Patents by Inventor Hisamitsu Yamamoto

Hisamitsu Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150072070
    Abstract: A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: C4H9—(OC2H4)m—OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: C4H9—(OC3H6)n—OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.
    Type: Application
    Filed: September 5, 2014
    Publication date: March 12, 2015
    Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Masayuki UTSUMI, Takuya OKAMACHI, Takuya KOMEDA
  • Publication number: 20140339463
    Abstract: The present invention provides a desmear solution and a desmear method using said desmear solution, the desmear solution being capable of certainly removing a smear inside a non-through hole formed in a resin substrate and also capable of forming a plating film excellent in adhesion without excessive roughening of a surface of the resin substrate. The present invention uses the desmear solution containing a permanganate having a concentration of 0.2 to 0.4 mol/L and an alkali metal hydroxide and having a molar concentration ratio of said permanganate to said alkali metal hydroxide of 1:5 to 1:20.
    Type: Application
    Filed: September 11, 2012
    Publication date: November 20, 2014
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Yoshikazu Saijo, Hisamitsu Yamamoto, Masayuki Utsumi
  • Patent number: 8877020
    Abstract: An anode pipe includes a main pipe portion and a secondary pipe portion. The anode pipe has an inner circumferential surface that functions as an anode. The main pipe portion has a first connection end portion and a second connection end portion. The main pipe portion forms a flow channel for a treatment liquid that continues from the first connection end portion to the second connection end portion. The secondary pipe portion extends in a tubular fashion from the intermediate section of the main pipe portion. The interior of the secondary pipe portion communicates with the flow channel inside the main pipe portion. The cathode is disposed at a distance from the inner circumferential surface of the anode pipe. The cathode extends from a cathode attachment end portion toward the main pipe portion inside the secondary pipe portion.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: November 4, 2014
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Hisamitsu Yamamoto, Masayuki Utsumi, Yoshikazu Saijo, Tomoji Okuda, Hiroki Omura
  • Patent number: 8828131
    Abstract: Disclosed is a catalyst application solution for plating an insulating portion of an object to be plated that comprises the insulating portion. The catalyst application solution is characterized by containing a water-soluble palladium compound, a reducer, a dispersant, catechol, a copper antioxidant and a buffering agent, and by having a pH of not less than 4.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: September 9, 2014
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Hisamitsu Yamamoto, Tetsuji Ishida
  • Publication number: 20140116334
    Abstract: An tank such as an electroless copper plating tank 200, includes a liquid squirting part 4 having a squirt port 6 for squirting the processing solution Q from the squirt port 6 toward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like work 10 so that the processing solution Q runs down the plate-like work 10.
    Type: Application
    Filed: September 26, 2013
    Publication date: May 1, 2014
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Teruyuki HOTTA, Hisamitsu YAMAMOTO, Takahiro ISHIZAKI, Masayuki UTSUMI, Takuya OKAMACHI, Syunsaku HOSHI, Fujio ASA, Junji MIZUMOTO
  • Publication number: 20140053774
    Abstract: A tank body 100 includes a liquid receiving part 2 for receiving processing solution Q applied to a plate-like work 10 and a liquid retaining part 4 for retaining liquids to be applied to the plate-like work 10 and a liquid outflowing part 6 for causing a flow of the processing solution Q which is spilled out of the liquid retaining part 4 and traveled down toward the plate-like work 10, wherein a tip 6a of the liquid outflowing part 6 is projected from a connecting part 5 connecting to the liquid retaining part 4 (or the liquid receiving part 2).
    Type: Application
    Filed: July 26, 2013
    Publication date: February 27, 2014
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Teruyuki HOTTA, Hisamitsu YAMAMOTO, Masayuki UTSUMI, Takahiro ISHIZAKI
  • Publication number: 20120298505
    Abstract: An anode pipe includes a main pipe portion and a secondary pipe portion. The anode pipe has an inner circumferential surface that functions as an anode. The main pipe portion has a first connection end portion and a second connection end portion. The main pipe portion forms a flow channel for a treatment liquid that continues from the first connection end portion to the second connection end portion. The secondary pipe portion extends in a tubular fashion from the intermediate section of the main pipe portion. The interior of the secondary pipe portion communicates with the flow channel inside the main pipe portion. The cathode is disposed at a distance from the inner circumferential surface of the anode pipe. The cathode extends from a cathode attachment end portion toward the main pipe portion inside the secondary pipe portion.
