Patents by Inventor Hiroyuki Izawa

Hiroyuki Izawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190367783
    Abstract: One aspect of the present invention is an adhesive film comprising: a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body; and a second adhesive layer comprising a second adhesive component, wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer.
    Type: Application
    Filed: February 14, 2018
    Publication date: December 5, 2019
    Inventors: Tetsuyuki SHIRAKAWA, Hiroyuki IZAWA, Tatsuya KUMADA
  • Publication number: 20190367782
    Abstract: One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.
    Type: Application
    Filed: February 14, 2018
    Publication date: December 5, 2019
    Inventors: Tetsuyuki SHIRAKAWA, Hiroyuki IZAWA, Takahiro FUKUI, Tatsuya KUMADA
  • Patent number: 10452047
    Abstract: According to one embodiment described herein aim to provide a mobile assist device capable of comprehensively determining (or judging) data output from various sensors, thereby determining (or judging) an item which should be controlled next. The mobile assist device includes a movable body, a sensors mounted on the movable body, and a control module which determines the brightness of the surroundings from an output of the sensor, and also outputs a control signal for controlling the operation of the other instrument based on a result of the determination.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: October 22, 2019
    Assignees: QINGDAO HISENSE ELECTRONICS CO., LTD., Toshiba Visual Solutions Corporation
    Inventors: Hiroyuki Nomoto, Shun Hirao, Hidehito Izawa, Reiko Kawachi, Kunio Honsawa
  • Patent number: 10418254
    Abstract: In an etching method of etching a tungsten film, the method is provided to execute a generating a surface reaction layer on a tungsten film that is formed on a surface of a base material by supplying a reactive species including fluorine which is generated in plasma onto the base material for a first predetermined time in a state where the base material of which the tungsten film is formed on at least a portion of the surface is cooled to a melting point temperature or lower of a tungsten fluoride, and a removing the surface reaction layer that is generated on the tungsten film by heating the base material of which the surface reaction layer is generated on the tungsten film to a boiling point temperature or higher of the tungsten fluoride for a second predetermined time.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: September 17, 2019
    Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Kazunori Shinoda, Naoyuki Kofuji, Hiroyuki Kobayashi, Nobuya Miyoshi, Kohei Kawamura, Masaru Izawa, Kenji Ishikawa, Masaru Hori
  • Publication number: 20190237302
    Abstract: In a vacuum processing apparatus including: a vacuum container including a processing chamber therein; a plasma formation chamber; plate members being arranged between the processing chamber and the plasma formation chamber; and a lamp and a window member being arranged around the plate members, in order that a wafer and the plate members are heated by electromagnetic waves from the lamp, a bottom surface and a side surface of the window member is formed of a member transmitting the electromagnetic waves therethrough.
    Type: Application
    Filed: April 9, 2019
    Publication date: August 1, 2019
    Inventors: Hiroyuki KOBAYASHI, Nobuya MIYOSHI, Kazunori SHINODA, Kenji MAEDA, Yutaka KOUZUMA, Satoshi SAKAl, Masaru IZAWA
  • Patent number: 10358434
    Abstract: Provided is a medicament comprising the compound represented by the following general formula (1) or a salt thereof: In the formula, R1, R2, R3, R4, R5, X1, X2, and X3 are defined. Methods for producing various radioactive compounds are also provided.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: July 23, 2019
    Assignees: NIHON MEDI-PHYSICS CO., LTD., KYOTO UNIVERSITY, NATIONAL HOSPITAL ORGANIZATION
    Inventors: Akihiro Izawa, Kei Akama, Yuki Okumura, Yurie Fukui, Nobuya Kobashi, Tsutomu Abe, Yoshihiro Doi, Miho Ikenaga, Hideo Saji, Hiroyuki Kimura, Mitsuhide Naruse
  • Patent number: 10325781
    Abstract: A method for etching a titanium nitride film includes a first process of supplying reactive species, which include hydrogen and fluorine, to a base material including a titanium nitride film on at least a part of a surface, and a second process of vacuum-heating the base material to remove the surface reaction layer that is generated on the surface of the titanium nitride film in the first process.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: June 18, 2019
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Kazunori Shinoda, Satoshi Sakai, Masaru Izawa, Nobuya Miyoshi, Hiroyuki Kobayashi, Yutaka Kouzuma, Kenji Ishikawa, Masaru Hori
  • Publication number: 20190169169
    Abstract: Provided is a medicament comprising the compound represented by the following general formula (1) or a salt thereof: In the formula, R1, R2, R3, R4, R5, X1, X2, and X3 are defined. Methods for producing various radioactive compounds are also provided.
