Patents by Inventor Hiroyuku Nishimura

Hiroyuku Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100065316
    Abstract: Disclosed is a printed wiring board which attains aims of printed wiring boards required for realizing high-speed, high-frequency semiconductor devices, namely a printed wiring board having low dielectric constant, low dielectric loss tangent and low linear expansion coefficient. Also disclosed is a composite woven fabric suitably used as a base material for such a printed wiring board. Specifically disclosed is a composite woven fabric containing quartz glass fibers and polyolefin fibers, in which the ratio of the quartz glass fibers to the composite woven fabric is set at 10 vol % or more and 90 vol % or less. It is preferred that the quartz glass fibers each have a filament diameter of 3 ?m or more and 16 ?m or less, and the composite woven fabric has a thickness of 200 ?m or less.
    Type: Application
    Filed: November 7, 2007
    Publication date: March 18, 2010
    Inventors: Akira Sato, Akira Fujinoki, Hiroyuku Nishimura, Tsukasa Sakaguchi