    Type: Application
    Filed: May 23, 2012
    Publication date: November 29, 2012
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Hisamitsu YAMAMOTO, Masayuki UTSUMI, Yoshikazu SAIJO, Tomoji OKUDA, Hiroki OMURA
  • Patent number: 8276270
    Abstract: The present invention is directed to a method for manufacturing a printed circuit board in which a plurality of conductive layers forming a wiring pattern are laminated in the state where they are put between insulating layers, and a printed circuit board formed thereby. The printed circuit board manufacturing method for the present invention includes a step of forming a via fill (17) to allow electroless plating liquid to be in contact with the surface of the wiring pattern exposed to a bottom part of a via hole (14) formed at a insulating layer to laminate plating metallic film from the bottom part to a opening part of the via hole (14), to form the via fill (17), and a step of forming a wiring pattern to form electroless plating metallic film (20) serving as the wiring pattern onto a substrate where the via fill (17) is formed.
    Type: Grant
    Filed: April 22, 2008
    Date of Patent: October 2, 2012
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Teruyuki Hotta, Shushi Morimoto, Takahiro Ishizaki, Hisamitsu Yamamoto
  • Publication number: 20120171363
    Abstract: Disclosed is a catalyst application solution for plating an insulating portion of an object to be plated that comprises the insulating portion. The catalyst application solution is characterized by containing a water-soluble palladium compound, a reducer, a dispersant, catechol, a copper antioxidant and a buffering agent, and by having a pH of not less than 4.
    Type: Application
    Filed: August 5, 2010
    Publication date: July 5, 2012
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Hisamitsu Yamamoto, Tetsuji Ishida
  • Publication number: 20120167916
    Abstract: Disclosed is a neutralizing/reducing agent for neutralizing/reducing an oxidizing agent component that is adsorbed and remains on an object to be coated after the object is subjected to a desmear treatment with the oxidizing agent, which comprises a thioamide compound and a non-aromatic thiol compound. The neutralizing/reducing agent does not generate any gas during a neutralization/reduction treatment, and therefore the occurrence of defects caused by the neutralization/reduction on the surface of a through hole or a blind via hole can be prevented. Further, the neutralizing/reducing agent hardly dissolves copper, and therefore the occurrence of haloing can be prevented, and the blistering caused by the etching between an inner layer copper and a resin with the neutralizing/reducing agent can also be prevented.
    Type: Application
    Filed: September 24, 2010
    Publication date: July 5, 2012
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Yoshikazu Saijo, Hisamitsu Yamamoto, Masayuki Utsumi
  • Publication number: 20120048728
    Abstract: The regeneration unit includes a tubular portion having the inner circumferential surface functioning as an anode, and a cathode provided inside the tubular portion and extending along the extension direction of the tubular portion in a state of separation from the inner circumferential surface. The treatment liquid used for desmearing treatment is fed through a gap between the inner circumferential surface of the tubular portion and the cathode. A feed-side conduit is connected by a downstream end portion thereof to the tubular portion and guides the treatment liquid discharged from a desmearing treatment tank into a regeneration unit. A return-side conduit is connected by an upstream end portion thereof to the tubular portion and guides the treatment liquid discharged from the regeneration unit into the desmearing treatment tank.
    Type: Application
    Filed: August 26, 2011
    Publication date: March 1, 2012
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Takahiro ISHIZAKI
  • Publication number: 20100181104
    Abstract: The present invention is directed to a method for manufacturing a printed circuit board in which a plurality of conductive layers forming a wiring pattern are laminated in the state where they are put between insulating layers, and a printed circuit board formed thereby. The printed circuit board manufacturing method for the present invention includes a step of forming a via fill (17) to allow electroless plating liquid to be in contact with the surface of the wiring pattern exposed to a bottom part of a via hole (14) formed at a insulating layer to laminate plating metallic film from the bottom part to a opening part of the via hole (14), to form the via fill (17), and a step of forming a wiring pattern to form electroless plating metallic film (20) serving as the wiring pattern onto a substrate where the via fill (17) is formed.
    Type: Application
    Filed: April 22, 2008
    Publication date: July 22, 2010
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Teruyuki Hotta, Shushi Morimoto, Takahiro Ishizaki, Hisamitsu Yamamoto
  • Publication number: 20100059386
    Abstract: A surface of an object to be plated is subjected to a treatment for palladium catalyst impartation to impart a palladium catalyst to the surface of an insulating part thereof. A palladium conductor layer is formed on the insulating part from a solution for palladium conductor layer formation which contains a palladium compound, an amine compound, and a reducing agent. On the palladium conductor layer is then directly formed a copper deposit by electroplating. Thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline. Consequently, the polyimide is prevented from being attacked and no adverse influence is exerted on adhesion. By adding an azole compound to the solution for palladium conductor layer formation, a palladium conductor layer is prevented from depositing on copper.
    Type: Application
    Filed: November 6, 2006
    Publication date: March 11, 2010
    Inventor: Hisamitsu Yamamoto