Patents by Inventor Hiroyuki Okabe

Hiroyuki Okabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8823018
    Abstract: Provided is a semiconductor module having high inrush-current tolerance. A semiconductor module includes a switching element formed of a wide bandgap semiconductor, and a free wheel diode connected in antiparallel with the switching element, wherein the free wheel diode is made of silicon and has negative temperature characteristics.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: September 2, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Rei Yoneyama, Hiroyuki Okabe, Takahiro Inoue, Shinji Sakai
  • Publication number: 20140213602
    Abstract: This invention provides a method for predicting a therapeutic effect of chemotherapy that uses an antitumor agent comprising ?,?,?-trifluorothymidine and 5-chloro-6-(1-(2-iminopyrrolidinyl) methyl)uracil hydrochloride at a molar ratio of 1:0.5 on a colorectal cancer patient, the method comprising: (1) detecting the presence or absence of KRAS gene mutation in a biological sample obtained from the patient; and (2) predicting that the patient is likely to sufficiently respond to the chemotherapy, when KRAS gene mutation is detected in Step (1).
    Type: Application
    Filed: August 15, 2012
    Publication date: July 31, 2014
    Applicant: TAIHO PHARMACEUTICAL CO., LTD.
    Inventors: Masanobu Ito, Hiroyuki Okabe
  • Publication number: 20140138706
    Abstract: An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole.
    Type: Application
    Filed: July 25, 2013
    Publication date: May 22, 2014
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Rei YONEYAMA, Nobuya NISHIDA, Hiroyuki OKABE
  • Publication number: 20130342999
    Abstract: A semiconductor module can be attached to a heat sink. The semiconductor module includes a case housing a component of the semiconductor module, and an elastic member having one end engaging with the case and an opposite end in abutting contact with the heat sink. The elastic member forms a gap between the case and the heat sink, and heat conductive grease is appliable to the gap to be interposed between the case and the heat sink.
    Type: Application
    Filed: March 4, 2013
    Publication date: December 26, 2013
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Leijie ZHOU, Hiroyuki OKABE
  • Publication number: 20130314834
    Abstract: A low power consumption semiconductor driving circuit is provided which applies positive and negative bias signals to a semiconductor switching element by using a single power source to perform the switching of the semiconductor switching element. The semiconductor driving circuit is a semiconductor driving circuit for driving the semiconductor switching element. The semiconductor driving circuit includes an internal power source circuit for generating a second voltage from a first voltage supplied from an external power source, and a driver for applying the first voltage or the second voltage between the gate and emitter of the semiconductor switching element in accordance with an input signal inputted from outside to switch on and off the semiconductor switching element. The internal power source circuit is configured to operate in accordance with the input signal.
    Type: Application
    Filed: December 26, 2012
    Publication date: November 28, 2013
    Inventors: Koji TAMAKI, Takahiro INOUE, Hiroyuki OKABE
  • Publication number: 20130286622
    Abstract: A semiconductor device includes a first printed circuit board, a flat cable having electrical wires and a coating film which covers the electrical wires except for both ends, one end of each of the electrical wires is connected to the first printed circuit board, and a second printed circuit board connected to other end of each of the electrical wires. The flat cable is bent in such a manner that the first printed circuit board and the second printed circuit board face each other. A flat surface is formed in a portion of the coating film.
    Type: Application
    Filed: March 14, 2013
    Publication date: October 31, 2013
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Taichi OBARA, Rei YONEYAMA, Hiroyuki OKABE
  • Publication number: 20130161644
    Abstract: Provided is a semiconductor module having high inrush-current tolerance. A semiconductor module includes a switching element formed of a wide bandgap semiconductor, and a free wheel diode connected in antiparallel with the switching element, wherein the free wheel diode is made of silicon and has negative temperature characteristics.
