Patents by Inventor Hisashi Arai

Hisashi Arai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11378046
    Abstract: A fuel supply apparatus mounted in a fuel tank has a fuel pump portion for sucking a fuel stored in the fuel tank and then discharging the fuel to the outside. The fuel supply apparatus includes a harness that is connected with an external power source; a power-sending connector portion a power-sending connector portion that is provided in a harness and has power-sending terminals having respective spring portions, a power-receiving connector portion that is provided in a fuel pump portion and has power-receiving terminals to be connected with the power-sending terminals, respectively, when contact pressure based on elastic force of the spring portions, as elastic portions, is provided thereto, and an insulator that covers at least base portions of the power-receiving terminals and at least parts of the spring portions of the power-sending terminals when the power-receiving terminals are connected with the power-sending terminals.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: July 5, 2022
    Assignees: Mitsubishi Electric Coporation, YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Atsushi Tsuda, Minoru Takata, Kenji Kubo, Hideto Arai, Hisashi Machida
  • Publication number: 20220104510
    Abstract: There is provided a novel method for suppressing coloration of an oil and fat composition when a food ingredient is fried using the oil and fat composition. This method includes a step for adding a preparation oil to an edible oil and fat, and is such that: the preparation oil is a substance that has been subjected, in a step for refining a crude raw oil obtained from olives serving as an oilseed raw material, to (1) an optionally implemented neutralization step, (2) an optionally implemented bleaching step, and (3) an optionally implemented deodorization step in the stated order, without a degumming step having been implemented, where at least one of the (2) bleaching step and the (3) deodorization step is implemented; and an absorbance difference of the preparation oil is 0.05 or more, the absorbance difference being obtained by subtracting the absorbance at a wavelength of 750 nm from the absorbance at a wavelength of 660 nm, with isooctane used as a control.
    Type: Application
    Filed: February 4, 2020
    Publication date: April 7, 2022
    Inventors: Masayoshi SAKAINO, Naruto MAKITA, Hisashi ARAI, Yousuke SAWARAGI, Shun MATSUZAWA, Takashi SANO
  • Patent number: 11118132
    Abstract: [Problem] To provide: a method for suppressing the coloration of oils and fats during frying; and a coloring inhibitor. [Solution] A method for suppressing the coloration of an oil/fat composition for frying, the method comprising a step for adding a prepared oil to an edible oil or fat, wherein the prepared oil is obtained through (1) a degumming step, (2) a neutralization step which may or may not be performed, (3) a bleaching step which may or may not be performed, and (4) a deodorizing step, in this order, in the process of refining a crude oil obtained from an oil feedstock, and the absorbance difference determined by subtracting the absorbance at a wavelength of 750 nm from the absorbance at a wavelength of 660 nm of the prepared oil obtained from step (3) is at least 0.030 when isooctane is used as the control. A coloring inhibitor characterized by containing said prepared oil.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: September 14, 2021
    Assignee: J -OIL MILLS, INC.
    Inventors: Masayoshi Sakaino, Ryuji Hori, Hisashi Arai, Naruto Makita, Ryo Okabe, Takashi Sano
  • Publication number: 20210051971
    Abstract: [Problem] To provide: a method for improving the stability of an oil or fat composition for frying use by preventing the coloration of the oil or fat composition and also preventing the increase in an anisidine value and the decrease in the content of a tocopherol compound in the oil or fat composition when a food material is fried with the oil or fat composition; and a stabilizer for an oil or fat composition for frying use. [Solution] A method for stabilizing an oil or fat composition for frying use according to the present invention is characterized in that a chlorophyll compound is added at a concentration of 0.05 to 2 ppm by mass inclusive to an edible oil or fat. It is preferred that the chlorophyll compound is added in the form of a chlorophyll compound-rich solution having a chlorophyll compound concentration of 1 to 1,000 ppm by mass inclusive. A stabilizer for an oil or fat composition for frying use according to the present invention contains a chlorophyll compound as an active ingredient.
    Type: Application
    Filed: January 21, 2019
    Publication date: February 25, 2021
    Inventors: Yosuke SAWARAGI, Ryuji HORI, Masayoshi SAKAINO, Naruto MAKITA, Hisashi ARAI, Shigeo TAKEUCHI
  • Publication number: 20210054304
    Abstract: [Problem] To provide: a method for suppressing the coloration of oils and fats during frying; and a coloring inhibitor. [Solution] A method for suppressing the coloration of an oil/fat composition for frying, the method comprising a step for adding a prepared oil to an edible oil or fat, wherein the prepared oil is obtained through (1) a degumming step, (2) a neutralization step which may or may not be performed, (3) a bleaching step which may or may not be performed, and (4) a deodorizing step, in this order, in the process of refining a crude oil obtained from an oil feedstock, and the absorbance difference determined by subtracting the absorbance at a wavelength of 750 nm from the absorbance at a wavelength of 660 nm of the prepared oil obtained from step (3) is at least 0.030 when isooctane is used as the control. A coloring inhibitor characterized by containing said prepared oil.
    Type: Application
    Filed: January 21, 2019
    Publication date: February 25, 2021
    Inventors: Masayoshi SAKAINO, Ryuji HORI, Hisashi ARAI, Naruto MAKITA, Ryo OKABE, Takashi SANO
  • Publication number: 20210045402
    Abstract: [Problem] To provide: a method for suppressing an increase in the anisidine value and a decrease in the amount of tocopherols in a fats and oils composition during frying; an inhibitor for suppressing an increase in the anisidine value; and an inhibitor for suppressing a decrease in the amount of tocopherols.
