Patents by Inventor Hiroyuki Kobayashi

Hiroyuki Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220144556
    Abstract: The invention provides a conveying device having a conveying performance higher than that of the related art, a sample analysis system and sample pretreatment device with the conveying device and a method for conveying a conveyance object. A conveying device 1 includes a permanent magnet 10 which is provided on a sample rack 111 side, magnetic poles 25 each of which includes a core 22 made of a second magnetic body and a winding 21 wound around an outer periphery of the core 22, drive circuits 50 each of which supplies a current to the winding 21 of the magnetic pole 25, and current command calculation units 55 each of which controls a value of the current to be supplied to the winding 21 from the drive circuit 50. The current command calculation unit 55 makes the currents to be supplied to the windings 21 vary.
    Type: Application
    Filed: January 14, 2020
    Publication date: May 12, 2022
    Inventors: Yasuaki AOYAMA, Ryosuke HOSHI, Hiroyuki KOBAYASHI, Satoru KANEKO, Takeshi TAMAKOSHI, Hiroshi WATANABE, Katsuhiro KAMBARA, Kuniaki ONIZAWA
  • Publication number: 20220145424
    Abstract: To improve adhesion between a plating film reducing contact electrical resistance and a copper alloy plate containing Mg. A copper alloy plate containing Mg of more than 1.2% by mass and 2% by mass or less and the balance Cu and inevitable impurities in a center portion in a plate thickness direction, in the copper alloy plate, a surface Mg concentration at a surface is 30% or less of a center Mg concentration at the center portion in the plate thickness direction, a surface layer portion having a depth from the surface to where a Mg concentration is 90% of the center Mg concentration is provided, and in the surface layer portion, the Mg concentration increases from the surface toward the center portion of the plate thickness direction with a concentration gradient of 0.2% by mass/?m or more and 50% by mass/?m or less.
    Type: Application
    Filed: March 25, 2020
    Publication date: May 12, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Naoki Miyashima, Takanori Kobayashi, Kazunari Maki, Shinichi Funaki, Hiroyuki Mori, Yuki Ito
  • Patent number: 11319139
    Abstract: An injector comprises a cylindrical barrel including a discharge port, a seal body coming into close contact with an inner circumferential surface of the barrel, a plunger for pushing and moving the seal body to the discharge port side of the barrel, and a stopper disposed on one of the barrel and the plunger and coming into elastic contact with the other in a radial direction of the barrel.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: May 3, 2022
    Assignee: KABUSHIKI KAISHA SHOFU
    Inventors: Hideto Kasaba, Hiroyuki Kobayashi, Hiroyuki Shioi, Hiroshi Yaana, Toshiyuki Nakatsuka, Yukihiro Ogawa, Hisako Tokura
  • Patent number: 11315702
    Abstract: A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a strand of a plurality of copper alloy wires: composed of a copper alloy containing Fe in an amount of 0.2% by mass or more and 1.6% by mass or less, P in an amount of 0.05% by mass or more and 0.4% by mass or less, and Sn in an amount of 0.05% by mass or more and 0.7% by mass or less, with the balance being Cu and impurities, and having a mass ratio of Fe/P of 4.0 or more; and having a wire diameter of 0.5 mm or less.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: April 26, 2022
    Assignees: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd.
    Inventors: Kei Sakamoto, Akiko Inoue, Tetsuya Kuwabara, Minoru Nakamoto, Yusuke Oshima, Yoshihiro Nakai, Kazuhiro Nanjyo, Taichiro Nishikawa, Kiyotaka Utsunomiya, Yasuyuki Ootsuka, Kinji Taguchi, Hiroyuki Kobayashi
  • Patent number: 11315701
    Abstract: A covered electrical wire comprising a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a strand of a plurality of copper alloy wires: composed of a copper alloy containing Fe in an amount of 0.1% by mass or more and 1.6% by mass or less, P in an amount of 0.05% by mass or more and 0.7% by mass or less, and Sn in an amount of 0.05% by mass or more and 0.7% by mass or less, with the balance being Cu and impurities; and having a wire diameter of 0.5 mm or less, the copper alloy wire having a tensile strength of 385 MPa or more and a work-hardening exponent of 0.1 or more.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: April 26, 2022
    Assignees: Sumitomo Electric Industries, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems. Ltd.
