat includes a seat body and a sensor configured to acquired information on an occupant seated on the seat body. The seat includes a coating as a location marker that marks a location of the sensor to render the location visually recognizable from outside the seat body.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: April 16, 2024
    Assignee: TS TECH CO., LTD.
    Inventors: Hiroyuki Kaku, Ryuichiro Hirose, Hiroyuki Numajiri, Satoshi Fujita, Takako Miyoshi, Munetaka Kowa, Atsushi Kusano, Yoshikazu Ito, Yousuke Higashi, Satoshi Suzuki, Ryosuke Sato, Kento Uetake, Yasuharu Otsuka, Satoru Kaneda
  • Patent number: 11953807
    Abstract: A detection device includes a photographing unit, a first holding portion holding the photographing unit, a magnet having an attracting face facing a flow space in which fluid flows and opposed to the photographing unit via the flow space, a second holding portion holding the magnet, and a connection portion connected to the second holding portion and having an opening portion.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: April 9, 2024
    Assignee: Komatsu Ltd.
    Inventors: Hiroyuki Chikugo, Shuuji Hori, Haruna Higashi
  • Patent number: 11932147
    Abstract: Disclosed is a seat including: sensors which includes a first cushion sensor provided at a seat cushion in a position corresponding to buttocks of an occupant, a second cushion sensor provided at the seat cushion and located farther frontward than the first cushion sensor, a first back sensor provided at a seat back and located in a lower position thereof, and a second back sensor provided at the seat back and located above the first back sensor; and a controller connected to the sensors and thereby allowed to acquire pressure values from the respective sensors. The controller is configured to identify the motion of the occupant based on outputs of at least two sensors of the first cushion sensor, the second cushion sensor, the first back sensor, and the second back sensor.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: March 19, 2024
    Assignee: TS TECH CO., LTD.
    Inventors: Hiroyuki Kaku, Atsushi Kusano, Hiroyuki Numajiri, Satoshi Fujita, Takako Miyoshi, Munetaka Kowa, Ryuichiro Hirose, Yoshikazu Ito, Yosuke Higashi, Satoshi Suzuki, Ryosuke Sato, Kento Uetake, Yasuharu Otsuka, Satoru Kaneda
  • Publication number: 20240021445
    Abstract: A substrate processing apparatus according to the present disclosure includes a substrate holding unit, a fluid supplying unit, a processing-liquid supplying unit, a nozzle, a fluid amount adjusting unit, and a controller. The substrate holding unit holds a substrate to be rotatable. The fluid supplying unit supplies fluid including pressurized vapor or mist of deionized water. The processing-liquid supplying unit supplies processing liquid including at least a sulfuric acid. The nozzle is connected to the fluid supplying unit and the processing-liquid supplying unit to discharge mixed fluid of the fluid and the processing liquid toward the substrate. The fluid amount adjusting unit adjusts a flow volume of the fluid that is flowing through the fluid supplying unit. The controller controls the fluid amount adjusting unit to adjust a ratio of the fluid to the processing liquid.
    Type: Application
    Filed: June 28, 2023
    Publication date: January 18, 2024
    Applicant: Tokyo Electron Limited
    Inventors: Hiroki SAKURAI, Yenrui HSU, Shoki MIZUGUCHI, Nobuhiro OGATA, Shinichi UMENO, Kazuya GODA, Minsung KIM, Hiroyuki HIGASHI
  • Patent number: 11389901
    Abstract: A pair of separators is overlapped and placed on a base jig and thereby positioned with each other. Respective through-holes thereof are positioned to the position of a pin hole provided in the base jig. When a main jig is pressed against the base jig to clamp the pair of separators, and a pin of a sub-jig is inserted into the pin hole to clamp the pair of separators by a head, an annular light guiding path is formed by a gap generated between an opening provided in the main jig and the head of the sub-jig, and hence a laser welding position which surrounds the through-holes is exposed. The surrounding of each through-hole is seamlessly laser-welded when the laser welding position is irradiated with a laser beam.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: July 19, 2022
    Inventors: Toshihiro Shimazoe, Kento Nagamatsu, Hiroyuki Higashi
  • Patent number: 10937669
    Abstract: A substrate solution-treatment apparatus includes: a substrate holding part for holding a substrate; a nozzle for supplying a treatment solution onto the substrate; a supply line; a flow rate control mechanism including a flow rate meter and a flow rate control valve installed in the supply line; an opening/closing valve installed in the supply line; and a control part for controlling operations of the flow rate control mechanism and the opening/closing valve. The flow rate control mechanism controls the flow rate control valve such that a detection value of the flow rate meter coincides with a flow rate target value provided from the control part. The control part controls the nozzle to supply the treatment solution onto the substrate with the opening/closing valve opened, and provides a first flow rate as the flow rate target value to the flow rate control mechanism.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: March 2, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kosuke Fukuda, Mikio Nakashima, Kazuyoshi Shinohara, Hiroyuki Higashi
  • Patent number: 10685858
    Abstract: The substrate processing method according to an exemplary embodiment includes a low temperature dissolving processing and an etching processing. The low temperature dissolving processing dissolves oxygen in an alkaline aqueous solution cooled to a predetermined temperature lower than the room temperature. The etching processing etches a substrate by supplying the alkaline aqueous solution in which oxygen is dissolved to the substrate.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: June 16, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Hiroyuki Higashi, Takahisa Otsuka, Kazuyoshi Shinohara, Takashi Nakazawa, Seiya Fujimoto, Yuichi Douki
  • Publication number: 20200139486
    Abstract: A pair of separators is overlapped and placed on a base jig and thereby positioned with each other. Respective through-holes thereof are positioned to the position of a pin hole provided in the base jig. When a main jig is pressed against the base jig to clamp the pair of separators, and a pin of a sub-jig is inserted into the pin hole to clamp the pair of separators by a head, an annular light guiding path is formed by a gap generated between an opening provided in the main jig and the head of the sub-jig, and hence a laser welding position which surrounds the through-holes is exposed. The surrounding of each through-hole is seamlessly laser-welded when the laser welding position is irradiated with a laser beam.
