Patents by Inventor Hisashi Kato

Hisashi Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200373327
    Abstract: A method of producing a semiconductor memory device includes, when three directions crossing each other are set to first, second, and third directions, respectively, laminating a plurality of first laminates and a plurality of second laminates on a semiconductor substrate in the third direction. The method further includes forming ends of the plurality of first laminates in shapes of steps extending in the first direction, and forming ends of the plurality of second laminates in shapes of steps extending in both directions of the first direction and the second direction.
    Type: Application
    Filed: August 14, 2020
    Publication date: November 26, 2020
    Applicant: Toshiba Memory Corporation
    Inventors: Tadashi IGUCHI, Murato Kawai, Toru Matsuda, Hisashi Kato, Megumi Ishiduki
  • Publication number: 20200348893
    Abstract: A mobile terminal device executes an OS including a printing system that supports a first search protocol and a printing function using a first printing method as a standard. If instructions for the use of the printing system included in the OS are provided by the user, the mobile terminal device receives a message conforming to the first search protocol from a printer that has been newly detected via the first search protocol. In a case where the detected printer has been selected, if the printer is determined not to conform to the first printing method based on the contents of the received message, the mobile terminal device activates a function for downloading a plug-in that supports the printer.
    Type: Application
    Filed: July 20, 2020
    Publication date: November 5, 2020
    Inventor: Hisashi Kato
  • Publication number: 20200342095
    Abstract: A classification unit classifies, per attack log data of a plurality of pieces of attack log data, one or more pieces of log information included in the attack log data, by value set consisting of a value of a first element and a value of a second element, thereby generating one or more log information groups. An integration unit integrates, per log information group, one or more pieces of log information included in the log information group, thereby generating integrated data. An extraction unit extracts, per value set, in one or more value sets, that is common among the plurality of pieces of attack log data, common information from a plurality of pieces of integrated data corresponding to the plurality of pieces of attack log data. A generation unit generates one or more attack detection rules based on one or more pieces of common information.
    Type: Application
    Filed: June 21, 2018
    Publication date: October 29, 2020
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hideaki IJIRO, Kiyoto KAWAUCHI, Takuya SHOYA, Atsushi KATO, Hiromitsu SHIRAI, Hisashi FUKUDA
  • Patent number: 10790229
    Abstract: A semiconductor memory device according to an embodiment includes a substrate; a plate-like first conductivity layer provided above the substrate and extending parallel to a substrate plane to bestride first and second regions; a plate-like second conductivity layer provided above the first conductivity layer to be separated from the first conductivity layer, an end portion of the first conductivity layer has a protruding staircase shape in the first region, the second conductivity layer extending parallel to the first conductivity layer to bestride the first and second regions; a first contact connected to the first conductivity layer at a side surface or a bottom surface of the first conductivity layer and extending from the first conductivity layer toward the substrate, the first contact being connected at a position where the end portion of the first conductivity layer in the first region protrudes, and a diameter size of a portion of the first contact connected at a side surface or a bottom surface of th
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: September 29, 2020
    Assignee: Toshiba Memory Corporation
    Inventors: Kenta Yoshinaga, Hideki Inokuma, Hisashi Kato, Masakazu Sawano
  • Publication number: 20200303300
    Abstract: According to one embodiment, a semiconductor memory device includes first and second conductor layers, a first pillar, a first contact, and a source line drive circuit. The first pillar is passing through the second conductor layers. The first pillar includes a first semiconductor layer and a second insulator layer. The first semiconductor layer includes a side surface partially in contact with the first conductor layer. The first contact is passing through the second conductor layers. The first contact includes a third conductor layer and a third insulator layer. The third conductor layer includes a side surface partially in contact with the first conductor layer. The source line drive circuit is electrically coupled to the first conductor layer via the first contact.