    Inventors: Kei Sakamoto, Akiko Inoue, Tetsuya Kuwabara, Minoru Nakamoto, Yusuke Oshima, Yoshihiro Nakai, Kazuhiro Nanjo, Taichiro Nishikawa, Kiyotaka Utsunomiya, Yasuyuki Ootsuka, Kinji Taguchi, Hiroyuki Kobayashi
  • Publication number: 20220115239
    Abstract: Provided is an etching method for etching a silicon oxide film with a high accuracy at a high selection ratio with respect to a silicon nitride film, the etching method of etching a film structure, in which an end portion of a film layer in which the silicon oxide film and the silicon nitride film formed in advance on a wafer disposed in a processing chamber are alternately stacked in a vertical direction forms a side wall of a groove or a hole, by supplying processing gas into the processing chamber includes a step of supplying hydrogen fluoride and alcohol vapor into the processing chamber, maintaining the wafer at a temperature of ?20° C. or lower, preferably ?20° C. to ?60° C., and etching the silicon oxide film from the end portion in a lateral direction.
    Type: Application
    Filed: April 10, 2020
    Publication date: April 14, 2022
    Inventors: Takashi Hattori, Yu Zhao, Hiroyuki Kobayashi, Hiroto Otake
  • Patent number: 11279149
    Abstract: A liquid discharging apparatus includes a transporting belt having an endless shape stretched over a plurality of rollers and configured to rotate while supporting a medium, to transport the medium in a transport direction, a liquid discharging unit configured to discharge a liquid onto the medium, and a flat plate portion for supporting the transporting belt from a side of a contact face with the roller. the flat plate portion includes an edge extending from one end of the transporting belt to the other end of the transporting belt along an extending direction intersecting the transport direction, the edge being formed by a transporting belt support face for supporting the transporting belt and a face facing upstream in a rotation direction of the transporting belt when transporting the medium in the transport direction. the edge is disposed to abut against the transporting belt along the extending direction.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: March 22, 2022
    Assignee: Seiko Epson Corporation
    Inventors: Kenichiro Kaneko, Seijun Horie, Tsuneyuki Sasaki, Hiroyuki Kobayashi
  • Patent number: 11276579
    Abstract: A substrate processing method for reducing a surface roughness of a semiconductor wafer by processing a film structure having at least two types of films beforehand disposed on the substrate, including steps of repeating an adsorption step of supplying activated particles into the processing chamber and allowing the particles to be adsorbed to a surface of a desirable film to be etched in the at least two types of films to allow the particles to combine with a material of the desirable film to form a reaction layer, a removal step of using plasma generated by supplying oxygen into the processing chamber to remove a deposit containing particles adhering to a surface of an undesirable film to be etched in the films, and a desorption step of desorbing and removing the reaction layer on the desirable film to be etched by heating the sample.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: March 15, 2022
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Hiroyuki Kobayashi, Nobuya Miyoshi, Kazunori Shinoda, Yutaka Kouzuma, Masaru Izawa
  • Publication number: 20220051387
    Abstract: An image processing apparatus includes an abnormal image generator that generates an abnormal image by inserting abnormal data into a learning normal image based on priorities set for each abnormal data, a priority setting unit that inputs the abnormal image to a model that has learned to eliminate the abnormal data from the abnormal image and newly sets the priority of the abnormal data inserted into the learning normal image based on the difference between an output image outputted from the model and the learning normal image, and a learning unit that learns the model so that the difference between the output image and leaning normal image is reduced.
    Type: Application
    Filed: February 17, 2020
    Publication date: February 17, 2022
    Applicant: NEC Corporation
    Inventor: Hiroyuki KOBAYASHI
  • Publication number: 20220008549
    Abstract: Desired is development of novel CDN derivatives having STING agonist activity; and a therapeutic agents and/or therapeutic methods using the novel CDN derivatives for diseases associated with STING agonist activity. Further desired is development of a therapeutic agents and/or therapeutic methods capable of delivering the novel CDN derivatives specifically to targeted cells and organs for diseases associated with STING agonist activity. The present invention provides novel CDN derivatives having potent STING agonist activity, and antibody-CDN derivative conjugates including the novel CDN derivatives.
