Abstract: A ceramic electronic component includes a first dielectric layer, a second dielectric layer, and an intermediate layer. The first dielectric layer is a layer containing BaO, Nd2O3, and TiO2, the second dielectric layer is a layer containing a different material from the material of the first dielectric layer, and the intermediate layer is a layer formed between the first dielectric layer and the second dielectric layer and containing main components that are not contained in the first dielectric layer and the second dielectric layer in common as the main components.

Abstract: A ceramic electronic component includes a first dielectric layer, a second dielectric layer, and a boundary reaction layer. The first dielectric layer is a layer containing BaO, Nd2O3, and TiO2, the second dielectric layer is a layer containing a material different from the material of the first dielectric layer, and the boundary reaction layer is a layer formed between the first dielectric layer and the second dielectric layer and containing at least one of Zn, Ti, Cu, and Mg.

Abstract: To provide a dielectric ceramic composition which is free from variation in breakdown voltage, and has excellent electric properties. The dielectric ceramic composition according the present invention includes: as a main component, a component represented by a composition formula {?(xBaO-yNd2O3-zTiO2)+?(2MgO—SiO2)}, wherein x, y, and z representing a molar ratio of the BaO Nd2O3, and TiO2 are each in a specific molar ratio range, and ? and ? representing a volume ratio of each component, zinc oxide, boron oxide, a glass having a softening point at a specific temperature or less, and silver, wherein a, b, c, and d representing a mass ratio of each of the minor components based on the main component are each in a specific mass ration range.

Abstract: Provided is a ceramic electronic component that, even if it is formed by building up dielectric layers of different compositions, can ensure that the built-up dielectric layers are prevented from separating from each other. The ceramic electronic component according to the present invention has: a first dielectric layer containing, as major components thereof, BaO, Nd2O3 and TiO2; a second dielectric layer containing a different composition from the first dielectric layer; and a boundary layer containing Zn and Ti, which is formed between the first dielectric layer and the second dielectric layer.

Abstract: There are provided electronic parts with excellent strength and high insulation resistance. According to a preferred embodiment, the electronic part comprises an inner layer section and outer layer sections formed covering the surfaces of the inner layer section, wherein the inner layer section and outer layer sections have a construction with a filler component dispersed in a glass component, the transverse strength of the inner layer section is at least 330 MPa, and the inner layer section has a thermal expansion coefficient larger than that of the outer layer sections.

Abstract: The present invention provides glass ceramic substrates 11a to 11d each containing a glass component and a plate-like alumina filler dispersed in the glass component, wherein the plate-like alumina filler has an average plate diameter of 0.1 to 20 ?m and an average aspect ratio of 50 to 80, and wherein the plate-like alumina filler has a content of 22 to 35% by volume based on a total amount of the glass component and plate-like alumina filler.

Abstract: In a method for manufacturing a composite wiring board, a through hole is formed in a sheet having a shrinkage-suppressing effect, and the through hole is filled with conductive paste to obtain a sheet for formation of a conductor. The sheet for formation of the conductor and a green sheet for a substrate in their laminated state are fired to obtain a ceramic substrate having a surface provided with a sintered metal conductor. A fired product of the sheet having the shrinkage-suppressing effect is removed from the surface of the ceramic substrate. Finally, a resin layer is formed on the surface of the ceramic substrate.

Abstract: A method for manufacturing magnetic metal powder is provided. In the method, a powdered magnetic metal oxide is supplied to a heat treatment furnace with a carrier gas composed of a reducing gas. The heat treatment furnace is maintained at temperatures above a reducing action starting temperature for the powdered magnetic metal oxide and above a melting point of the magnetic metal in the powder. The powdered magnetic metal oxide is subject to a reducing process, and then magnetic metal particles, the resultant reduced product, is melted to form a melt. The melt is re-crystallized in a succeeding cooling step, to obtain single crystal magnetic metal power in substantially spherical form.