    Type: Application
    Filed: January 21, 2019
    Publication date: February 18, 2021
    Inventors: Masayoshi SAKAINO, Naruto MAKITA, Ryuji HORI, Hisashi ARAI, Ryo OKABE, Takashi SANO
  • Patent number: 7334238
    Abstract: The present invention includes a frame, an optical pick-up module fixed to the frame and a circuit board forming a control circuit fixed to the frame. The frame has fixing parts to other members.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: February 19, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yuji Tanaka, Kazuo Matsumoto, Takeshi Watanabe, Masanobu Aramaki, Hidetaka Taguchi, Shingo Sagata, Yuichi Uchikawa, Takashi Morishita, Fumihide Maeda, Masanari Esaki, Hirohisa Koizumi, Shinichi Tokumaru, Hiroki Kokubu, Hisashi Arai, Takeshi Sugimoto
  • Publication number: 20080037408
    Abstract: The present invention includes a frame, an optical pick-up module fixed to the frame and a circuit board forming a control circuit fixed to the frame. The frame has fixing parts to other members.
    Type: Application
    Filed: August 24, 2007
    Publication date: February 14, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Yuji TANAKA, Kazuo Matsumoto, Takeshi Watanabe, Masanobu Aramaki, Hidetaka Taguchi, Shingo Sagata, Yuichi Uchikawa, Takashi Morishita, Fumihide Maeda, Masanari Esaki, Hirohisa Koizumi, Shinichi Tokumaru, Hiroki Kokubu, Hisashi Arai, Takeshi Sugimoto
  • Patent number: 7087457
    Abstract: A die bonding method and apparatus that performs bonding position detection and bonding inspection without lowering the productivity, in which after a bonding head has bonded a semiconductor chip to an island, the bonding head is moved to a wafer to pick up a semiconductor chip and is returned to the island; and during this period, an island used for bonding inspection (that is the island on which bonding has just been performed) and an island used for position detection (that is the island on which bonding is to be done next) are imaged by a camera in the same visual field, and inspection of the bonding conditions of the island used for inspection and detection of the position of the island used for position detection are performed based on the acquired image data.
    Type: Grant
    Filed: February 5, 2004
    Date of Patent: August 8, 2006
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Yoshiyuki Ogata, Hisashi Arai
  • Publication number: 20040223447
    Abstract: The present invention includes a frame, an optical pick-up module fixed to the frame and a circuit board forming a control circuit fixed to the frame. The frame has fixing parts to other members.
    Type: Application
    Filed: April 20, 2004
    Publication date: November 11, 2004
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Yuji Tanaka, Kazuo Matsumoto, Takeshi Watanabe, Masanobu Aramaki, Hidetaka Taguchi, Shingo Sagata, Yuichi Uchikawa, Takashi Morishita, Fumihide Maeda, Masanari Esaki, Hirohisa Koizumi, Shinichi Tokumaru, Hiroki Kokubu, Hisashi Arai, Takeshi Sugimoto
  • Publication number: 20040157368
    Abstract: A die bonding method and apparatus that performs bonding position detection and bonding inspection without lowering the productivity, in which after a bonding head has bonded a semiconductor chip to an island, the bonding head is moved to a wafer to pick up a semiconductor chip and is returned to the island; and during this period, an island used for bonding inspection (that is the island on which bonding has just been performed) and an island used for position detection (that is the island on which bonding is to be done next) are imaged by a camera in the same visual field, and inspection of the bonding conditions of the island used for inspection and detection of the position of the island used for position detection are performed based on the acquired image data.
    Type: Application
    Filed: February 5, 2004
    Publication date: August 12, 2004
    Applicant: Kabushiki Kaisha Shinkawa
    Inventors: Yoshiyuki Ogata, Hisashi Arai
  • Patent number: 6070780
    Abstract: A bonding device equipped with a heating block for heating, for instance, a lead frame upon which bonding is performed including vacuum suction nozzles, which are installed above the heating block so as to lift the lead frame, and an air-cylinder, which raises and lowers the vacuum suction nozzles. The lead frame is lifted from the heating block by the vacuum suction nozzles, thus being prevented from being overly heated by the heating block.
    Type: Grant
    Filed: December 30, 1997
    Date of Patent: June 6, 2000
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Masayuki Shimura, Hisashi Arai, Masaki Okawara
  • Patent number: 6059846
    Abstract: A device for inspecting a high loop of a wire bonded on, for instance, a lead frame including a frame carrying stand, which guides and supports a lead frame, and an inspection roller, which is installed directly above the frame carrying stand. The inspection roller has frame pressing parts made as an insulating part so as to press the side portions of the lead frame against the frame carrying stand 31; and the inspection roller further has a wire detection part made as conductive parts provided between the frame pressing ring. A step or height difference between the frame pressing parts and the wire detection part is formed so as to be equal to the upper-limit value of the maximum height of wire loops formed by the bonded wire, and high loops that exceed the upper-limit value are detected by way of an electric current that flows when the wire detection part contacts the bonded wire.
    Type: Grant
    Filed: March 17, 1998
    Date of Patent: May 9, 2000
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Hisashi Arai, Masaru Inomata, Masayuki Shimura
  • Patent number: 5651492
    Abstract: A heating device used in a bonding apparatus including a cover which is provided on a heating body so as to cover a guide groove which guides lead frames; and gas grooves are formed in the heating body so as to run along the guide groove, and an inert gas is supplied into the gas grooves so that the inert gas prevents the entry of air from the joining surfaces of the heating body and cover.
    Type: Grant
    Filed: September 17, 1996
    Date of Patent: July 29, 1997
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Hisashi Arai, Nobuharu Moriya