    Type: Application
    Filed: September 11, 2019
    Publication date: September 24, 2020
    Applicant: Toshiba Memory Corporation
    Inventor: Hisashi KATO
  • Patent number: 10776056
    Abstract: An information processing apparatus manages whether each of a plurality of print plug-ins is in an enabled state or in a disabled state, the plurality of print plug-ins adding at least a search function to an operating system operating on the information processing apparatus, and, if a search for a printer is instructed and the plurality of print plug-ins includes a print plug-in in the disabled state, performs a search for a printer by a print plug-in in the enabled state, and displays a detection result and a setting screen for setting the print plug-in in the disabled state to the enabled state.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: September 15, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Hisashi Kato
  • Publication number: 20200287452
    Abstract: A motor coil substrate includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate such that the coils are extending from a first end toward a second end on the opposite side with respect to the first end. The flexible substrate includes inner peripheral and outer peripheral flexible substrates such that the coils include outer peripheral coils formed on the outer peripheral flexible substrate and inner peripheral coils formed on the inner peripheral flexible substrate, that a number of the outer peripheral coils and a number of the inner peripheral coils are L, that an m-th outer peripheral coil of the outer peripheral coils is positioned on a m-th inner peripheral coil of the inner peripheral coils, and that the m-th outer peripheral coil and the m-th inner peripheral coil are connected to each other in parallel, where L and m are natural numbers.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 10, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200286678
    Abstract: A planar transformer includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate. The coil substrate is formed to have coil parts and coilless parts such that the coil parts have the coils and that the coilless parts do not have the coils, and the coil substrate is folded such that at least one of the coilless parts is sandwiched between two of the coil parts.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 10, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Patent number: 10761790
    Abstract: An information processing apparatus executes an operating system (OS) including a printing system that supports a first search protocol, and a printing function to generate a print job conforming to a first printing method and send the generated print job to a printer as a standard. A memory stores instructions, and a processor executes the instructions causing the information processing apparatus to receive a message conforming to the first search protocol from another printer that has been newly detected via the first search protocol if instructions for the use of the printing system included in the OS are provided by a user, and activate, upon condition that the detected printer has been selected and is determined not to conform to the first printing method based on contents of the received message, a function for downloading a print plug-in that supports the detected printer, wherein the print plug-in generates another print job and sends the generated another print job to the detected printer.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: September 1, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Hisashi Kato
  • Patent number: 10756589
    Abstract: A motor coil includes a magnet structure, and a laminated coil substrate formed on the magnet structure and including coil substrates and adhesive layers alternately laminated. The coil substrates are formed by folding a printed wiring board including a resin substrate, a first conductor layer formed on a first surface of the resin substrate and forming coils, and a second conductor layer formed on a second surface on the opposite side with respect to the first surface and forming coils, and the adhesive layers include an adhesive layer including a magnetic sheet.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: August 25, 2020
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Shinobu Kato, Hitoshi Miwa, Hisashi Kato, Toshihiko Yokomaku
  • Patent number: 10734221
    Abstract: A method of manufacturing a semiconductor device having a metal oxide film with workpiece accommodated in a chamber, includes: supplying a precursor gas containing a metal complex into the chamber to form a precursor layer on the workpiece from the precursor gas; supplying an oxidizing gas into the chamber to oxidize the precursor layer so that a metal oxide layer is formed, the oxidizing gas being a gas containing H2O or a gas having a functional group containing hydrogen atoms in the metal complex and containing an oxidant to generate H2O by reaction with the functional group; supplying an H2O removal gas containing alcohols or amines into the chamber to remove H2O adsorbed onto the metal oxide layer; and executing a plurality of cycles each including the supplying a precursor gas and the supplying an oxidizing gas. At least some of the cycles includes the supplying an H2O removal gas.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: August 4, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Taiki Kato, Hisashi Higuchi, Kosuke Yamamoto, Ayuta Suzuki, Kazuyoshi Matsuzaki, Yuji Seshimo, Susumu Takada, Yoshihiro Takezawa
  • Publication number: 20200234962
    Abstract: A dry etching gas composition is used which contains a saturated or unsaturated hydrofluorocarbon compound (excluding 1,2,2,3-pentafluorocyclobutane and 1,1,2,2-tetrafluorocyclobutane) represented by a general formula (1): CxHyFz (where x, y, and z are integers that satisfy 2?x?4, y+z?2x+2, and 0.5<z/y<2). Use of the etching gas composition containing the above-described hydrofluorocarbon makes it possible to selectively etch a nitrogen-containing silicon-based film (b1) with respect to a silicon oxide film, a non-silicon-based mask material, or a polycrystalline silicon film.