    Type: Application
    Filed: August 31, 2012
    Publication date: June 27, 2013
    Applicant: Mitsubishi Electric Corporation
    Inventors: Rei YONEYAMA, Hiroyuki OKABE, Takahiro INOUE, Shinji SAKAI
  • Patent number: 8178191
    Abstract: A multilayer wiring board includes a core insulating layer with a first conductive wiring, a first insulating layer with a softening temperature lower than the core insulating layer, and a second insulating layer formed on the core insulating layer through the first insulating layer, the second insulating layer with a second conductive wiring electrically connected to the first conductive wiring and a softening temperature higher than the first insulating layer. The first insulating layer is mainly formed of a liquid crystal polymer. The core insulating layer and the second insulating layer are mainly formed of a polyimide resin or a bismaleimide triazine resin. The first conductive wiring and the second conductive wiring are electrically connected through a conductive via formed penetrating through the first insulating layer and the second insulating layer in a thickness direction.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: May 15, 2012
    Assignee: Hitachi Cable, Ltd.
    Inventors: Shigeo Nishino, Hiroyuki Takasaka, Nagayoshi Matsuo, Hiroyuki Okabe
  • Patent number: 7863255
    Abstract: Antitumor treatment regimens comprising: administering, to a patient diagnosed with cancer, an antitumor agent comprising 4-amino-1-(2-cyano-2-deoxy-?-D-arabinofuranosyl)-2(1H)-pyrimidinone, or a salt thereof, by way of continuous intravenous infusion, in an amount of 2.0 to 4.0 mg per m2 total body surface area of the patient, of 4-amino-1-(2-cyano-2-deoxy-?-D-arabinofuranosyl)-2(1H)-pyrimidinone equivalent, per day, for a duration of 168 to 336 hours. Compositions for providing the methods are also disclosed.
    Type: Grant
    Filed: April 29, 2008
    Date of Patent: January 4, 2011
    Assignee: Taiho Pharmaceutical Co., Ltd.
    Inventors: Hiroyuki Okabe, Kazuhito Arakawa
  • Publication number: 20090270340
    Abstract: Antitumor treatment regimens comprising: administering, to a patient diagnosed with cancer, an antitumor agent comprising 4-amino-1-(2-cyano-2-deoxy-?-D-arabinofuranosyl)-2(1H)-pyrimidinone, or a salt thereof, by way of continuous intravenous infusion, in an amount of 2.0 to 4.0 mg per m2 total body surface area of the patient, of 4-amino-1-(2-cyano-2-deoxy-?-D-arabinofuranosyl)-2(1H)-pyrimidinone equivalent, per day, for a duration of 168 to 336 hours. Compositions for providing the methods are also disclosed.
    Type: Application
    Filed: April 29, 2008
    Publication date: October 29, 2009
    Applicant: TAIHO Pharmaceuticak co., LTD.
    Inventors: Hiroyuki Okabe, Kazuhito Arakawa
  • Publication number: 20090151990
    Abstract: A multilayer wiring board includes a core insulating layer with a first conductive wiring, a first insulating layer with a softening temperature lower than the core insulating layer, and a second insulating layer formed on the core insulating layer through the first insulating layer, the second insulating layer with a second conductive wiring electrically connected to the first conductive wiring and a softening temperature higher than the first insulating layer. The first insulating layer is mainly formed of a liquid crystal polymer. The core insulating layer and the second insulating layer are mainly formed of a polyimide resin or a bismaleimide triazine resin. The first conductive wiring and the second conductive wiring are electrically connected through a conductive via formed penetrating through the first insulating layer and the second insulating layer in a thickness direction.
    Type: Application
    Filed: June 13, 2008
    Publication date: June 18, 2009
    Inventors: Shigeo NISHINO, Hiroyuki Takasaka, Nagayoshi Matsuo, Hiroyuki Okabe
  • Publication number: 20080027027
    Abstract: An object of the present invention is to provide a lactosucrose high content saccharide which comprises 70% or more of lactosucrose, on a saccharide composition basis, with a lower content of 1-kestose and fructosyl lactosucrose as by-products. Another object of the present invention is to provide processes for producing a lactosucrose high content saccharide and high purity lactosucrose containing 90% or more of lactosucrose, on a saccharide composition basis, which are feasible for industrial production. Further object of the present invention is to provide a solid lactosucrose with low hygroscopicity and a solid composition comprising the same.