    Type: Application
    Filed: July 12, 2018
    Publication date: May 7, 2020
    Inventors: Toshihiro SHIMAZOE, Kento NAGAMATSU, Hiroyuki HIGASHI
  • Publication number: 20190006206
    Abstract: The substrate processing method according to an exemplary embodiment includes a low temperature dissolving processing and an etching processing. The low temperature dissolving processing dissolves oxygen in an alkaline aqueous solution cooled to a predetermined temperature lower than the room temperature. The etching processing etches a substrate by supplying the alkaline aqueous solution in which oxygen is dissolved to the substrate.
    Type: Application
    Filed: June 27, 2018
    Publication date: January 3, 2019
    Inventors: Hiroyuki Higashi, Takahisa Otsuka, Kazuyoshi Shinohara, Takashi Nakazawa, Seiya Fujimoto, Yuichi Douki
  • Publication number: 20180350636
    Abstract: A substrate solution-treatment apparatus includes: a substrate holding part for holding a substrate; a nozzle for supplying a treatment solution onto the substrate; a supply line; a flow rate control mechanism including a flow rate meter and a flow rate control valve installed in the supply line; an opening/closing valve installed in the supply line; and a control part for controlling operations of the flow rate control mechanism and the opening/closing valve. The flow rate control mechanism controls the flow rate control valve such that a detection value of the flow rate meter coincides with a flow rate target value provided from the control part. The control part controls the nozzle to supply the treatment solution onto the substrate with the opening/closing valve opened, and provides a first flow rate as the flow rate target value to the flow rate control mechanism.
    Type: Application
    Filed: May 25, 2018
    Publication date: December 6, 2018
    Inventors: Kosuke FUKUDA, Mikio NAKASHIMA, Kazuyoshi SHINOHARA, Hiroyuki HIGASHI
  • Patent number: 9865483
    Abstract: Disclosed is a substrate liquid processing method. The method includes: supplying a first processing liquid to a central portion of a substrate at a first flow rate by a first nozzle while rotating the substrate using a substrate holding unit; supplying a second processing liquid to a location between the central portion and an outer circumferential end of the substrate by a second nozzle while supplying the first processing liquid to the central portion of the substrate at the first flow rate; and changing the flow rate of the first processing liquid supplied from the first nozzle to a second flow rate lower than the first flow rate, so as to continue forming of the liquid film on the overall surface of the substrate while supplying the second processing liquid by the second nozzle to the substrate that is formed with a liquid film on the overall surface thereof.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: January 9, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Hiroyuki Higashi, Gentaro Goshi, Takahisa Otsuka
  • Publication number: 20160093517
    Abstract: Disclosed is a substrate liquid processing method. The method includes: supplying a first processing liquid to a central portion of a substrate at a first flow rate by a first nozzle while rotating the substrate using a substrate holding unit; supplying a second processing liquid to a location between the central portion and an outer circumferential end of the substrate by a second nozzle while supplying the first processing liquid to the central portion of the substrate at the first flow rate; and changing the flow rate of the first processing liquid supplied from the first nozzle to a second flow rate lower than the first flow rate, so as to continue forming of the liquid film on the overall surface of the substrate while supplying the second processing liquid by the second nozzle to the substrate that is formed with a liquid film on the overall surface thereof.
