Patents by Inventor Hiroyuki Shindo

Hiroyuki Shindo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230004811
    Abstract: A learning processing device and method achieves learning of a lightweight model that is completed in a short amount of time. The learning processing device obtains a new, second learning model from an existing first learning model. An input unit acquires a first learning model generated in advance by learning a first learning data set, and an unpruned neural network (hereinafter, NN). An important parameter identification unit uses the first learning model and the NN to initialize a NN to be learned, and uses a second learning data set and the initialized NN to identify a degree of importance of parameters in a recognition process of the initialized NN. A new model generation unit carries out a pruning process for deleting parameters which are not important from the initialized NN, thereby generating a second NN; and a learning unit uses the second learning data set to learn the second NN.
    Type: Application
    Filed: February 7, 2020
    Publication date: January 5, 2023
    Inventors: Masayoshi ISHIKAWA, Masanori OUCHI, Hiroyuki SHINDO, Yasutaka TOYODA, Shinichi SHINODA
  • Publication number: 20220414833
    Abstract: An inspection apparatus includes an image distortion estimation unit that estimates a distortion amount between a reference image and an inspection image, an image distortion correction unit that corrects the inspection image and/or the reference image using an estimated distortion amount, and an inspection unit that performs inspection using a corrected inspection image and the reference image or the inspection image and a corrected reference image. The image distortion estimation unit estimates a distortion amount in which only distortion occurring in an entire image can be corrected by adjustment of a correction condition.
    Type: Application
    Filed: May 20, 2022
    Publication date: December 29, 2022
    Inventors: Kosuke FUKUDA, Masayoshi ISHIKAWA, Yasuhiro YOSHIDA, Hiroyuki SHINDO
  • Publication number: 20220335594
    Abstract: Provided are a defect inspection apparatus and a defect inspection method that can inspect various types of defects in a synthesized image. The defect inspection apparatus synthesizes a first detection signal from a first detector and a second detection signal from a second detector with a first synthesis ratio to generate a first synthesized image, and synthesizes the first detection signal and the second detection signal with a second synthesis ratio different from the first synthesis ratio to generate a second synthesized image. The defect inspection apparatus generates a first inspection image based on the first synthesized image and generates a second inspection image based on the second synthesized image. The defect inspection apparatus executes a logical operation on the first inspection image and the second inspection image to generate a synthesized inspection image. The defect inspection apparatus executes defect determination on the synthesized inspection image.
    Type: Application
    Filed: April 8, 2022
    Publication date: October 20, 2022
    Inventors: Yasushi EBIZUKA, Hiroyuki SHINDO, Ryugo KAGETANI
  • Patent number: 11448663
    Abstract: This invention is directed to a pattern height information correction system which includes a contour line information of a pattern extracted from an acquired image including at least an AFM (atomic force microscope) module, a design information database that stores design information including at least layer information, and a computer system that divides the extracted pattern into regions based on the design information stored in the design information database relating to the extracted pattern and associates the divided regions with layer information, in which the computer system specifies a horizontal region designated as horizontal in advance from the divided regions, creates an approximated curved surface based on the specified horizontal region corresponding to the same layer information, and corrects height information of the extracted pattern using the approximated curved surface.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: September 20, 2022
    Assignee: Hitachi High-Tech Corporation
    Inventors: Kenji Yamasaki, Hiroyuki Shindo, Taeko Kashiwa, Ryugo Kagetani
  • Publication number: 20220036116
    Abstract: An object of the present invention is to achieve both suppression of data amount of an image processing system that learns a collation image to be used for image identification using a discriminator and improvement of identification performance of the discriminator. In order to achieve the above object, there is proposed an image processing system including a discriminator that identifies an image using a collation image, the image processing system further including a machine learning engine that performs machine learning of collation image data required for image identification. The machine learning engine searches for a successfully identified image using an image for which identification has been failed, and adds information, obtained based on a partial image of the image for which identification has been failed and which has been selected by an input device to the successfully identified image obtained by the search to generate corrected collation image data.