    Type: Application
    Filed: April 20, 2005
    Publication date: January 31, 2008
    Inventors: Hiroyuki Okabe, Hajime Aga, Michio Kubota, Toshio Miyake
  • Publication number: 20060017621
    Abstract: The transmit/receive antenna has an active element with a two-dimensional conductor pattern formed on the surface of a dielectric substrate, surface-surface mounted to a PC board, and forming plural distribution paths of mutually different length. Antenna current is copied into a ground conductor such that the antenna element defines a linear main radiator, having a feeding end and an open end, forming a first distribution path, and a linear short-circuiting branching T-conductor, forming a second distribution path. A third distribution path is formed across the main radiation conductor leading to the ground conductor. This configuration produces two resonance frequency bands, exclusive of harmonics. The main radiation conductor and the feeding conductor are formed by conductor patterns on the dielectric substrate and the short-circuiting conductor is formed by a conductor pattern over the upper surface and side surface of the dielectric.
    Type: Application
    Filed: July 15, 2005
    Publication date: January 26, 2006
    Applicant: FDK Corporation
    Inventors: Kazuhiko Okawara, Hiroyuki Okabe
  • Patent number: 6922528
    Abstract: A light emission control system for a flash device includes a plurality of photometering sensors for photometric measurements on different photometering zones; and a controller which outputs a periodic pulsed trigger signal for activating the flash device, and sequentially selects analog signals output from the plurality of photometering sensors to convert the analog signals into digital signals in sequence. The controller outputs the pulsed trigger signal having a predetermined pulse frequency to perform a pre-flash emission operation in which the flash device is activated to discharge intermittently. The controller subsequently converts each analog signal into a corresponding digital signal in sequence in accordance with each trigger pulse of the periodic pulsed trigger signal before performing a main flash emission operation in which the flash device is activated to discharge at a time of exposure.
    Type: Grant
    Filed: March 9, 2004
    Date of Patent: July 26, 2005
    Assignee: PENTAX Corporation
    Inventor: Hiroyuki Okabe
  • Publication number: 20040179832
    Abstract: A light emission control system for a flash device includes a plurality of photometering sensors for photometric measurements on different photometering zones; and a controller which outputs a periodic pulsed trigger signal for activating the flash device, and sequentially selects analog signals output from the plurality of photometering sensors to convert the analog signals into digital signals in sequence. The controller outputs the pulsed trigger signal having a predetermined pulse frequency to perform a pre-flash emission operation in which the flash device is activated to discharge intermittently. The controller subsequently converts each analog signal into a corresponding digital signal in sequence in accordance with each trigger pulse of the periodic pulsed trigger signal before performing a main flash emission operation in which the flash device is activated to discharge at a time of exposure.
    Type: Application
    Filed: March 9, 2004
    Publication date: September 16, 2004
    Applicant: PENTAX Corporation
    Inventor: Hiroyuki Okabe
  • Patent number: 6569634
    Abstract: This invention relates to a method for immunologically measuring human thymidylate synthase with an anti-human thymidylate synthase antibody, wherein as the antibody, at least an anti-human thymidylate synthase polyclonal antibody immobilized on an insoluble matrix is used; a method for evaluating sensitivity of cancer cells to a fluoropyrimidine antitumor drug from the results of the measurement by the measuring method; and a human thymidylate synthase measuring kit comprising an insoluble matrix with at least one anti-human thymidylate synthase polyclonal antibody immobilized thereon. By a simple immunological measuring method, human TS in a sample can be measured with high sensitivity.
    Type: Grant
    Filed: May 1, 2000
    Date of Patent: May 27, 2003
    Assignees: Taiho Pharmaceutical Co., Ltd., Iatron Laboratories Inc.
    Inventors: Nobuhiro Hoshino, Takeshi Matsuya, Masakazu Fukushima, Hiroyuki Okabe
  • Patent number: 6500932
    Abstract: This invention relates to an anti-human thymidylate synthase monoclonal antibody capable of recognizing an epitope which exists in a region of 187th to 313th amino acids from an N-terminus in human thymidy late synthase, an anti-human thymidylate synthase monoclonal antibody capable of recognizing an epitope which exists in a region of from an N-terminus to a 61st amino acid in human thymidylate synthase, and also hybridomas capable of producing these monoclonal anti-bodies. These monoclonal antibodies are useful for the immunological measurement of human thymidylate synthase.
    Type: Grant
    Filed: May 1, 2000
    Date of Patent: December 31, 2002
    Assignee: Taiho Pharmaceutical Co., Ltd.
    Inventors: Masakazu Fukushima, Hiroyuki Okabe