Abstract: A method for manufacturing spherical ceramic powder is provided. The method includes essentially a spray drying step and a sintering step. In the spray drying step, a spray nozzle is used to spray slurry containing powdered raw material consisting essentially of ceramic ingredients to form liquid droplets, and liquid contents in the liquid droplets are heated and removed to obtain ceramic granular powder. In the sintering step, the ceramic granular powder is sintered to form spherical ceramic powder. The method provides ceramic powder having a mean particle size of about 1-50 ?m and a sphericity of about 0.8 or higher, which is suited for mixing with resin material to form a compound. The ceramic powder has high dispersant and filling properties against the resin material.

Abstract: There is provided a dielectric ceramic material in which the firing temperature dependency of the relative dielectric constant can be suppressed and the mechanical strength can be improved. Specifically, there is provided a dielectric ceramic material including: main constituents given by a composition located in the region, in a ternary diagram of ZrO2, SnO2 and TiO2 shown in FIG. 1, bounded by point A, point B, point C, point D, point E and point F; and ZnO: 0.5 to 5 wt %, NiO: 0.1 to 3 wt %, and SiO2: 0.008 to 1.5 wt % in relation to the total weight of the main constituents. The dielectric ceramic material can include Nb2O5: 0.2 wt % or less and K2O: 0.035 wt % or less in relation to the total weight of the main constituents.

Abstract: There is provided a dielectric ceramic material in which the firing temperature dependency of the relative dielectric constant can be suppressed and the mechanical strength can be improved. Specifically, there is provided a dielectric ceramic material including: main constituents given by a composition located in the region, in a ternary diagram of ZrO2, SnO2 and TiO2 shown in FIG. 1, bounded by point A, point B, point C, point D, point E and point F; and ZnO: 0.5 to 5 wt %, NiO: 0.1 to 3 wt %, and SiO2: 0.008 to 1.5 wt % in relation to the total weight of the main constituents. The dielectric ceramic material can include Nb2O5: 0.2 wt % or less and K2O: 0.035 wt % or less in relation to the total weight of the main constituents.

Abstract: A composite wiring board includes a ceramic substrate, a resin layer in contact with at least one surface of the ceramic substrate and a sintered metal conductor piercing through the resin layer. The composite wiring board is manufactured by a method including the steps of forming a through hole in a sheet having a shrinkage-suppressing effect and filling the through hole with conductive paste to obtain a sheet for formation of a conductor, firing the conductor formation sheet and a green sheet for a substrate in their laminated state to obtain a ceramic substrate having a surface provided with a sintered metal conductor, removing from the surface of the ceramic substrate a fired product of the sheet having the shrinkage-suppressing effect and forming a resin layer on the surface of the ceramic substrate.

Abstract: A core material-including organic core board or inorganic sintered board 1 having a plurality of band-shaped conductor patterns 2 formed on its front and rear surfaces is sliced in a direction crossing the band-shaped conductor patterns 2. End portions of the band-shaped conductor patterns 2 exposed on each of cut surfaces of the core board 1 are connected to one another by bridging conductor patterns formed on the cut surfaces. In this manner, at least one helical coil is provided. The inner diameter of the helical coil can be kept constant while coil pitch accuracy can be kept good.

Abstract: In a multilayered substrate obtained by laminating a plurality of substrates and including plural kinds of functional elements therein, a first functional material film and a second functional material film are provided on the same plane and first and second functional elements are formed by the first and second functional material films, respectively. The functional material film may be formed on a transferring substrate by a thin film method and may be transferred to the substrate.

Abstract: A composite magnetic material including a resin and generally spherical magnetic metal particles of at least one type dispersed in the resin and consisting essentially of single crystal grains, the metal particles having a mean particle size of 0.1 to 10 ?m and each having an insulating coating layer at least partially coated thereon.

Abstract: A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric, ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.

Abstract: A core material-including organic core board or inorganic sintered board 1 having a plurality of band-shaped conductor patterns 2 formed on its front and rear surfaces is sliced in a direction crossing the band-shaped conductor patterns 2. End portions of the band-shaped conductor patterns 2 exposed on each of cut surfaces of the core board 1 are connected to one another by bridging conductor patterns formed on the cut surfaces. In this manner, at least one helical coil is provided. The inner diameter of the helical coil can be kept constant while coil pitch accuracy can be kept good.

Abstract: A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.

Abstract: A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.

Abstract: A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.