    Type: Application
    Filed: October 18, 2021
    Publication date: February 3, 2022
    Inventors: Shinichi SHINODA, Yasutaka TOYODA, Shigetoshi SAKIMURA, Masayoshi ISHIKAWA, Hiroyuki SHINDO, Hitoshi SUGAHARA
  • Publication number: 20210383524
    Abstract: A pattern inspection system inspects an image of an inspection target pattern of an electronic device using an identifier constituted by machine learning, based on the image of the inspection target pattern of the electronic device and data used to manufacture the inspection target pattern. The system includes a storage unit which stores a plurality of pattern images of the electronic device and pattern data used to manufacture a pattern of the electronic device, and an image selection unit which selects a learning pattern image used in the machine learning from the plurality of pattern images, based on the pattern data and the pattern image stored in the storage unit.
    Type: Application
    Filed: August 24, 2021
    Publication date: December 9, 2021
    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Shuyang DOU, Shinichi SHINODA, Yasutaka TOYODA, Hiroyuki SHINDO
  • Publication number: 20210374403
    Abstract: In order to select an optimal learning model for an image when inference is carried out in the extraction of a profile line using machine learning, without requiring a correct value or degree of certainty, a feature extraction learning model group containing a plurality of learning models is used for feature extraction. A recall learning model group containing recall learning models is paired with the feature extraction learning models. A feature amount extraction unit for referencing a feature extraction learning model and extracting a feature amount from input data; a data-to-data recall unit for referencing a recall learning model and outputting a recall result with the feature amount subjected to dimensional compression; and a learning model selection unit for selecting a feature extraction learning model from the feature extraction learning model group under the condition that the difference between the feature amount and the recall result is minimized are provided.
    Type: Application
    Filed: December 21, 2018
    Publication date: December 2, 2021
    Inventors: Ryou YUMIBA, Yasutaka TOYODA, Hiroyuki SHINDO
  • Patent number: 11176405
    Abstract: An object of the present invention is to achieve both suppression of data amount of an image processing system that learns a collation image to be used for image identification using a discriminator and improvement of identification performance of the discriminator. In order to achieve the above object, there is proposed an image processing system including a discriminator that identifies an image using a collation image, the image processing system further including a machine learning engine that performs machine learning of collation image data required for image identification. The machine learning engine searches for a successfully identified image using an image for which identification has been failed, and adds information, obtained based on a partial image of the image for which identification has been failed and which has been selected by an input device to the successfully identified image obtained by the search to generate corrected collation image data.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: November 16, 2021
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Shinichi Shinoda, Yasutaka Toyoda, Shigetoshi Sakimura, Masayoshi Ishikawa, Hiroyuki Shindo, Hitoshi Sugahara
  • Patent number: 11132788
    Abstract: A pattern inspection system inspects an image of an inspection target pattern of an electronic device using an identifier constituted by machine learning, based on the image of the inspection target pattern of the electronic device and data used to manufacture the inspection target pattern. The system includes a storage unit which stores a plurality of pattern images of the electronic device and pattern data used to manufacture a pattern of the electronic device, and an image selection unit which selects a learning pattern image used in the machine learning from the plurality of pattern images, based on the pattern data and the pattern image stored in the storage unit.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: September 28, 2021
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Shuyang Dou, Shinichi Shinoda, Yasutaka Toyoda, Hiroyuki Shindo
  • Patent number: 10989794
    Abstract: Scanning optical system, comprising a rotatable mirror unit including first and second mirror surfaces each inclining relative to a rotation axis, and a light projecting system including a light source which emits light flux toward an object through the mirror unit. The light flux is reflected on the first mirror surface, then to the second mirror surface, and projected so as to scan on the object correspondingly to rotation of the mirror unit. The mirror unit includes multiples pairs of the first and second mirror surfaces, and the respective intersection angles of the multiples pairs are different from each other. In one rotation of the mirror unit, light flux emitted from the light source is reflected on the second mirror surfaces, and is projected sequentially, thereby to scan a measurement range in which the object is measured. Length in a sub scanning direction of the light flux and intersection angles of the multiples pairs correspond to length in a sub scanning direction of the measurement range.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: April 27, 2021
    Assignee: Konica Minolta, Inc.