    Type: Application
    Filed: December 6, 2018
    Publication date: June 6, 2019
    Applicants: NIHON MEDI-PHYSICS CO., LTD., Kyoto University, National Hospital Organization
    Inventors: Akihiro IZAWA, Kei AKAMA, Yuki OKUMURA, Yurie FUKUI, Nobuya KOBASHI, Tsutomu ABE, Yoshihiro DOI, Miho IKENAGA, Hideo SAJI, Hiroyuki KIMURA, Mitsuhide NARUSE
  • Publication number: 20190149702
    Abstract: An imaging apparatus includes an imager, a receiver, a synchronization signal generator, and a time code controller. The imager performs an imaging operation according to a synchronization signal. The receiver receives a time code signal including time code information and a synchronization pattern for detecting the time code information from another imaging apparatus. The synchronization signal generator generates the synchronization signal so as to be synchronized with a timing of the synchronization pattern included in the time code signal received. The time code controller generates a time code based on the synchronization signal and the time code information received.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 16, 2019
    Inventors: Hiroyuki SATOH, Masato IZAWA, Yuichi SUZUKI, Yoshio OHTSUKA
  • Patent number: 10290472
    Abstract: In a vacuum processing apparatus including: a vacuum container including a processing chamber therein; a plasma formation chamber; plate members being arranged between the processing chamber and the plasma formation chamber; and a lamp and a window member being arranged around the plate members, in order that a wafer and the plate members are heated by electromagnetic waves from the lamp, a bottom surface and a side surface of the window member is formed of a member transmitting the electromagnetic waves therethrough.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: May 14, 2019
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Hiroyuki Kobayashi, Nobuya Miyoshi, Kazunori Shinoda, Kenji Maeda, Yutaka Kouzuma, Satoshi Sakai, Masaru Izawa
  • Patent number: 8696942
    Abstract: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane(meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: April 15, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigeki Katogi, Hiroyuki Izawa, Houko Sutou, Masami Yusa, Tohru Fujinawa
  • Patent number: 8518303
    Abstract: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane(meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: August 27, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigeki Katogi, Hiroyuki Izawa, Houko Sutou, Masami Yusa, Tohru Fujinawa
  • Patent number: 8426588
    Abstract: Specified phenylalanine derivatives and analogues thereof have an antagonistic activity to ?4 integrin. They are used as therapeutic agents for various diseases concerning ?4 integrin.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: April 23, 2013
    Assignee: Ajinomoto Co, Inc.
    Inventors: Shingo Makino, Tatsuya Okuzumi, Toshihiko Yoshimura, Yuko Satake, Nobuyasu Suzuki, Hiroyuki Izawa, Kazuyuki Sagi, Akira Chiba, Eiji Nakanishi, Masahiro Murata, Takashi Tsuji
  • Publication number: 20130075142
    Abstract: An adhesive composition for connection between a first circuit member having a first connecting terminal on the main surface and a second circuit member having a second connecting terminal on the main surface, wherein the first circuit member and/or second circuit member are made of a base material containing a thermoplastic resin with a glass transition temperature of no higher than 200° C., the first connecting terminal and/or second connecting terminal are made of ITO and/or IZO, and the adhesive composition includes a phosphate group-containing compound, the free phosphate concentration of the cured adhesive composition being no greater than 100 ppm by mass.
    Type: Application
    Filed: March 24, 2011
    Publication date: March 28, 2013
    Applicant: HITACHI CHEMICAL CO., LTD.
    Inventors: Hiroyuki Izawa, Shigeki Katogi
  • Patent number: 8309658
    Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: November 13, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigeki Katogi, Houko Sutou, Hiroyuki Izawa, Toshiaki Shirasaka, Masami Yusa, Takanobu Kobayashi
  • Publication number: 20120273974
    Abstract: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.
    Type: Application
    Filed: June 12, 2012
    Publication date: November 1, 2012
    Applicant: HITACHI CHEMICAL CO., LTD.
    Inventors: Shigeki Katogi, Hiroyuki Izawa, Houko Sutou, Masami Yusa, Tohru Fujinawa
  • Publication number: 20120253041
    Abstract: Specified phenylalanine derivatives and analogues thereof have an antagonistic activity to ?4 integrin. They are used as therapeutic agents for various diseases concerning ?4 integrin.
    Type: Application
    Filed: June 15, 2012
    Publication date: October 4, 2012
    Applicant: Ajinomoto Co., Inc.
    Inventors: Shingo MAKINO, Tatsuya Okuzumi, Toshihiko Yoshimura, Yuko Satake, Nobuyasu Suzuki, Hiroyuki Izawa, Kazuyuki Sagi, Akira Chiba, Eiji Nakanishi, Masahiro Murata, Takashi Tsuji
  • Patent number: 8222405
    Abstract: Specified phenylalanine derivatives and analogues thereof have an antagonistic activity to ?4 integrin. They are used as therapeutic agents for various diseases concerning ?4 integrin.
    Type: Grant
    Filed: November 22, 2010
    Date of Patent: July 17, 2012
    Assignee: Ajinomoto Co., Inc.
    Inventors: Shingo Makino, Tatsuya Okuzumi, Toshihiko Yoshimura, Yuko Satake, Nobuyasu Suzuki, Hiroyuki Izawa, Kazuyuki Sagi, Akira Chiba, Eiji Nakanishi, Masahiro Murata, Takashi Tsuji
  • Patent number: 8138268
    Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
    Type: Grant
    Filed: June 8, 2005
    Date of Patent: March 20, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigeki Katogi, Houko Sutou, Hiroyuki Izawa, Toshiaki Shirasaka, Masami Yusa, Takanobu Kobayashi
  • Publication number: 20120063109
    Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
    Type: Application
    Filed: November 17, 2011
    Publication date: March 15, 2012
    Inventors: Shigeki KATOGI, Houko SUTOU, Hiroyuki IZAWA, Toshiaki SHIRASAKA, Masami YUSA, Takanobu KOBAYASHI