Patents by Inventor Hiroyuki SAKAUCHI

Hiroyuki SAKAUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION
    Publication number: 20210363342
    Abstract: A resin composition including (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, in which a chloride ion content included in the resin composition measured in accordance with a sample combustion ion chromatography method (BS EN 14532 2007) is 50 ppm or less.
    Type: Application
    Filed: August 9, 2021
    Publication date: November 25, 2021
    Applicant: AJINOMOTO CO., INC.
    Inventors: Hiroyuki SAKAUCHI, Minoru SASAKI, Mariko MIYOSHI
  • RESIN COMPOSITION
    Publication number: 20200283620
    Abstract: Resin compositions including (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, in which a chloride ion content included in the resin composition measured in accordance with a sample combustion ion chromatography method (BS EN 14582 2007) is 50 ppm or less are capable of forming a cured product having excellent adhesion with a conductive layer even after the HAST test.
    Type: Application
    Filed: March 5, 2020
    Publication date: September 10, 2020
    Applicant: AJINOMOTO CO., INC.
    Inventors: Hiroyuki SAKAUCHI, Minoru SASAKI, Mariko MIYOSHI
  • CURED PRODUCT AND PRODUCTION METHOD OF SAME, AND RESIN SHEET AND RESIN COMPOSITION
    Publication number: 20200231786
    Abstract: Cured products that are formed of a cured material obtained by curing a resin composition including (A) at least one epoxy resin, (B) at least one curing agent, and (C) at least one inorganic filler, and have a ground surface, in which the maximum depth of a depressed portion present on the ground surface is less than 10 ?m are useful for making printed wiring boards.
    Type: Application
    Filed: April 7, 2020
    Publication date: July 23, 2020
    Applicant: Ajinomoto Co., Inc.
    Inventor: Hiroyuki SAKAUCHI
  • RESIN COMPOSITION FOR USE IN RELEASE FILM
    Publication number: 20120175159
    Abstract: By incorporating an epoxy resin and aluminum hydroxide into a resin composition, it is possible to achieve a resin composition for use in a release film, which retains high bond strength after a build-up layer is cured, and which has excellent peel strength after being subjected to heating treatment for releasing.
    Type: Application
    Filed: January 6, 2012
    Publication date: July 12, 2012
    Applicant: AJINOMOTO CO. INC
    Inventors: Hiroyuki SAKAUCHI, Hiroshi Orikabe