Patents by Inventor Hiroyuki Okabe
Hiroyuki Okabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8823018Abstract: Provided is a semiconductor module having high inrush-current tolerance. A semiconductor module includes a switching element formed of a wide bandgap semiconductor, and a free wheel diode connected in antiparallel with the switching element, wherein the free wheel diode is made of silicon and has negative temperature characteristics.Type: GrantFiled: August 31, 2012Date of Patent: September 2, 2014Assignee: Mitsubishi Electric CorporationInventors: Rei Yoneyama, Hiroyuki Okabe, Takahiro Inoue, Shinji Sakai
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Publication number: 20140213602Abstract: This invention provides a method for predicting a therapeutic effect of chemotherapy that uses an antitumor agent comprising ?,?,?-trifluorothymidine and 5-chloro-6-(1-(2-iminopyrrolidinyl) methyl)uracil hydrochloride at a molar ratio of 1:0.5 on a colorectal cancer patient, the method comprising: (1) detecting the presence or absence of KRAS gene mutation in a biological sample obtained from the patient; and (2) predicting that the patient is likely to sufficiently respond to the chemotherapy, when KRAS gene mutation is detected in Step (1).Type: ApplicationFiled: August 15, 2012Publication date: July 31, 2014Applicant: TAIHO PHARMACEUTICAL CO., LTD.Inventors: Masanobu Ito, Hiroyuki Okabe
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Publication number: 20140138706Abstract: An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole.Type: ApplicationFiled: July 25, 2013Publication date: May 22, 2014Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Rei YONEYAMA, Nobuya NISHIDA, Hiroyuki OKABE
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Publication number: 20130342999Abstract: A semiconductor module can be attached to a heat sink. The semiconductor module includes a case housing a component of the semiconductor module, and an elastic member having one end engaging with the case and an opposite end in abutting contact with the heat sink. The elastic member forms a gap between the case and the heat sink, and heat conductive grease is appliable to the gap to be interposed between the case and the heat sink.Type: ApplicationFiled: March 4, 2013Publication date: December 26, 2013Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Leijie ZHOU, Hiroyuki OKABE
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Publication number: 20130314834Abstract: A low power consumption semiconductor driving circuit is provided which applies positive and negative bias signals to a semiconductor switching element by using a single power source to perform the switching of the semiconductor switching element. The semiconductor driving circuit is a semiconductor driving circuit for driving the semiconductor switching element. The semiconductor driving circuit includes an internal power source circuit for generating a second voltage from a first voltage supplied from an external power source, and a driver for applying the first voltage or the second voltage between the gate and emitter of the semiconductor switching element in accordance with an input signal inputted from outside to switch on and off the semiconductor switching element. The internal power source circuit is configured to operate in accordance with the input signal.Type: ApplicationFiled: December 26, 2012Publication date: November 28, 2013Inventors: Koji TAMAKI, Takahiro INOUE, Hiroyuki OKABE
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Publication number: 20130286622Abstract: A semiconductor device includes a first printed circuit board, a flat cable having electrical wires and a coating film which covers the electrical wires except for both ends, one end of each of the electrical wires is connected to the first printed circuit board, and a second printed circuit board connected to other end of each of the electrical wires. The flat cable is bent in such a manner that the first printed circuit board and the second printed circuit board face each other. A flat surface is formed in a portion of the coating film.Type: ApplicationFiled: March 14, 2013Publication date: October 31, 2013Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Taichi OBARA, Rei YONEYAMA, Hiroyuki OKABE
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Publication number: 20130161644Abstract: Provided is a semiconductor module having high inrush-current tolerance. A semiconductor module includes a switching element formed of a wide bandgap semiconductor, and a free wheel diode connected in antiparallel with the switching element, wherein the free wheel diode is made of silicon and has negative temperature characteristics.Type: ApplicationFiled: August 31, 2012Publication date: June 27, 2013Applicant: Mitsubishi Electric CorporationInventors: Rei YONEYAMA, Hiroyuki OKABE, Takahiro INOUE, Shinji SAKAI
