Patents by Inventor Hiroyuki Osawa

Hiroyuki Osawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10464346
    Abstract: Provided is an ink jet recording apparatus capable of easily and more reliably performing fixation processing on a recording medium moved after image recording. The ink jet recording apparatus is provided with: an image forming unit (12) that ejects ink; a first conveyance unit (11) that conveys a recording medium (P) on which the ejected ink is to land and relatively moves the same with respect to the image forming unit; a fixation unit (24) that fixes the ink that has landed on the recording medium; a second conveyance unit (21) that conveys the recording medium on which the ink to be fixed has landed and relatively moves the same with respect to the fixation unit; and a first end pressing roller (215) and a second end pressing roller (216) which serve as a floating suppression unit that suppresses, from the ink-landed surface side, floating of the recording medium from a recording medium conveyance surface in the second conveyance unit.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: November 5, 2019
    Assignee: KONICA MINOLTA, INC.
    Inventors: Satoru Osawa, Hiroyuki Tokimatsu
  • Patent number: 8240119
    Abstract: A high-strength cable having a twisted layer of non-metallic reinforcing elements in outer coatings is disclosed. The reinforcing elements include coating elements, fiber elements of copolyparaphenylene-3,4?-oxydiphenyleneterephthalic amide disposed in the coating elements, and filling materials filled between the fiber elements, respectively. The lateral compression stress of the fiber elements of the copolyparaphenylene-3,4?-oxydiphenyleneterephthalic amide is 75 cN/dtex or more.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: August 14, 2012
    Assignees: Furukawa Electric Co., Ltd., Japan Agency for Marine-Earth Science and Technology
    Inventors: Yoshihiro Fujimoto, Katsuya Sakamoto, Tatsushi Fujimori, Hajime Izawa, Hiroyuki Osawa, Takashi Murashima, Kikuo Hashimoto
  • Publication number: 20100326038
    Abstract: A high-strength cable is a high-strength cable that has a twisted layer 21 of non-metallic reinforcing elements in outer coatings. Reinforcing elements 41 and 42 have coating elements 50 and 60, fiber elements 51 and 61 of copolyparaphenylene-3,4?-oxydiphenyleneterephthalic amide disposed in the coating elements 50 and 60, and filling materials 52 and 62 filled between the fiber elements, respectively. The lateral compression stress of the fiber elements 51 and 61 of the copolyparaphenylene-3,4?-oxydiphenyleneterephthalic amide is 75 cN/dtex or more.
    Type: Application
    Filed: February 18, 2009
    Publication date: December 30, 2010
    Applicants: FURUKAWA ELECTRIC CO., LTD., JAPAN AGENCY FOR MARINE-EARTH SCIENCE AND TECH.
    Inventors: Yoshihiro Fujimoto, Katsuya Sakamoto, Tatsushi Fujimori, Hajime Izawa, Hiroyuki Osawa, Takashi Murashima, Kikuo Hashimoto
  • Patent number: 7101255
    Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.
    Type: Grant
    Filed: June 10, 2005
    Date of Patent: September 5, 2006
    Assignee: Ebara Corporation
    Inventors: Seiji Katsuoka, Manabu Tsujimura, Kunihiko Sakurai, Hiroyuki Osawa
  • Publication number: 20060078321
    Abstract: A picture display device comprises a device main body, a covering body, a link mechanism, an operating protrusion, an opening and closing detecting switch and an control unit. The device main body restores and outputs a picture signal. The covering body has a picture display unit for displaying the picture signal from the device main body. The link mechanism couples the device main body and the covering body in a multi-axis manner and can be turned by orienting the covering body with respect to the device main body. The operating protrusion is formed on a face of the covering body. The opening and closing detecting switch can be pressed by the operating protrusion when the covering body is closed, causing the picture display unit to face the device main body. The control unit turns off the picture display unit when the switch is been operated.
    Type: Application
    Filed: October 6, 2005
    Publication date: April 13, 2006
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Hiroyuki Osawa, Tomoyoshi Furusawa
  • Patent number: 7011452
    Abstract: A rolling bearing with shield plate comprises an outer ring having an outer ring raceway and a circumferential anchor groove, the anchor groove provided at an axial end portion separated from the outer ring raceway and having an outside facing side surface, an inner ring having an inner ring raceway, a plurality of rolling members between the outer ring raceway and the inner ring raceway, and a shield plate in a generally circular ring shape provided with an inside facing, radially outer portion and an outer peripheral edge portion which is anchored in the anchor groove of the outer ring, the shield plate having an elastic seal member attached generally circumferentially and radially inner than the outer peripheral edge portion of the shield plate, such that the seal member is elastically held between the shield plate and the anchor groove.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: March 14, 2006
    Assignee: NSK Ltd.
    Inventors: Hironori Suzuki, Takamasa Itsu, Hiroyuki Osawa, Takahiko Uchiyama
  • Publication number: 20060015704
    Abstract: An operation apparatus includes signal lines, a decoder connected with the signal lines and configured to sequentially decode first and second instruction codes on the signal lines, an instruction executing section configured to execute operation processing based on each of the decoding results of the first and second instruction codes by the decoder, respectively, and an output unit connected with the signal lines and configured to continuously and sequentially output the first and second instruction codes onto the signal lines. Each of the first and second instruction codes comprises a first bit data and a second bit data. The first bit data of the first instruction code indicates that the first instruction code belongs to a first one of instruction code groups and at least a portion of the second bit data of the first instruction code indicates an instruction content of the first instruction code.
