Patents by Inventor Hiroyuki Moriya

Hiroyuki Moriya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200017613
    Abstract: Particles of an acrylic polymer comprising a constituent unit (A) derived from methyl methacrylate and a constituent unit (B) derived from a (meth)acrylic acid alkyl ester in which the alkyl group has 2 to 8 carbon atoms, wherein the particles having electrostatic buildup inhibition rate of 90 to 99.9° as obtained by a specific method.
    Type: Application
    Filed: September 25, 2019
    Publication date: January 16, 2020
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Yoshikazu SAITO, Takahiro Mukuda, Hiroyuki Fukuoka, Makoto Moriya, Masaaki Kiura, Masashi Serizawa
  • Patent number: 10526486
    Abstract: A resin composition includes a thermoplastic resin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond that includes a first resin containing at least one of an amide bond and an imide bond and having such a melting temperature that a difference in melting temperature between the first resin and the thermoplastic resin is from 0° C. to 90° C. and a second resin containing at least one of an amide bond and an imide bond and having a melting temperature which is higher than that of the thermoplastic resin and that of the first resin, and a compatibilizer.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: January 7, 2020
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi Miyamoto, Daisuke Nakayama, Masayuki Okoshi, Hiroyuki Moriya
  • Publication number: 20190369355
    Abstract: There is provided a camera module including a stacked lens structure including a plurality of lens substrates. The plurality of lens substrates includes a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate. The camera module further includes an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element.
    Type: Application
    Filed: January 16, 2018
    Publication date: December 5, 2019
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Munekatsu FUKUYAMA, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Masanori IWASAKI, Toshihiko HAYASHI, Shuzo SATO, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Yusuke MORIYA, Minoru ISHIDA
  • Publication number: 20190359821
    Abstract: The invention is directed to a resin composition containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, a resin molded article containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, and a method for preparing a resin composition including molten kneading polycarbonate, reinforced fibers and compatibilizer having a reactive cyclic group.
    Type: Application
    Filed: August 12, 2019
    Publication date: November 28, 2019
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Masayuki OKOSHI, Hiroyuki MORIYA, Tsuyoshi MIYAMOTO, Yuko IWADATE, Daisuke NAKAYAMA
  • Patent number: 10472433
    Abstract: Particles of an acrylic polymer comprising a constituent unit (A) derived from methyl methacrylic acid and a constituent unit (B) derived from a (meth)acrylic acid alkyl ester in which the alkyl group has 2 to 8 carbon atoms, wherein the particles having electrostatic buildup inhibition rate of 90 to 99.9%.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: November 12, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Yoshikazu Saito, Takahiro Mukuda, Hiroyuki Fukuoka, Makoto Moriya, Masaaki Kiura, Masashi Serizawa
  • Patent number: 10475837
    Abstract: An electronic device has a mounted image sensor including a light shielding body having light shielding walls and light transmitting portions each formed in an opening between the light shielding walls, a first light-shielding layer formed on a light incident surface side of the light shielding body and having an opening narrower than the opening of the light shielding body for each of the openings of the light shielding body, a microlens provided for each of the openings of the first light-shielding layer on the light incident surface side of the light shielding body, and a light receiving element layer with an array of a large number of light receiving elements. The present disclosure can be used for, for example, a compound-eye optical system.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: November 12, 2019
    Assignee: SONY CORPORATION
    Inventors: Yusuke Moriya, Kunihiko Hikichi, Hiroyuki Itou, Atsushi Yamamoto, Masahiko Shimizu
  • Publication number: 20190323683
    Abstract: Provided is a light-emitting device and the like in which a light source emits light on the basis of information obtained through communications and the light thus emitted is easy for a user to visually recognize. A light-emitting device includes an LED, a light guide plate, a transparent NFC antenna sheet, and an NFC antenna. The transparent NFC antenna sheet and the NFC antenna are disposed on a principal surface or a backside surface of the light guide plate. At least some part of the light guided by the light guide plate exits out through the principal surface. The LED emits light on the basis of identification information obtained through communications via the NFC antenna sheet and the NFC antenna.