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Patent number: 8178191Abstract: A multilayer wiring board includes a core insulating layer with a first conductive wiring, a first insulating layer with a softening temperature lower than the core insulating layer, and a second insulating layer formed on the core insulating layer through the first insulating layer, the second insulating layer with a second conductive wiring electrically connected to the first conductive wiring and a softening temperature higher than the first insulating layer. The first insulating layer is mainly formed of a liquid crystal polymer. The core insulating layer and the second insulating layer are mainly formed of a polyimide resin or a bismaleimide triazine resin. The first conductive wiring and the second conductive wiring are electrically connected through a conductive via formed penetrating through the first insulating layer and the second insulating layer in a thickness direction.Type: GrantFiled: June 13, 2008Date of Patent: May 15, 2012Assignee: Hitachi Cable, Ltd.Inventors: Shigeo Nishino, Hiroyuki Takasaka, Nagayoshi Matsuo, Hiroyuki Okabe
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Patent number: 7863255Abstract: Antitumor treatment regimens comprising: administering, to a patient diagnosed with cancer, an antitumor agent comprising 4-amino-1-(2-cyano-2-deoxy-?-D-arabinofuranosyl)-2(1H)-pyrimidinone, or a salt thereof, by way of continuous intravenous infusion, in an amount of 2.0 to 4.0 mg per m2 total body surface area of the patient, of 4-amino-1-(2-cyano-2-deoxy-?-D-arabinofuranosyl)-2(1H)-pyrimidinone equivalent, per day, for a duration of 168 to 336 hours. Compositions for providing the methods are also disclosed.Type: GrantFiled: April 29, 2008Date of Patent: January 4, 2011Assignee: Taiho Pharmaceutical Co., Ltd.Inventors: Hiroyuki Okabe, Kazuhito Arakawa
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Publication number: 20090270340Abstract: Antitumor treatment regimens comprising: administering, to a patient diagnosed with cancer, an antitumor agent comprising 4-amino-1-(2-cyano-2-deoxy-?-D-arabinofuranosyl)-2(1H)-pyrimidinone, or a salt thereof, by way of continuous intravenous infusion, in an amount of 2.0 to 4.0 mg per m2 total body surface area of the patient, of 4-amino-1-(2-cyano-2-deoxy-?-D-arabinofuranosyl)-2(1H)-pyrimidinone equivalent, per day, for a duration of 168 to 336 hours. Compositions for providing the methods are also disclosed.Type: ApplicationFiled: April 29, 2008Publication date: October 29, 2009Applicant: TAIHO Pharmaceuticak co., LTD.Inventors: Hiroyuki Okabe, Kazuhito Arakawa
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Publication number: 20090151990Abstract: A multilayer wiring board includes a core insulating layer with a first conductive wiring, a first insulating layer with a softening temperature lower than the core insulating layer, and a second insulating layer formed on the core insulating layer through the first insulating layer, the second insulating layer with a second conductive wiring electrically connected to the first conductive wiring and a softening temperature higher than the first insulating layer. The first insulating layer is mainly formed of a liquid crystal polymer. The core insulating layer and the second insulating layer are mainly formed of a polyimide resin or a bismaleimide triazine resin. The first conductive wiring and the second conductive wiring are electrically connected through a conductive via formed penetrating through the first insulating layer and the second insulating layer in a thickness direction.Type: ApplicationFiled: June 13, 2008Publication date: June 18, 2009Inventors: Shigeo NISHINO, Hiroyuki Takasaka, Nagayoshi Matsuo, Hiroyuki Okabe
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Publication number: 20080027027Abstract: An object of the present invention is to provide a lactosucrose high content saccharide which comprises 70% or more of lactosucrose, on a saccharide composition basis, with a lower content of 1-kestose and fructosyl lactosucrose as by-products. Another object of the present invention is to provide processes for producing a lactosucrose high content saccharide and high purity lactosucrose containing 90% or more of lactosucrose, on a saccharide composition basis, which are feasible for industrial production. Further object of the present invention is to provide a solid lactosucrose with low hygroscopicity and a solid composition comprising the same.Type: ApplicationFiled: April 20, 2005Publication date: January 31, 2008Inventors: Hiroyuki Okabe, Hajime Aga, Michio Kubota, Toshio Miyake
