Abstract: An inertial measurement device includes: a substrate having a joining area; a cap; a sensor device accommodated in a resin package and disposed in a mounting area on the substrate in an internal space between the substrate and the cap; and a sealing material and a joining material configured to join the cap to the substrate in the joining area of the substrate. The joining material surrounds the mounting area and has a communication hole for communication between the internal space and the outside, and the sealing material closes the communication hole.

Abstract: This spring used for a suspension device for a vehicle is provided with: a metal wire material which constitutes a spring section and which has a cover layer provided on the surface thereof; and a seat section which is subjected to a load acting on the spring section, is formed from an elastically deformable material, has a groove section into which the wire material fits, and is bonded to the wire material by an adhesive. The minimum thickness of the portion of the adhesive, which protrudes from the groove section, is greater than or equal to the thickness of an adhesion layer formed in the groove section.

Abstract: An electronic device includes: an electronic component including an inertial element, a base including a substrate to which the inertial element is fixed and a frame portion provided to surround the inertial element in a plan view, a first lid bonded to the frame portion so as to accommodate the inertial element between the first lid and the base, a second lid provided to face the first lid, and a bonding member disposed between the first lid and the second lid; and a molded portion covering the electronic component.

Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.

Abstract: This spring used for a suspension device for a vehicle is provided with: a metal wire material which constitutes a spring section and which has a cover layer provided on the surface thereof; and a seat section which is subjected to a load acting on the spring section, is formed from an elastically deformable material, and is bonded to the cover layer by an adhesive. The difference between the hardness of the seat section and the hardness of the adhesive is greater than the difference between the hardness of the adhesive and the hardness of the cover layer.

Abstract: Disclosed is a spring for a suspension device for a vehicle. The spring includes: a spring section made of a coil-shaped wire; and a seat section made of an elastically deformable material, brought into contact with a seat turn section of the spring section, and bearing load acting on the spring section. When a direction orthogonal to a direction of the load acting on the spring section is set as a widthwise direction, at least a part of the seat section is provided with a movable region support section having a widthwise dimension less than or equal to predetermined times a diameter dimension of the wire.

Abstract: This spring used for a suspension device for a vehicle is provided with: a metal wire material which constitutes a spring section and which has a cover layer provided on the surface thereof; and a seat section which is subjected to a load acting on the spring section, is formed from an elastically deformable material, has a groove section into which the wire material fits, and is bonded to the wire material by an adhesive. The minimum thickness of the portion of the adhesive, which protrudes from the groove section, is greater than or equal to the thickness of an adhesion layer formed in the groove section.

Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.

Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.

Abstract: Implementations described herein generally relate to methods for leveling a component above a substrate. In one implementation, a test substrate is placed on a substrate support inside of a processing chamber. A component, such as a mask, is located above the substrate. The component is lowered to a position so that the component and the substrate are in contact. The component is then lifted and the particle distribution on the test substrate is reviewed. Based on the particle distribution, the component may be adjusted. A new test substrate is placed on the substrate support inside of the processing chamber, and the component is lowered to a position so that the component and the new test substrate are in contact. The particle distribution on the new test substrate is reviewed. The process may be repeated until a uniform particle distribution is shown on a test substrate.

Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.

Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.

Abstract: Implementations described herein generally relate to methods for leveling a component above a substrate. In one implementation, a test substrate is placed on a substrate support inside of a processing chamber. A component, such as a mask, is located above the substrate. The component is lowered to a position so that the component and the substrate are in contact. The component is then lifted and the particle distribution on the test substrate is reviewed. Based on the particle distribution, the component may be adjusted. A new test substrate is placed on the substrate support inside of the processing chamber, and the component is lowered to a position so that the component and the new test substrate are in contact. The particle distribution on the new test substrate is reviewed. The process may be repeated until a uniform particle distribution is shown on a test substrate.

Abstract: A method of producing a spring which reduces time required for a heat treatment step of eliminating a machining strain generated by a forming step is provided. This production method is provided with a forming step (S10) of forming a spring steel material into a spring shape and a heat treatment step (S12) of eliminating a machining strain generated in the spring steel material by the forming step. The heat treatment step is executed by electrically heating the spring steel material by applying a current thereto. The heat treatment step has a first step of heating the spring steel material to a predetermined set temperature and a second step of keeping the spring steel material at the set temperature for a predetermined set time period subsequent to the first step. The set temperature is set to be higher than 430° C. but not higher than 500° C.

Abstract: A method of producing a spring which reduces time required for a heat treatment step of eliminating a machining strain generated by a forming step is provided. This production method is provided with a forming step (S10) of forming a spring steel material into a spring shape and a heat treatment step (S12) of eliminating a machining strain generated in the spring steel material by the forming step. The heat treatment step is executed by electrically heating the spring steel material by applying a current thereto. The heat treatment step has a first step of heating the spring steel material to a predetermined set temperature and a second step of keeping the spring steel material at the set temperature for a predetermined set time period subsequent to the first step. The set temperature is set to be higher than 430° C. but not higher than 500° C.

Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.

Abstract: A method of producing a spring which reduces time required for a heat treatment step of eliminating a machining strain generated by a forming step is provided. This production method is provided with a forming step (S10) of forming a spring steel material into a spring shape and a heat treatment step (S12) of eliminating a machining strain generated in the spring steel material by the forming step. The heat treatment step is executed by electrically heating the spring steel material by applying a current thereto. The heat treatment step has a first step of heating the spring steel material to a predetermined set temperature and a second step of keeping the spring steel material at the set temperature for a predetermined set time period subsequent to the first step. The set temperature is set to be higher than 430° C. but not higher than 500° C.

Abstract: A method for heating an entire spring, including regions adjacent to electrodes attached thereto, in a single electrical heating process includes (i) causing at least a pair of electrodes to make contact with the spring, and then (ii) electrically heating the spring by applying a voltage across the pair of electrodes. Each of the electrodes includes a first part having a first electric resistance value and a second part having a second electric resistance value that is higher than the first electric resistance value.

Abstract: A small-sized electronic security system superior in emergent response and capable of obtaining power from other electronic apparatuses even in the case in which a portable electronic key suffers from battery exhaustion, and a remote-operating portable electronic key therefor are obtained. The electronic security system is applied to a remote-operating system for in-vehicle equipment. The electronic key is composed of an electronic key housing on which a power supply is mounted and an electronic key module arranged to be able to be detachably attached to the electronic key housing and provided with a transmission/reception antenna, signal verification means, and operation control means for the in-vehicle equipment.

Abstract: An oscillation circuit comprises a SAW resonator having a pair of reflectors disposed on a piezoelectric substrate and a pair of IDTs which are set up in parallel between the pair of reflectors and which are constituted by teeth-of-a-comb electrodes; an inverter to which the pair of IDTs are connected in parallel; and a change-over unit which is provided between each of a pair of the teeth-of-a-comb electrodes constituting either of the IDTs of the pair of IDTs and the inverter and which changes over and connects an input side and an output side of the inverter connected to each of the pair of the teeth-of-a-comb electrodes.