    Type: Application
    Filed: March 27, 2017
    Publication date: October 24, 2019
    Inventors: MASAAKI MORIYA, MASAFUMI UENO, NAOKI SHIOBARA, MITSURU HINENO, TOMOHIRO OMATSU, HIROYUKI FURUKAWA, YASUHIRO SUGITA, SHINJI YAMAGISHI, JEAN MUGIRANEZA
  • Patent number: 10442913
    Abstract: A resin composition includes a thermoplastic resin, a carbon fiber, a polyamide having at least one of a carboxy group and an amino group at a terminal thereof, in which a presence ratio of the carboxy group present on the terminal is higher than a presence ratio of the amino group present on the terminal, and a compatibilizer.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: October 15, 2019
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Daisuke Nakayama, Tsuyoshi Miyamoto, Masayuki Okoshi, Hiroyuki Moriya
  • Patent number: 10414932
    Abstract: Ink includes water, a pigment, an organic solvent including glycol ether, and a surfactant including a silicone-based surfactant and a salt of sulfo succinic acid dialkyl ester. As measured by maximum bubble pressure technique at 23 degrees C., the dynamic surface tension of the ink at 15 msec is not greater than 31 mN/m and the difference between the dynamic surface tension of the ink at 15 msec and the dynamic surface tension of the ink at 1,500 msec is not greater than 4.0 mN/m.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: September 17, 2019
    Assignee: Ricoh Company, Ltd.
    Inventors: Kazuhiko Umemura, Hiroyuki Fushimi, Yoshihiro Moriya, Tamotsu Aruga
  • Patent number: 10385195
    Abstract: A resin composition for resin moldings comprises: a first resin composition containing a first polyolefin, a polyamide, carbon fibers having an average fiber length of 0.1 mm to 1 mm and a carboxylic anhydride-modified polyolefin as a compatibilizer; and a second resin composition containing a second polyolefin and organic fibers having an average fiber length of 1 mm to 20 mm, wherein, taking the total contents of the first polyolefin and the second polyolefin as 100 parts by mass, a content of the polyamide accounts for 1 part by mass to 50 parts by mass, a content of the carbon fiber accounts for 1 part by mass to 50 parts by mass, a content of the organic fibers accounts for 1 part by mass to 20 part by mass, and a content of the compatibilizer accounts for 1 part by mass to 10 parts by mass.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: August 20, 2019
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi Miyamoto, Hiroyuki Moriya, Masayuki Okoshi
  • Publication number: 20190248992
    Abstract: A resin molding including a polyolefin, a polyamide in a content of 1 part by mass to 50 parts by mass per 100 parts of the polyolefin, carbon fibers in a content of 1 part by mass to 50 parts by mass per 100 parts by mass of the polyolefin, organic fibers in a content of 1 part by mass to 20 parts by mass per 100 parts by mass of the polyolefin, and a carboxylic anhydride-modified polyolefin as a compatibilizer in a content of 1 part by mass to 10 parts by mass per 100 parts by mass of the polyolefin, where a proportion of a carbon fiber and an organic fiber each having a fiber length in a range of 1 mm to 20 mm to all the carbon fibers and the organic fibers is 1% to 20% by number.
    Type: Application
    Filed: April 24, 2019
    Publication date: August 15, 2019
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi MIYAMOTO, Hiroyuki MORIYA, Masayuki OKOSHI
  • Patent number: 10379323
    Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: August 13, 2019
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Yusuke Moriya, Masanori Iwasaki, Takashi Oinoue, Yoshiya Hagimoto, Hiroyasu Matsugai, Hiroyuki Itou, Suguru Saito, Keiji Ohshima, Nobutoshi Fujii, Hiroshi Tazawa, Toshiaki Shiraiwa, Minoru Ishida
  • Publication number: 20190169381
    Abstract: A resin composition containing a thermoplastic resin, carbon fibers, glass fibers, a resin containing amide bonds and/or imide bonds, and a compatibilizer.
