Patents by Inventor Hisahiro IKEDA

Hisahiro IKEDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reflow device and method for manufacturing substrate using the reflow device
    Patent number: 11090751
    Abstract: A reflow device configured to perform reflow soldering on a substrate having a first component and a second component having a heat capacity larger than a heat capacity of the first component. The reflow device includes a plurality of heating sections applying gas to the substrate, a booth accommodating the heating sections, and a controller configured to perform, at least twice or more times, a heating control of controlling the heating sections to increase both of a temperature of the first component and a temperature of the second component, and then reduce the temperature of the first component while increasing the temperature of the second component.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: August 17, 2021
    Assignee: DENSO CORPORATION
    Inventors: Masayasu Yamamoto, Atsushi Furumoto, Masato Kamino, Hisahiro Ikeda, Hiroki Kamiya
  • REFLOW DEVICE AND METHOD FOR MANUFACTURING SUBSTRATE USING THE REFLOW DEVICE
    Publication number: 20190262924
    Abstract: A reflow device configured to perform reflow soldering on a substrate having a first component and a second component having a heat capacity larger than a heat capacity of the first component. The reflow device includes a plurality of heating sections applying gas to the substrate, a booth accommodating the heating sections, and a controller configured to perform, at least twice or more times, a heating control of controlling the heating sections to increase both of a temperature of the first component and a temperature of the second component, and then reduce the temperature of the first component while increasing the temperature of the second component.
    Type: Application
    Filed: May 9, 2019
    Publication date: August 29, 2019
    Inventors: Masayasu YAMAMOTO, Atsushi FURUMOTO, Masato KAMINO, Hisahiro IKEDA, Hiroki KAMIYA