    Type: Application
    Filed: September 6, 2019
    Publication date: January 13, 2022
    Applicant: DAIICHI SANKYO COMPANY, LIMITED
    Inventors: Toshifumi TSUDA, Toshiki TABUCHI, Hideaki WATANABE, Hiroyuki KOBAYASHI, Masayuki ISHIZAKI, Kyoko HARA, Teiji WADA, Masami ARAI
  • Patent number: 11217454
    Abstract: The present invention provides a plasma processing method or a plasma processing method, which allows the evenness of etching amounts to increase and the yield of processing to improve. A method for etching a tungsten film includes: a first step of depositing a fluorocarbon layer and forming an intermediate layer that contains tungsten and fluorine and is self-limiting between the fluorocarbon layer and the tungsten film by supplying plasma of an organic gas containing fluorine to a base material having the tungsten film over at least a part of the surface; and a second step of removing the fluorocarbon layer and the intermediate layer by using plasma of an oxygen gas.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: January 4, 2022
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Kazunori Shinoda, Hiroto Otake, Hiroyuki Kobayashi, Kohei Kawamura, Masaru Izawa
  • Patent number: 11210548
    Abstract: A railroad track recognition apparatus has an index calculating unit, an initial searching unit, a secondary searching unit, and a railroad track recognizing unit. The index calculating unit calculates an index value, for each pixel or pixel group of a captured image. The initial searching unit selects a line segment, having a larger evaluation value obtained from the index values, from a plurality of line segments in a first search area, and the secondary searching unit selects a line segment, having a larger evaluation value obtained from the index values, from a second area or a third area. The railroad track recognizing unit recognizes a railroad track based on reference points of the line segments selected by the initial and secondary searching units.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: December 28, 2021
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION
    Inventors: Takuya Futagami, Yusuke Takahashi, Hiroyuki Kobayashi, Yushi Kamo
  • Publication number: 20210398723
    Abstract: The present invention comprises: an object to be conveyed that has at least one permanent magnet 10; a magnetic pole 25 that has a core 22 comprising a second magnetic body and a winding 21 wound around the outer periphery of the core 22; a drive circuit 50 for supplying a current to the winding 21 of the magnetic pole 25; a current detection unit 30 for detecting the value of the current flowing through the winding 21; and a computation unit 40 for estimating the position of the permanent magnet 10 on the basis of the current value detected by the current detection unit 30 and controlling the value of the current supplied from the drive circuit 50 to the winding 21 on the basis of information about the estimated position of the permanent magnet 10.
    Type: Application
    Filed: November 7, 2019
    Publication date: December 23, 2021
    Inventors: Yasuaki AOYAMA, Hiroyuki KOBAYASHI, Satoru KANEKO, Takeshi TAMAKOSHI, Ryosuke HOSHI, Katsuhiro KAMBARA, Hiroshi WATANABE, Kuniaki ONIZAWA
  • Publication number: 20210366721
    Abstract: A substrate processing method for reducing a surface roughness of a semiconductor wafer by processing a film structure having at least two types of films beforehand disposed on the substrate, including steps of repeating an adsorption step of supplying activated particles into the processing chamber and allowing the particles to be adsorbed to a surface of a desirable film to be etched in the at least two types of films to allow the particles to combine with a material of the desirable film to form a reaction layer, a removal step of using plasma generated by supplying oxygen into the processing chamber to remove a deposit containing particles adhering to a surface of an undesirable film to be etched in the films, and a desorption step of desorbing and removing the reaction layer on the desirable film to be etched by heating the sample.
    Type: Application
    Filed: November 14, 2018
    Publication date: November 25, 2021
    Inventors: Hiroyuki KOBAYASHI, Nobuya MIYOSHI, Kazunori SHINODA, Yutaka KOUZUMA, Masaru IZAWA
  • Publication number: 20210358760
    Abstract: Provided is a plasma etching method which enables etching with high accuracy while controlling and reducing surface roughness of a transition metal film. The etching is performed for the transition metal film, which is formed on a sample and contains a transition metal element, by a first step of isotropically generating a layer of transition metal oxide on a surface of the transition metal film while a temperature of the sample is maintained at 100° C. or lower, a second step of raising the temperature of the sample to a predetermined temperature of 150° C. or higher and 250° C. or lower while a complexation gas is supplied to the layer of transition metal oxide, a third step of subliming and removing a reactant generated by an reaction between the complexation gas and the transition metal oxide formed in the first step while the temperature of the sample is maintained at 150° C. or higher and 250° C. or lower, and a fourth step of cooling the sample.