    Type: Application
    Filed: February 4, 2019
    Publication date: June 6, 2019
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Masayuki OKOSHI, Hiroyuki MORIYA, Tsuyoshi MIYAMOTO
  • Patent number: 10301461
    Abstract: Provided is a resin composition including: a thermoplastic resin; a carbon fiber; and a terminal modified resin including a main chain having at least one terminal modified with a long chain alkyl group having 8 or more carbon atoms, the main chain containing at least one of an amide bond and an imide bond.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: May 28, 2019
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi Miyamoto, Daisuke Nakayama, Hiroyuki Moriya, Masayuki Okoshi
  • Publication number: 20190153222
    Abstract: Provided is a resin composition containing a thermoplastic resin, a carbon fiber, a polyamide, and a compatibilizer. The polyamide contains: a structural unit containing an aromatic ring other than an aramid structure; and a structural unit not containing an aromatic ring. Each of the structural unit is a structural unit in which a dicarboxylic acid and a diamine are condensation-polymerized, or a structural unit that is a ring-opened lactam.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi MIYAMOTO, Masayuki OKOSHI, Hiroyuki MORIYA
  • Publication number: 20190153203
    Abstract: This resin composition includes: a polyolefin; carbon fibers having an average fiber length of 0.1 to 2.5 mm; a resin including at least one among an amide bond and an imide bond, the content of the resin with respect to 100 parts by mass of the polyolefin being greater than 20 parts by mass and less than or equal to 100 parts by mass; and a compatibilizer.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Yuko IWADATE, Masayuki OKOSHI, Hiroyuki MORIYA, Tsuyoshi MIYAMOTO, Daisuke NAKAYAMA
  • Publication number: 20190144783
    Abstract: The present application relates to anti-foam compositions and methods of making and using such compositions as well as consumer products that comprise such compositions and the use of same. Such anti-foam compositions have low viscosities yet are effective antifoamers.
    Type: Application
    Filed: November 10, 2017
    Publication date: May 16, 2019
    Inventors: Rajan Keshav PANANDIKER, Bernard William KLUESENER, Rachel Morgan Clayton ROEDER, Hiroyuki MORIYA, Shinji IRIFUNE
  • Patent number: 10221287
    Abstract: A resin composition includes a thermoplastic resin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond and having such a melting temperature that a difference in melting temperature between the resin containing at least one of an amide bond and an imide bond and the thermoplastic resin is 90° C. or lower, and a compatibilizer.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: March 5, 2019
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi Miyamoto, Daisuke Nakayama, Masayuki Okoshi, Hiroyuki Moriya
  • Publication number: 20190015318
    Abstract: The present invention provides an emulsified cosmetic, including: an anionic acryl silicone copolymer (A) having an acryl chain as the main chain, the copolymer including, as monomer units, (I) 1 to 30% by mass of a polymerizable hydrophilic monomer having carboxylic acid, phosphoric acid, or sulfonic acid neutralized with a base, and (II) 10% by mass or more of a silicone macromonomer represented by the following general formula (1), or a silicone dendron group-containing polymerizable monomer; an oil material (B); and water (C). Accordingly, the present invention provides an emulsified cosmetic having excellent emulsification stability and non-stickiness.
    Type: Application
    Filed: February 24, 2017
    Publication date: January 17, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Hiroyuki MORIYA
  • Patent number: 10100184
    Abstract: A resin composition for resin moldings includes: a first resin composition containing a first polyolefin, a polyamide, first carbon fibers having an average fiber length of 0.1 mm to 1 mm and a carboxylic anhydride-modified polyolefin as a compatibilizer; and a second resin composition containing a second polyolefin and second carbon fibers having an average fiber length of 6 mm to 20 mm, wherein of the whole quantity of the resin composition for resin moldings, taking the total contents of the first polyolefin and the second polyolefin as 100 parts by mass, a content of the polyamide accounts for 1 part by mass to 50 parts by mass, the total contents for the first carbon fiber and the second carbon fiber account for 1 part by mass to 50 parts by mass and a content of the compatibilizer accounts for 1 part by mass to 10 parts by mass.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: October 16, 2018
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi Miyamoto, Hiroyuki Moriya, Masayuki Okoshi