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Publication number: 20060017621Abstract: The transmit/receive antenna has an active element with a two-dimensional conductor pattern formed on the surface of a dielectric substrate, surface-surface mounted to a PC board, and forming plural distribution paths of mutually different length. Antenna current is copied into a ground conductor such that the antenna element defines a linear main radiator, having a feeding end and an open end, forming a first distribution path, and a linear short-circuiting branching T-conductor, forming a second distribution path. A third distribution path is formed across the main radiation conductor leading to the ground conductor. This configuration produces two resonance frequency bands, exclusive of harmonics. The main radiation conductor and the feeding conductor are formed by conductor patterns on the dielectric substrate and the short-circuiting conductor is formed by a conductor pattern over the upper surface and side surface of the dielectric.Type: ApplicationFiled: July 15, 2005Publication date: January 26, 2006Applicant: FDK CorporationInventors: Kazuhiko Okawara, Hiroyuki Okabe
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Patent number: 6922528Abstract: A light emission control system for a flash device includes a plurality of photometering sensors for photometric measurements on different photometering zones; and a controller which outputs a periodic pulsed trigger signal for activating the flash device, and sequentially selects analog signals output from the plurality of photometering sensors to convert the analog signals into digital signals in sequence. The controller outputs the pulsed trigger signal having a predetermined pulse frequency to perform a pre-flash emission operation in which the flash device is activated to discharge intermittently. The controller subsequently converts each analog signal into a corresponding digital signal in sequence in accordance with each trigger pulse of the periodic pulsed trigger signal before performing a main flash emission operation in which the flash device is activated to discharge at a time of exposure.Type: GrantFiled: March 9, 2004Date of Patent: July 26, 2005Assignee: PENTAX CorporationInventor: Hiroyuki Okabe
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Publication number: 20040179832Abstract: A light emission control system for a flash device includes a plurality of photometering sensors for photometric measurements on different photometering zones; and a controller which outputs a periodic pulsed trigger signal for activating the flash device, and sequentially selects analog signals output from the plurality of photometering sensors to convert the analog signals into digital signals in sequence. The controller outputs the pulsed trigger signal having a predetermined pulse frequency to perform a pre-flash emission operation in which the flash device is activated to discharge intermittently. The controller subsequently converts each analog signal into a corresponding digital signal in sequence in accordance with each trigger pulse of the periodic pulsed trigger signal before performing a main flash emission operation in which the flash device is activated to discharge at a time of exposure.Type: ApplicationFiled: March 9, 2004Publication date: September 16, 2004Applicant: PENTAX CorporationInventor: Hiroyuki Okabe
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Patent number: 6569634Abstract: This invention relates to a method for immunologically measuring human thymidylate synthase with an anti-human thymidylate synthase antibody, wherein as the antibody, at least an anti-human thymidylate synthase polyclonal antibody immobilized on an insoluble matrix is used; a method for evaluating sensitivity of cancer cells to a fluoropyrimidine antitumor drug from the results of the measurement by the measuring method; and a human thymidylate synthase measuring kit comprising an insoluble matrix with at least one anti-human thymidylate synthase polyclonal antibody immobilized thereon. By a simple immunological measuring method, human TS in a sample can be measured with high sensitivity.Type: GrantFiled: May 1, 2000Date of Patent: May 27, 2003Assignees: Taiho Pharmaceutical Co., Ltd., Iatron Laboratories Inc.Inventors: Nobuhiro Hoshino, Takeshi Matsuya, Masakazu Fukushima, Hiroyuki Okabe
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Patent number: 6500932Abstract: This invention relates to an anti-human thymidylate synthase monoclonal antibody capable of recognizing an epitope which exists in a region of 187th to 313th amino acids from an N-terminus in human thymidy late synthase, an anti-human thymidylate synthase monoclonal antibody capable of recognizing an epitope which exists in a region of from an N-terminus to a 61st amino acid in human thymidylate synthase, and also hybridomas capable of producing these monoclonal anti-bodies. These monoclonal antibodies are useful for the immunological measurement of human thymidylate synthase.Type: GrantFiled: May 1, 2000Date of Patent: December 31, 2002Assignee: Taiho Pharmaceutical Co., Ltd.Inventors: Masakazu Fukushima, Hiroyuki Okabe