    Type: Application
    Filed: September 11, 2015
    Publication date: March 31, 2016
    Inventors: Hiroyuki Higashi, Gentaro Goshi, Takahisa Otsuka
  • Patent number: 9216460
    Abstract: A coolant-hole equipped drill includes a drill main body, a cutting edge portion which has a tip flank, a chip discharging groove provided with a front groove wall surface and a rear groove wall surface, a cutting edge formed at a ridge line portion where the front groove wall surface and the tip flank intersect with each other, a land portion formed between the chip discharging grooves adjacent to each other in the rotating direction, and a coolant hole drilled at the land portion and opened at the tip flank. The coolant hole includes a front hole wall surface, a rear hole wall surface, and an outer-circumference hole wall surface.
    Type: Grant
    Filed: June 15, 2010
    Date of Patent: December 22, 2015
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Matsuda, Hiroyuki Higashi, Koichiro Naruke, Tadashi Yamamoto, Kazuya Yanagida
  • Publication number: 20120082524
    Abstract: A coolant-hole equipped drill includes a drill main body, a cutting edge portion which has a tip flank, a chip discharging groove provided with a front groove wall surface and a rear groove wall surface, a cutting edge formed at a ridge line portion where the front groove wall surface and the tip flank intersect with each other, a land portion formed between the chip discharging grooves adjacent to each other in the rotating direction, and a coolant hole drilled at the land portion and opened at the tip flank. The coolant hole includes a front hole wall surface, a rear hole wall surface, and an outer-circumference hole wall surface.
    Type: Application
    Filed: June 15, 2010
    Publication date: April 5, 2012
    Applicant: Mitsubishi Materials Corporation
    Inventors: Nobuyuki Matsuda, Hiroyuki Higashi, Koichiro Naruke, Tadashi Yamamoto, Kazuya Yanagida
  • Patent number: 7762748
    Abstract: A plurality of cutting oil feed holes extend from the proximal side towards the distal side are provided in a drill body located on a reference line that extends towards a circumferential central portion of an outer circumferential surface of the drill body split by a chip discharge groove from an axis in a cross section orthogonal to the axis. A cutting oil feed hole that is located on the radial outermost side is used as a first cutting oil feed hole, and a cutting oil feed hole that is on the radial innermost side is used as a second cutting oil feed hole. Two or more openings of the cutting oil feed holes are provided in one cutting edge as the plurality of cutting oil feed holes are formed in the vicinity of the intersection ridgeline portion between the distal flank face and the second thinned face.
    Type: Grant
    Filed: December 3, 2007
    Date of Patent: July 27, 2010
    Assignee: Mitsubishi Materials Corporation
    Inventors: Kazuya Yanagida, Masayuki Mabuchi, Hiroyuki Higashi
  • Publication number: 20080131221
    Abstract: A plurality of cutting oil feed holes extend from the proximal side towards the distal side are provided in a drill body located on a reference line that extends towards a circumferential central portion of an outer circumferential surface of the drill body split by a chip discharge groove from an axis in a cross section orthogonal to the axis. A cutting oil feed hole that is located on the radial outermost side is used as a first cutting oil feed hole, and a cutting oil feed hole that is on the radial innermost side is used as a second cutting oil feed hole. Two or more openings of the cutting oil feed holes are provided in one cutting edge as the plurality of cutting oil feed holes are formed in the vicinity of the intersection ridgeline portion between the distal flank face and the second thinned face.
    Type: Application
    Filed: December 3, 2007
    Publication date: June 5, 2008
    Applicant: Mitsubishi Materials Corporation
    Inventors: Kazuya Yanagida, Masayuki Mabuchi, Hiroyuki Higashi
  • Publication number: 20050114882
    Abstract: The information providing system receives contents and a contents code corresponding to the contents by utilizing the broadcasting waves transmitted from a broadcasting station or the Internet, for example, and stores them. The contents may be information of newspaper article or else, and the contents code may be a code uniquely assigned to the contents. On the other hand, a paper-type display medium on which a similar contents code is recorded in advance is provided to a user by selling it or free distribution. When the user sets the paper-type display medium on the broadcasting receiver in a household, the code reading unit reads the contents code recorded on the paper-type display medium. Then, the receiver obtains the contents corresponding to the read contents code and displays it on the paper-type display medium.
    Type: Application
    Filed: March 7, 2003
    Publication date: May 26, 2005
    Inventors: Teruo Sakamaki, Hiroyuki Higashi, Yuji Ogura
  • Patent number: D602054
    Type: Grant
    Filed: May 11, 2009
    Date of Patent: October 13, 2009
    Assignee: Mitsubishi Materials Corporation
    Inventors: Kazuya Yanagida, Hiroyuki Higashi, Nobuyuki Matsuda
  • Patent number: D602055
    Type: Grant
    Filed: May 11, 2009
    Date of Patent: October 13, 2009
    Assignee: Mitsubishi Materials Corporation
    Inventors: Kazuya Yanagida, Hiroyuki Higashi, Nobuyuki Matsuda