    Inventors: Ryouta Ishikawa, Hiroyuki Matsuda, Masashi Kageyama, Junichiro Yonetake, Hideyuki Fujii, Hiroyuki Shindo
  • Publication number: 20210080485
    Abstract: This invention is directed to a pattern height information correction system which includes a contour line information of a pattern extracted from an acquired image including at least an AFM (atomic force microscope) module, a design information database that stores design information including at least layer information, and a computer system that divides the extracted pattern into regions based on the design information stored in the design information database relating to the extracted pattern and associates the divided regions with layer information, in which the computer system specifies a horizontal region designated as horizontal in advance from the divided regions, creates an approximated curved surface based on the specified horizontal region corresponding to the same layer information, and corrects height information of the extracted pattern using the approximated curved surface.
    Type: Application
    Filed: August 4, 2020
    Publication date: March 18, 2021
    Inventors: Kenji YAMASAKI, Hiroyuki SHINDO, Taeko KASHIWA, Ryugo KAGETANI
  • Patent number: 10937146
    Abstract: The image evaluation device includes a design data image generation unit that images design data; a machine learning unit that creates a model for generating a design data image from an inspection target image, using the design data image as a teacher and using the inspection target image corresponding to the design data image; a design data prediction image generation unit that predicts the design data image from the inspection target image, using the model created by the machine learning unit; a design data image generation unit that images the design data corresponding to the inspection target image; and a comparison unit that compares a design data prediction image generated by the design data prediction image generation unit and the design data image. As a result, it is possible to detect a systematic defect without using a defect image and generating misinformation frequently.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: March 2, 2021
    Assignee: Hitachi High-Tech Corporation
    Inventors: Shinichi Shinoda, Masayoshi Ishikawa, Yasutaka Toyoda, Yuichi Abe, Hiroyuki Shindo
  • Patent number: 10718611
    Abstract: The present invention provides a semiconductor evaluation device for fabricating a suitable reference pattern utilized in comparison tests. The semiconductor evaluation device and computer program extract a process window in a more accurate range based on a two-dimensional evaluation of the pattern. In order to achieve the above described objects, the present invention includes a semiconductor evaluation device that measures the dimensions of the pattern formed over the sample based on a signal obtained by way of a charged particle beam device, selects a pattern whose dimensional measurement results satisfy specified conditions or exposure conditions when the pattern is formed, and forms synthesized contour data, by synthesizing contour data obtained from images of an identically shaped pattern in design data, and also a pattern formed under the selected exposure conditions or a pattern having a positional relation that is already known relative to the selected pattern.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: July 21, 2020
    Assignee: Hitachi High-Tech Corporation
    Inventors: Asuka Honda, Hiroyuki Shindo
  • Publication number: 20200134355
    Abstract: An object of the present invention is to achieve both suppression of data amount of an image processing system that learns a collation image to be used for image identification using a discriminator and improvement of identification performance of the discriminator. In order to achieve the above object, there is proposed an image processing system including a discriminator that identifies an image using a collation image, the image processing system further including a machine learning engine that performs machine learning of collation image data required for image identification. The machine learning engine searches for a successfully identified image using an image for which identification has been failed, and adds information, obtained based on a partial image of the image for which identification has been failed and which has been selected by an input device to the successfully identified image obtained by the search to generate corrected collation image data.
    Type: Application
    Filed: March 15, 2018
    Publication date: April 30, 2020
    Inventors: Shinichi SHINODA, Yasutaka TOYODA, Shigetoshi SAKIMURA, Masayoshi ISHIKAWA, Hiroyuki SHINDO, Hitoshi SUGAHARA
  • Publication number: 20200074611
    Abstract: A pattern inspection system inspects an image of an inspection target pattern of an electronic device using an identifier constituted by machine learning, based on the image of the inspection target pattern of the electronic device and data used to manufacture the inspection target pattern. The system includes a storage unit which stores a plurality of pattern images of the electronic device and pattern data used to manufacture a pattern of the electronic device, and an image selection unit which selects a learning pattern image used in the machine learning from the plurality of pattern images, based on the pattern data and the pattern image stored in the storage unit.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 5, 2020
    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Shuyang DOU, Shinichi SHINODA, Yasutaka TOYODA, Hiroyuki SHINDO
  • Publication number: 20200033122
    Abstract: The present invention is intended to provide a pattern evaluation apparatus and a computer program aimed at achieving defect inspection with high efficiency and high precision while allowing manufacturing variations that are dissimilar depending on the sites of a circuit. In order to achieve the above object, proposed are a computer program and an inspection system having a means of performing statistical processing of measurement data of a plurality of inspection target patterns having similar or same design pattern shape used for manufacturing the inspection target patterns, and performing adjustment of a defect determination threshold in accordance with a distribution state of measurement data.