    Type: Application
    Filed: April 2, 2018
    Publication date: July 23, 2020
    Inventors: Korehito KATO, Yoshihiko IKETANI, Yukinobu SHIBUSAWA, Hisashi SHIMIZU
  • Publication number: 20200161919
    Abstract: A coil substrate includes a flexible substrate, and a coil including a wiring and formed on the flexible substrate. The flexible substrate has a cut penetrating through the flexible substrate such that the cut is formed to extend along a portion of the coil.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 21, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi Miwa, Shinobu Kato, Toshihiko Yokomaku, Hisashi Kato, Takahisa Hirasawa, Tetsuya Muraki, Takayuki Furuno
  • Publication number: 20200135750
    Abstract: According to one embodiment, a semiconductor memory device includes a first conductive layer, a first semiconductor body, a second semiconductor body, a first memory layer, and a second memory layer. The first conductive layer includes first to fourth extension regions, and a first connection region. The first extension region extends in a first direction. The second extension region extends in the first direction and is arranged with the first extension region in the first direction. The third extension region extends in the first direction and is arranged with the first extension region in a second direction crossing the first direction. The fourth extension region extends in the first direction, is arranged with the third extension region in the first direction, and is arranged with the second extension region in the second direction.
    Type: Application
    Filed: December 31, 2019
    Publication date: April 30, 2020
    Applicant: Toshiba Memory Corporation
    Inventors: Takuya INATSUKA, Tadashi IGUCHI, Murato KAWAI, Hisashi KATO, Megumi ISHIDUKI
  • Publication number: 20200083769
    Abstract: A coil substrate for a motor includes a flexible substrate, and multiple coils formed on a surface of the flexible substrate. Each of the coils has a wiring having first wiring portions and second wiring portions extending from the first wirings respectively and is formed such that the first wiring portions extend parallel with respect to each other and that the second wiring portions extend not parallel to the first wirings, and the flexible substrate is formed to be formed around a magnet of a motor such that the first wiring portions form an angle that is substantially perpendicular to a rotation direction of the motor.
    Type: Application
    Filed: September 11, 2019
    Publication date: March 12, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200076263
    Abstract: A motor coil substrate includes a flexible substrate, and multiple coils formed on the flexible substrate such that each of the coils has a spiral shape. The flexible substrate has multiple folding lines formed and the multiple coils positioned such that the flexible substrate is folded at the folding lines and wound around a magnet and that an m-th coil and an (m+1)-th coil of the coils partially overlap one another when folded at the folding lines.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 5, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200075223
    Abstract: A planar transformer includes a flexible insulating substrate having a first surface and a second surface on the opposite side with respect to the first surface, and multiple coils formed side by side on the first surface and the second surface of the flexible insulating substrate such that each of the coils includes a spiral-shaped wiring. The flexible insulating substrate has bending portions formed such that the flexible insulating substrate is folded at the bending portions and stack the coils one another.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200075224
    Abstract: A planar transfoinier includes a flexible insulating substrate having a pair of short sides, a pair of long sides, a first surface, and a second surface on an opposite side with respect to the first surface, multiple coils formed side by side on the first surface and second surface of the flexible insulating substrate such that each of the coils has a spiral-shaped wiring, and multiple terminals formed on the flexible insulating substrate and connected to the coils respectively such that the terminals are positioned in a center portion of the flexible insulating substrate formed close to a center of the long sides of the flexible insulating substrate. The flexible insulating substrate has multiple bending portions formed such that the flexible insulating substrate is folded at the bending portions and stacks the coils one another.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Patent number: 10553600
    Abstract: According to one embodiment, a semiconductor memory device includes a first conductive layer, a first semiconductor body, a second semiconductor body, a first memory layer, and a second memory layer. The first conductive layer includes first to fourth extension regions, and a first connection region. The first extension region extends in a first direction. The second extension region extends in the first direction and is arranged with the first extension region in the first direction. The third extension region extends in the first direction and is arranged with the first extension region in a second direction crossing the first direction. The fourth extension region extends in the first direction, is arranged with the third extension region in the first direction, and is arranged with the second extension region in the second direction.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: February 4, 2020
    Assignee: Toshiba Memory Corporation
    Inventors: Takuya Inatsuka, Tadashi Iguchi, Murato Kawai, Hisashi Kato, Megumi Ishiduki
  • Patent number: D897294
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: September 29, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shinichi Kato, Hisashi Hirokawa, Tomoomi Nishimura, Atsutomo Hayamizu, Takashi Ando