    Type: Application
    Filed: July 13, 2005
    Publication date: January 19, 2006
    Applicant: NEC Electronics Corporation
    Inventors: Hiroyuki Osawa, Ryuji Ishida
  • Patent number: 6984164
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.
    Type: Grant
    Filed: June 10, 2004
    Date of Patent: January 10, 2006
    Assignee: Ebara Corporation
    Inventors: Norio Kimura, Hideji Isobe, Kazuo Shimizu, Hiroyuki Osawa
  • Publication number: 20050227596
    Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.
    Type: Application
    Filed: June 10, 2005
    Publication date: October 13, 2005
    Inventors: Seiji Katsuoka, Manabu Tsujimura, Kunihiko Sakurai, Hiroyuki Osawa
  • Patent number: 6918814
    Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: July 19, 2005
    Assignee: Ebara Corporation
    Inventors: Seiji Katsuoka, Manabu Tsujimura, Kunihiko Sakurai, Hiroyuki Osawa
  • Publication number: 20040224613
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.
    Type: Application
    Filed: June 10, 2004
    Publication date: November 11, 2004
    Inventors: Norio Kimura, Hideji Isobe, Kazuo Shimizu, Hiroyuki Osawa
  • Publication number: 20040184690
    Abstract: A rolling bearing with shield plate comprises an outer ring having an outer ring raceway and a circumferential anchor groove, the anchor groove provided at an axial end portion separated from the outer ring raceway and having an outside facing side surface, an inner ring having an inner ring raceway, a plurality of rolling members between the outer ring raceway and the inner ring raceway, and a shield plate in a generally circular ring shape provided with an inside facing, radially outer portion and an outer peripheral edge portion which is anchored in the anchor groove of the outer ring, the shield plate having an elastic seal member attached generally circumferentially and radially inner than the outer peripheral edge portion of the shield plate, such that the seal member is elastically held between the shield plate and the anchor groove.
    Type: Application
    Filed: January 30, 2004
    Publication date: September 23, 2004
    Applicant: NSK Ltd.
    Inventors: Hironori Suzuki, Takamasa Itsu, Hiroyuki Osawa, Takahiko Uchiyama
  • Patent number: 6764381
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.
    Type: Grant
    Filed: March 17, 2003
    Date of Patent: July 20, 2004
    Assignee: Ebara Corporation
    Inventors: Norio Kimura, Hideji Isobe, Kazuo Shimizu, Hiroyuki Osawa
  • Publication number: 20030171071
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.
    Type: Application
    Filed: March 17, 2003
    Publication date: September 11, 2003
    Inventors: Norio Kimura, Hideji Isobe, Kazuo Shimizu, Hiroyuki Osawa
  • Patent number: 6558229
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: May 6, 2003
    Assignee: Ebara Corporation
    Inventors: Norio Kimura, Hideji Isobe, Kazuo Shimizu, Hiroyuki Osawa
  • Publication number: 20020191877
    Abstract: A rolling bearing with shield plate comprises an outer ring having an outer ring raceway and a circumferential anchor groove, the anchor groove provided at an axial end portion separated from the outer ring raceway and having an outside facing side surface, an inner ring having an inner ring raceway, a plurality of rolling members between the outer ring raceway and the inner ring raceway, and a shield plate in a generally circular ring shape provided with an inside facing, radially outer portion and an outer peripheral edge portion which is anchored in the anchor groove of the outer ring, the shield plate having an elastic seal member attached generally circumferentially and radially inner than the outer peripheral edge portion of the shield plate, such that the seal member is elastically held between the shield plate and the anchor groove.
    Type: Application
    Filed: February 14, 2000
    Publication date: December 19, 2002
    Inventors: Hironori Suzuki, Takamasa Itsu, Hiroyuki Osawa, Takahiko Uchiyama
  • Publication number: 20020124373
    Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.
    Type: Application
    Filed: May 16, 2002
    Publication date: September 12, 2002
    Inventors: Seiji Katsuoka, Manabu Tsujimura, Kunihiko Sakurai, Hiroyuki Osawa
  • Patent number: 6413146
    Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.
    Type: Grant
    Filed: October 30, 2001
    Date of Patent: July 2, 2002
    Assignee: Ebara Corporation
    Inventors: Seiji Katsuoka, Manabu Tsujimura, Kunihiko Sakurai, Hiroyuki Osawa
  • Publication number: 20020025764
    Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.
    Type: Application
    Filed: October 30, 2001
    Publication date: February 28, 2002
    Inventors: Seiji Katsuoka, Manabu Tsujimura, Kunihiko Sakurai, Hiroyuki Osawa
  • Patent number: 6332826
    Abstract: This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.
    Type: Grant
    Filed: September 8, 1999
    Date of Patent: December 25, 2001
    Assignee: Ebara Corporation
    Inventors: Seiji Katsuoka, Manabu Tsujimura, Kunihiko Sakurai, Hiroyuki Osawa