    Type: Application
    Filed: August 4, 2017
    Publication date: January 30, 2020
    Inventors: Yasutaka TOYODA, Hiroyuki SHINDO
  • Patent number: 10445875
    Abstract: A pattern-measuring apparatus and a semiconductor-measuring system are provided which are able to obtain an evaluation result for suitably selecting processing with respect to a semiconductor device. In particular, there is proposed a pattern-measuring apparatus including an arithmetic device which compares a circuit pattern of an electronic device with a reference pattern, in which the arithmetic device classifies the circuit pattern in processing unit of the circuit pattern on the basis of a comparison of a measurement result between the circuit pattern and the reference pattern with at least two threshold values.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: October 15, 2019
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Yasutaka Toyoda, Norio Hasegawa, Takeshi Kato, Hitoshi Sugahara, Yutaka Hojo, Daisuke Hibino, Hiroyuki Shindo
  • Publication number: 20190228522
    Abstract: The image evaluation device includes a design data image generation unit that images design data; a machine learning unit that creates a model for generating a design data image from an inspection target image, using the design data image as a teacher and using the inspection target image corresponding to the design data image; a design data prediction image generation unit that predicts the design data image from the inspection target image, using the model created by the machine learning unit; a design data image generation unit that images the design data corresponding to the inspection target image; and a comparison unit that compares a design data prediction image generated by the design data prediction image generation unit and the design data image. As a result, it is possible to detect a systematic defect without using a defect image and generating misinformation frequently.
    Type: Application
    Filed: January 18, 2019
    Publication date: July 25, 2019
    Inventors: Shinichi SHINODA, Masayoshi ISHIKAWA, Yasutaka TOYODA, Yuichi ABE, Hiroyuki SHINDO
  • Publication number: 20190056481
    Abstract: Scanning optical system, comprising a rotatable mirror unit including first and second mirror surfaces each inclining relative to a rotation axis, and a light projecting system including a light source which emits light flux toward an object through the mirror unit. The light flux is reflected on the first mirror surface, then to the second mirror surface, and projected so as to scan on the object correspondingly to rotation of the mirror unit. The mirror unit includes multiples pairs of the first and second mirror surfaces, and the respective intersection angles of the multiples pairs are different from each other. In one rotation of the mirror unit, light flux emitted from the light source is reflected on the second mirror surfaces, and is projected sequentially, thereby to scan a measurement range in which the object is measured. Length in a sub scanning direction of the light flux and intersection angles of the multiples pairs correspond to length in a sub scanning direction of the measurement range.
    Type: Application
    Filed: August 21, 2018
    Publication date: February 21, 2019
    Inventors: Ryouta ISHIKAWA, Hiroyuki MATSUDA, Masashi KAGEYAMA, Junichiro YONETAKE, Hideyuki FUJII, Hiroyuki SHINDO
  • Patent number: 10078132
    Abstract: The present invention provides a scanning optical system and radar that can suppress longitudinal distortion and spot rotation of a spot light radiated on an object. A light flux emitted from a light source is reflected on a first mirror surface of a mirror unit, then, proceeds to a second mirror surface, further is reflected on the second mirror surface, and is projected so as to scan on an object correspondingly to rotation of the mirror unit. The light flux emitted from the light projecting system is made longer in a sub scanning angle direction than in a scanning angle direction in a measurement range of the object and satisfies the following conditional expression, |?1?90|×|?|?255 . . . (1); in the expression, ?1 is an intersection angle (°) between the first mirror surface and the second mirror surface, and ? is a rotation angle (°).
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: September 18, 2018
    Assignee: Konica Minolta, Inc.
    Inventors: Ryouta Ishikawa, Hiroyuki Matsuda, Masashi Kageyama, Junichiro Yonetake, Hideyuki Fujii, Hiroyuki Shindo