Abstract: Provided is a light detecting apparatus comprising a light emitting section that emits light; a light detecting section that detects light from an observation target irradiated with the light emitted by the light emitting section; a mount section attached to a test subject that includes the observation target; and a holding section that holds the light emitting section and the light detecting section and is detachably attached to the mount section. The holding section holds the light emitting section and the light detecting section in a manner to secure a relative positional relationship between the light emitting section and the light detecting section, and a relative positional relationship between the holding section and the mount section is determined by attaching the holding section to the mount section.

Abstract: Provided is a light detecting apparatus comprising a light emitting section that emits light; a light detecting section that detects light from an observation target irradiated with the light emitted by the light emitting section; a mount section attached to a test subject that includes the observation target; and a holding section that holds the light emitting section and the light detecting section and is detachably attached to the mount section. The holding section holds the light emitting section and the light detecting section in a manner to secure a relative positional relationship between the light emitting section and the light detecting section, and a relative positional relationship between the holding section and the mount section is determined by attaching the holding section to the mount section.

Abstract: An apparatus for forming a coating film, comprises a spin chuck for supporting a substrate with one surface facing upward and rotating the substrate about a vertical axis, a first nozzle for supplying a solvent of a coating solution on the substrate, and a second nozzle for supplying the coating solution on a central portion of the substrate. The first and second nozzles are supported by a head such that the supported nozzle moves between a dropping position above the substrate and a waiting position offset from the substrate. The solvent and coating solution are diffused along the surface of the substrate by rotating the spin chuck.

Abstract: The present invention has a resist processing apparatus for supplying a processing solution onto an object to be processed to perform a resist process, including a processing solution supply nozzle for supplying the processing solution onto the object to be processed, a processing solution feeding arrangement for feeding the processing solution to the processing solution supply nozzle, a processing solution flow path arranged to extend between the processing solution feeding arrangement and the processing solution supply nozzle, and a processing solution deaeration mechanism arranged at an intermediate portion of the processing solution flow path to deaerate the processing solution.

Abstract: An apparatus for forming a coating film, comprises a spin chuck for supporting a substrate with one surface facing upward and rotating the substrate about a vertical axis, a first nozzle for supplying a solvent of a coating solution on the substrate, and a second nozzle for supplying the coating solution on a central portion of the substrate. The first and second nozzles are supported by a head such that the supported nozzle moves between a dropping position above the substrate and a waiting position offset from the substrate. The solvent and coating solution are diffused along the surface of the substrate by rotating the spin chuck.

Abstract: An apparatus for forming a coating film, comprises a spin chuck for supporting a substrate with one surface facing upward and rotating the substrate about a vertical axis, a first nozzle for supplying a solvent of a coating solution on the substrate, and a second nozzle for supplying the coating solution on a central portion of the substrate. The first and second nozzles are supported by a head such that the supported nozzle moves between a dropping position above the substrate and a waiting position offset from the substrate. The solvent and coating solution are diffused along the surface of the substrate by rotating the spin chuck.