    Type: Application
    Filed: February 1, 2019
    Publication date: November 18, 2021
    Inventors: Sumiko FUJISAKI, Yoshihide YAMAGUCHI, Hiroyuki KOBAYASHI, Kazunori SHINODA, Kohei KAWAMURA, Yutaka KOUZUMA, Masaru IZAWA
  • Publication number: 20210351908
    Abstract: A clock and data recovery device of a memory system receives a multiplexed data signal obtained by multiplexing a plurality of data units, each of which is to be transmitted to one of a plurality of memories for storage therein, in an area corresponding to each memory in an amplitude direction and a time direction. The clock and data recovery device includes a clock generation circuit configured to generate a clock, and a data recovery circuit configured to execute phase synchronization with respect to a synchronization signal included in the multiplexed data signal using the generated clock and to recover one of the data units from the area corresponding to one of the memories, from the multiplexed data signal.
    Type: Application
    Filed: July 22, 2021
    Publication date: November 11, 2021
    Inventor: Hiroyuki KOBAYASHI
  • Patent number: 11171393
    Abstract: According to one embodiment, a battery module includes a plurality of sub-modules. The plurality of sub-modules are integrated. Each of the plurality of sub-modules includes a cell group configured using a plurality of cells connected in series. The plurality of cells configuring the cell group are arranged linearly such that intra-cell current directions are parallel and the intra-cell current direction of each of the cells is opposite to the intra-cell current direction of the cell adjacent to each cell in the cell group. Each of the plurality of sub-modules includes an input terminal to input a current to the cell group and an output terminal to output the current from the cell group.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: November 9, 2021
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroyuki Kobayashi, Tomomi Kageyama, Takeshi Yasuda, Kaoru Koiwa, Seiji Ito, Tomonori Ezoe
  • Patent number: 11161358
    Abstract: A printing apparatus includes an ejection unit including a nozzle surface configured to eject a liquid droplet, the nozzle surface facing a printing surface of a medium, a transport unit configured to transport the medium in a transport direction, a steam application unit configured to apply steam to the printing surface, the steam application unit being provided upstream of the ejection unit in the transport direction, and a medium compression unit configured to compress the medium, the medium compression unit being provided upstream of the ejection unit in the transport direction and downstream of the steam application unit in the transport direction.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: November 2, 2021
    Assignee: Seiko Epson Corporation
    Inventors: Seijun Horie, Hiroyuki Kobayashi, Yoshihisa Horikawa
  • Patent number: 11155096
    Abstract: A liquid ejecting unit includes: a first chamber; a second chamber; a third chamber; a fourth chamber; a first liquid passage for supplying a first type of liquid to the first chamber and the third chamber; a second liquid passage for supplying a second type of liquid to the second chamber and the fourth chamber, the second type of liquid differing from the first type of liquid; a first fluid passage for supplying fluid to the first chamber and the second chamber; and a second fluid passage for supplying the fluid to the third chamber and the fourth chamber.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: October 26, 2021
    Assignee: Seiko Epson Corporation
    Inventors: Masahiko Sato, Hiroyuki Hagiwara, Hironori Matsuoka, Hiroyuki Kobayashi, Takahiro Kanegae
  • Publication number: 20210304474
    Abstract: An information processing apparatus, an information processing method, a non-transitory computer-readable medium, and an information processing apparatus. The information processing apparatus includes an area information generating circuitry, a detection circuitry, and an area selection circuitry. The area information generating circuitry is configured to generate area information indicating each area of each image of a plurality of images, the plurality of images being projected onto a projection surface. The detection circuitry is configured to detect one or more areas that are designated by a user operation out of a plurality of areas, the plurality of areas based on the area information that is generated. The area selecting circuitry is configured to select a portion of the plurality of areas based on the one or more areas that are detected.
    Type: Application
    Filed: July 24, 2019
    Publication date: September 30, 2021
    Inventors: Hiroyuki Kobayashi, Akihiro Hokimoto